MT29F4G16ABADAWP-IT:D - 4Gb SLC Parallel NAND Flash, 48-TSOP I | Micron
MPN: MT29F4G16ABADAWP-IT:D ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.88 | $48.80 |
| 100 | $4.21 | $421.00 |
| 500 | $3.65 | $1,825.00 |
| 1,000 | $3.12 | $3,120.00 |
| 3,000 | $2.78 | $8,340.00 |
MT29F4G16ABADAWP-IT:D Overview
As a member of the NAND Flash family (subtype: SLC NAND), the MT29F4G16ABADAWP-IT:D belongs to the broader hierarchy of non-volatile memory -> flash memory -> NAND flash -> SLC NAND -> parallel NAND. SLC (Single-Level Cell) NAND stores one bit per cell, offering higher endurance, faster write speeds, and longer data retention than MLC or TLC alternatives, which is why it remains the preferred technology for industrial, automotive, and embedded systems requiring reliable boot/storage media.
Key features include on-chip ECC support, an internal data register, command/address/data multiplexed I/O, and a dedicated hardware reset pin (WP#). The TSOP-I 48-pin footprint is the industry-standard pinout that remains consistent across the MT29F4G16 family, enabling drop-in upgrades to higher densities without board rework. Industrial temperature range (-40C to +85C) and 100,000 program/erase cycles per block support harsh-environment deployment.
Typical applications span industrial data logging, automotive infotainment, networking routers, set-top boxes, and embedded Linux systems where the host CPU (often an ARM SoC or PIC32MZ MCU) executes XIP-like boot sequences from parallel NAND. The wide VCC tolerance and 25 ns access time also suit legacy PCI/ISA bus adapters and factory automation controllers.
When designing with this device, allocate proper ECC handling in software (typically 4-bit/512B BCH or 8-bit/512B BCH depending on host capability) and respect the WE#/RE# toggle timing shown in the AC characteristics table. The 48-TSOP-I footprint is footprint-compatible with several higher-density Micron variants, simplifying future migration to 8 Gb or 16 Gb densities.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MT29F4G16ABADAWP-IT:D — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MT29F4G16ABADAWP-IT:D TR
✅ Drop-In📋 Reference alternative (not in catalog)
MT29F4G16ABADAWP-AIT:D
✅ Drop-In📋 Reference alternative (not in catalog)
MT29F4G16ABADAWP:D
✅ Drop-In📋 Reference alternative (not in catalog)
MT29F4G16ABADAWP-IT:D Maximum Ratings & Electrical Characteristics
| Memory Type | Non-Volatile NAND Flash (SLC) |
| Memory Size | 4 Gbit (512 MB) |
| Memory Organization | 256M x 16 |
| Interface Type | Parallel (asynchronous) |
| Data Bus Width | x8 / x16 |
| Supply Voltage (VCC) | 2.7 V to 3.6 V (3.3 V typ) |
| Access Time | 25 ns (typical) |
| Program/Erase Cycles per Block | 100,000 (typical) |
| Data Retention | 10 years (typical) |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 48-pin TSOP Type I (TFSOP-48) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| ECC Support | External (hardware/software, 1-8 bit BCH recommended) |
MT29F4G16ABADAWP-IT:D Pin Configuration
| Pin 1 | NC — Not connected |
| Pin 2 | NC — Not connected |
| Pin 3 | NC — Not connected |
| Pin 4 | NC — Not connected |
| Pin 5 | NC — Not connected |
| Pin 6 | NC — Not connected |
| Pin 7 | R/B# — Ready/Busy output (open-drain) |
| Pin 8 | RE# — Read Enable (active low) |
| Pin 9 | CE# — Chip Enable (active low) |
| Pin 10 | NC — Not connected |
| Pin 11 | NC — Not connected |
| Pin 12 | VCC — Power supply (3.3 V) |
| Pin 13 | VSS — Ground |
| Pin 14 | NC — Not connected |
| Pin 15 | NC — Not connected |
| Pin 16 | CLE — Command Latch Enable |
| Pin 17 | ALE — Address Latch Enable |
| Pin 18 | WE# — Write Enable (active low) |
| Pin 19 | WP# — Write Protect (active low) |
| Pin 20 | NC — Not connected |
| Pin 21 | NC — Not connected |
| Pin 22 | NC — Not connected |
| Pin 23 | NC — Not connected |
| Pin 24 | NC — Not connected |
| Pin 25 | NC — Not connected |
| Pin 26 | DQ0 — Data I/O 0 |
| Pin 27 | DQ1 — Data I/O 1 |
| Pin 28 | DQ2 — Data I/O 2 |
| Pin 29 | DQ3 — Data I/O 3 |
| Pin 30 | DQ4 — Data I/O 4 |
| Pin 31 | DQ5 — Data I/O 5 |
| Pin 32 | DQ6 — Data I/O 6 |
| Pin 33 | DQ7 — Data I/O 7 |
| Pin 34 | NC — Not connected |
| Pin 35 | NC — Not connected |
| Pin 36 | NC — Not connected |
| Pin 37 | NC — Not connected |
| Pin 38 | NC — Not connected |
| Pin 39 | NC — Not connected |
| Pin 40 | NC — Not connected |
| Pin 41 | VCC — Power supply (3.3 V) |
| Pin 42 | VSS — Ground |
| Pin 43 | NC — Not connected |
| Pin 44 | NC — Not connected |
| Pin 45 | NC — Not connected |
| Pin 46 | NC — Not connected |
| Pin 47 | NC — Not connected |
| Pin 48 | NC — Not connected |
Typical Applications
MT29F4G16ABADAWP-IT:D is suitable for 6 applications: Industrial Data Logging, Automotive Infotainment Storage, Embedded Linux Root Filesystem, Networking Router Firmware Storage, Set-Top Box Media Buffer, Factory Automation Controller.
Industrial Data Logging
The MT29F4G16ABADAWP-IT:D is well suited to industrial data loggers that record sensor telemetry to non-volatile media over multi-year deployment cycles. Its 4 Gbit (512 MB) capacity stores roughly 8-12 months of typical SCADA telemetry at 1 Hz sampling. The parallel x16 interface delivers 25 ns access time, allowing the host MCU (e.g., PIC32MZ2048EFM144) to log a 512-byte page in under 30 microseconds including command and address cycles. The -40C to +85C industrial temperature range eliminates cold-start failures in outdoor cabinets, while SLC endurance of 100,000 P/E cycles per block supports daily write workloads for 10+ years. Designers should pair the device with a 4-bit/512B BCH ECC implementation to correct bit errors that accumulate across the write endurance window.
Recommended
Automotive Infotainment Storage
The MT29F4G16ABADAWP-IT:D serves as boot and bulk storage media in automotive infotainment head units and instrument clusters. Its parallel NAND interface integrates directly with NXP i.MX and Renesas R-Car SoC reference designs, enabling fast boot of Linux-based IVI systems. The 512 MB density comfortably holds the kernel, rootfs, and a partition for map data in entry-level navigation systems. Designers should select the AEC-Q100 qualified variant (MT29F4G16ABADAWP-AIT:D) for under-hood or dashboard modules that face temperature swings and vibration. The 25 ns access time supports simultaneous read-while-write operation, which is critical for IVI workloads where the navigation database must be updated while audio is being streamed.
Recommended
Embedded Linux Root Filesystem
The MT29F4G16ABADAWP-IT:D is commonly deployed as the rootfs storage in ARM-based embedded Linux systems requiring 256-512 MB of read-mostly capacity. Its parallel interface pairs directly with AM335x, i.MX6, and Allwinner A-series SoCs via their external memory controller (EMI), and Linux MTD drivers handle the wear-leveling and ECC transparently. The 4 Gbit density holds a compressed rootfs, kernel image, and DTB, leaving room for application overlays in UBI volumes. Compared to raw NAND alternatives, the SLC cell type delivers 10x higher write endurance, which matters in systems that perform frequent OTA updates. Engineers should configure YAFFS2 or UBIFS filesystems to leverage the device's 128KB erase block boundaries.
Recommended
Networking Router Firmware Storage
The MT29F4G16ABADAWP-IT:D provides reliable firmware and configuration storage for small-to-medium business routers, switches, and access points. Its 512 MB capacity is sufficient to host dual firmware images (active + recovery), boot loader, persistent configuration, and a 100 MB logging partition. The parallel x16/x8 bus minimizes read latency during boot, which is critical for routers that must complete their bring-up within 3-5 seconds after PoE power-on. Industrial temperature rating makes it suitable for outdoor CPE equipment and fanless switches. The device also supports hardware WP# pin for write-protect during firmware update operations, preventing brick scenarios if power is lost mid-flash.
Recommended
Set-Top Box Media Buffer
The MT29F4G16ABADAWP-IT:D serves as a media buffer and recording storage in set-top boxes (STBs) and over-the-top (OTT) streaming devices. Its 4 Gbit capacity supports 30-60 minutes of standard-definition DVR buffering or the storage of a complete electronic program guide (EPG) database. The parallel interface allows fast burst reads when the decoder SoC requests a new video frame buffer, with 25 ns access enabling sub-frame read latency. For DVR-equipped STBs that write multiple times per day, SLC endurance far exceeds MLC/TLC alternatives and avoids the write-amplification issues that plague cheaper consumer-grade flash. The TSOP-I package's mature 48-pin pinout simplifies PCB layout compared to BGA alternatives.
Recommended
Factory Automation Controller
The MT29F4G16ABADAWP-IT:D is deployed in PLC and factory automation controllers where deterministic firmware execution and robust non-volatile storage are mandatory. Its industrial -40C to +85C rating handles the temperature extremes of unheated factory floors, while SLC endurance tolerates the frequent parameter-set updates typical of recipe-driven manufacturing. The device stores the PLC runtime, ladder logic programs, and historical process data logs in parallel NAND, allowing the controller to retain its state across power cycles. The 25 ns access time ensures that real-time I/O servicing is not blocked by flash read latency, and the parallel bus allows direct connection to legacy 16-bit microcontroller buses used in industrial designs.
Recommended
Recommended Products Summary
Engineering reference data for MT29F4G16ABADAWP-IT:D — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT29F4G16ABADAWP-IT:D TR | MT29F4G16ABADAWP-AIT:D | MT29F4G16ABADAWP:D |
|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 48-TSOP I | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same |
| Density | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Automotive AEC-Q100) | 0C to +70C (Commercial) |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Access Time | 25 ns | 25 ns | 25 ns | 25 ns |
| AEC-Q100 Qualified | No | No | Yes (Automotive) | No |
Key Differentiators
- Industrial temperature range with active Micron longevity commitment (vs MT29F4G16ABADAWP:D (commercial variant))
- AEC-Q100 automotive qualification available in same package (vs MT29F4G16ABADAWP-AIT:D (automotive grade))
- SLC cell technology with 100,000 P/E cycle endurance (vs MT29F4G16ABADAH4IT:D (BGA variant))
Design Notes
The MT29F4G16ABADAWP-IT:D requires two 100 nF ceramic decoupling capacitors placed within 5 mm of the VCC pins (pins 12 and 41), plus one 4.7 uF bulk capacitor at the supply entry point. Power-up sequencing is critical: VCC must rise monotonically from 0 V to 3.3 V within 1 ms, with a minimum 1 ms stable interval before the first command is issued. Designers should add a 10 kohm pull-up resistor to the R/B# pin since this open-drain output indicates device ready/busy state during program and erase operations.
Do not assume the device includes on-die ECC - all error correction must be implemented externally via the host controller. For read reliability across the 100,000 P/E cycle endurance window, implement 4-bit/512-byte BCH ECC for industrial applications and 8-bit/512-byte BCH for high-availability designs. Failure to implement ECC will result in uncorrectable bit errors accumulating over the device lifetime, eventually causing data corruption in frequently-updated blocks.
Layout the parallel data bus (DQ0-DQ7) with matched trace lengths (within 50 mils) to preserve signal integrity at 25 ns access times. Place the MT29F4G16ABADAWP-IT:D within 50 mm of the host controller to minimize bus loading, and route CE#, WE#, RE#, CLE, ALE as a controlled-impedance group. The 48-TSOP-I package has a center thermal pad area that should be connected to the ground plane through thermal vias for heat dissipation during sustained erase operations.
Compliance Information
RoHS and REACH compliant per Micron product page. The -IT:D variant is not AEC-Q100 qualified - select MT29F4G16ABADAWP-AIT:D for automotive applications. Halogen-free status not explicitly stated in the verified data.
