MTFC128GAVATTC-AIT - 1Tbit UFS 3.1 SLC NAND, 153-LFBGA | Micron
MPN: MTFC128GAVATTC-AIT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $19.5 | $19.50 |
| 10 | $18.2 | $182.00 |
| 100 | $16.4 | $1,640.00 |
| 500 | $14.85 | $7,425.00 |
| 1,000 | $13.6 | $13,600.00 |
MTFC128GAVATTC-AIT Overview
Universal Flash Storage (UFS) is a JEDEC-standardized managed NAND interface (JESD220E and related MIPI UniPro / M-PHY physical layers) that replaced legacy eMMC by introducing a full-duplex, multi-lane serial architecture with command queues and embedded controller features. The UFS 3.1 generation doubles peak interface bandwidth versus UFS 2.1 and adds Write Booster, DeepSleep, and Host Performance Booster features, making it the preferred managed NAND for high-end automotive SoCs and 5G mobile platforms.
Key features of the MTFC128GAVATTC-AIT include a UFS 3.1 interface with HS-Gear4 (x2 lane) operation, integrated NAND flash controller with strong ECC and bad-block management, and AEC-Q100 Grade 2 / Grade 3 qualification for automotive temperature ranges. The device operates from a 2.4 V to 2.7 V VCC supply and a separate 1.8 V VCCQ for the host interface, simplifying integration with 1.8 V application processors. SLC mode yields higher endurance and lower bit error rate than TLC alternatives in the same family.
Typical applications span automotive infotainment head units, digital instrument clusters, ADAS sensor loggers, industrial gateways, and edge AI recorders. Its 11.5 mm x 13 mm LFBGA footprint is compatible with the broader Micron MTFC256GAVATTC-AIT (256 GB) and -AAT (consumer) variants, enabling one PCB layout to support multiple densities or temperature grades.
When designing in this part, follow Micron's reference PCB layout for the 153-ball LFBGA, including 0.5 mm ball pitch escape routing, VCC decoupling with 1uF plus 0.1uF ceramics per power pin, and provision for a boot partition. Designers should also plan for the UFS reference clock stability and impedance-controlled MIPI M-PHY lanes to pass HS-Gear4 compliance.
Drop-in alternatives for MTFC128GAVATTC-AIT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MTFC128GAVATTC-AIT (same form factor and footprint) — differing in Automotive Qualification, Memory Type, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MTFC256GAVATTC-AIT
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View Datasheet →MTFC128GAVATTC-AAT
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MTFC256GAVATTC-AAT
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MTFC128GAVATTC-AIT Maximum Ratings & Electrical Characteristics
| Memory Type | FLASH - NAND (SLC), Managed UFS |
| Memory Density | 1 Tbit (128 GB) |
| Memory Interface | UFS 3.1 |
| Memory Configuration | SLC mode |
| Operating Voltage VCC | 2.4 V to 2.7 V |
| Operating Voltage VCCQ | 1.8 V (typical) |
| Package | 153-ball LFBGA, 11.5 mm x 13 mm, 0.5 mm pitch |
| Operating Temperature | -40 C to +95 C (IT = Industrial Temperature, automotive Grade) |
| Automotive Qualification | AEC-Q100 (automotive grade, suffix IT) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead Free | Yes |
MTFC128GAVATTC-AIT 153-ball lfbga, 11.5 mm x 13 mm, 0.5 mm pitch Pin Configuration Guide
Pin configuration for MTFC128GAVATTC-AIT (153-ball lfbga, 11.5 mm x 13 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MTFC128GAVATTC-AIT.
Refer to the datasheet for full pin configuration.
Typical Applications
MTFC128GAVATTC-AIT is suitable for 6 applications: Automotive Infotainment Head Unit, ADAS Sensor Data Logger, Digital Instrument Cluster, Industrial Edge AI Recorder, Vehicle Telematics and V2X Gateway, Ruggedized Handheld Terminal.
Automotive Infotainment Head Unit
The MTFC128GAVATTC-AIT fits automotive infotainment head units because its 1 Tbit SLC NAND plus UFS 3.1 interface delivers the multi-gigabit sustained read bandwidth required to stream 4K displays, navigation maps, and HD audio simultaneously. UFS 3.1's full-duplex command queue prevents UI stalls during background map prefetch, while AEC-Q100 Grade 2/3 qualification and the -40 C to +95 C operating range let the part survive closed-cabin thermal stress. Placed on the application-processor board with 1uF plus 0.1uF VCC decoupling and a 1.8 V VCCQ rail, it replaces legacy eMMC 5.1 with a 2-3x throughput uplift at moderate incremental cost.
Recommended
ADAS Sensor Data Logger
For ADAS sensor loggers (front camera, radar, lidar pre-processor), the MTFC128GAVATTC-AIT provides the sequential-write endurance and AEC-Q100 reliability demanded by ISO 26262 platforms. Its UFS 3.1 HS-Gear4 lanes sustain high-throughput writes from multiple sensor pipelines without dropping frames, while SLC mode extends P/E cycles well beyond TLC alternatives. The 153-ball LFBGA footprint allows compact placement next to the ADAS SoC, and the automotive temperature grade tolerates engine-bay-adjacent mounting. Designers should enable UFS Write Booster to meet peak sensor burst rates.
Recommended
Digital Instrument Cluster
Digital instrument clusters benefit from the MTFC128GAVATTC-AIT's fast random read latency, which determines how quickly graphics assets (gauges, maps, warning icons) are pulled into the cluster GPU. UFS 3.1's command queue lets the cluster issue parallel read requests for layered gauges without queue contention. The 128 GB capacity holds multiple language variants, firmware A/B partitions, and diagnostic logs. The automotive LFBGA package and AEC-Q100 Grade 2/3 qualification suit behind-cluster mounting where ambient temperatures can exceed 85 C in sun-loaded cabins.
Recommended
Industrial Edge AI Recorder
In industrial edge-AI recording nodes (machine vision, predictive-maintenance gateways), the MTFC128GAVATTC-AIT offers the ruggedized temperature range and managed-NAND convenience required for 24/7 operation. UFS 3.1 sustains continuous write throughput from camera or vibration sensors while the integrated ECC and bad-block management reduce host CPU load. The same 153-ball LFBGA layout used in automotive designs can be reused, allowing OEM platforms to share PCB tooling across auto and industrial SKUs. Pair with an industrial SoC and PoE for a deployable AI logger.
Recommended
Vehicle Telematics and V2X Gateway
Telematics control units and V2X gateways leverage the MTFC128GAVATTC-AIT for storing map tiles, firmware-over-the-air staging buffers, and event data recorder (EDR) snapshots. The UFS 3.1 interface supports simultaneous OTA download (write) and map read requests without throughput collapse, which is critical for time-sensitive V2X messaging. AEC-Q100 conformance and 95 C thermal ceiling let the telematics unit sit in roof consoles or telematics control modules that experience sustained solar load. The 128 GB capacity also accommodates multiple regional map packages.
Recommended
Ruggedized Handheld Terminal
Ruggedized handheld terminals used in field service, public safety, and military logistics use the MTFC128GAVATTC-AIT as their primary storage because its industrial temperature grade and managed NAND reliability outperform raw eMMC in drop-shock environments. UFS 3.1 provides fast app-launch and barcode-scan buffering, while the small 11.5x13 mm LFBGA fits within space-constrained handheld enclosures. The 128 GB capacity holds offline maps, multimedia training content, and inventory databases. Firmware should enable UFS DeepSleep for battery-life optimization between scans.
Recommended
Recommended Products Summary
Engineering reference data for MTFC128GAVATTC-AIT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MTFC256GAVATTC-AIT | MTFC128GAVATTC-AAT | MTFC256GAVATTC-AAT | MTFC128GAOAEAA-AIT |
|---|---|---|---|---|---|
| Package | 153-LFBGA (11.5x13 mm) | 153-LFBGA (11.5x13 mm) - same | 153-LFBGA (11.5x13 mm) - same | 153-LFBGA (11.5x13 mm) - same | 153-LFBGA (11.5x13 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 128 GB (1 Tbit) | 256 GB (2 Tbit) | 128 GB (1 Tbit) | 256 GB (2 Tbit) | 128 GB (1 Tbit) |
| Interface | UFS 3.1 | UFS 3.1 | UFS 3.1 | UFS 3.1 | UFS 2.1 / 3.1 (early gen) |
| NAND Mode | SLC | SLC | SLC | SLC | SLC |
| Temperature Grade | -40 C to +95 C (IT) | -40 C to +95 C (IT) | -40 C to +85 C (AT, Grade 1) | -40 C to +85 C (AT, Grade 1) | -40 C to +95 C (IT) |
| AEC-Q100 | Qualified (Grade 2/3) | Qualified | Qualified (Grade 1) | Qualified (Grade 1) | Qualified |
| Approx. Unit Price (qty-1) | $19.50 | $32.00 (typ.) | $15.00 (typ.) | $26.00 (typ.) | $22.00 (typ., legacy) |
Key Differentiators
- Higher temperature ceiling than commercial -AAT grade (vs MTFC128GAVATTC-AAT)
- Identical footprint to 256 GB upgrade path (vs MTFC256GAVATTC-AIT)
- SLC endurance vs TLC competitors in same class (vs Generic UFS 3.1 TLC competitors)
Design Notes
Route the MIPI M-PHY differential pairs (DTO/DT1) with 85 ohm differential impedance and length matching within 0.5 mm to pass UFS 3.1 HS-Gear4 compliance. Use Micron's reference 0.5 mm-pitch escape pattern under the 153-ball LFBGA: microvia-in-pad is acceptable, but keep antipads clear of the BGA's center power/ground balls to maintain a solid return path. Place a 1uF plus 0.1uF X7R ceramic on each VCC pin within 1 mm.
Estimated: at sustained sequential write of 400 MB/s into the MTFC128GAVATTC-AIT, the LFBGA package dissipates roughly 0.8 W above ambient. With theta_JA around 25 C/W on a 4-layer JEDEC test board, junction temperature rises ~20 C above 85 C ambient, so provide at least 200 mm^2 of continuous GND copper under the BGA and consider a thermal via array tied to internal ground planes. AEC-Q100 Grade 2 (105 C) and Grade 3 (85 C) variants both rely on this copper spread.
REF_CLK to the MTFC128GAVATTC-AIT must come from a low-jitter source (<50 ps RMS) and be AC-coupled per the UFS 3.1 specification. Add a clock-buffer reference design from the host SoC's reference schematic, and ensure RST_N has a 10 kohm pull-up to VCCQ_18 to avoid unintended reset during power-rail ramp. Validate HS-BURST and PWM-Gear1 eye diagrams with a UFS protocol analyzer before production release.
Do not assume UFS 3.1 parts are byte-level compatible with eMMC 5.1 host stacks: the host processor needs a MIPI UniPro / M-PHY driver and a UFSHCI register interface. Also avoid hot-swapping the part during firmware update; corruption of the UFS Device Descriptor can permanently brick the boot partition, requiring JTAG-level recovery. Use Micron's documented firmware update flow and dual-LUN A/B boot configuration for automotive OTA safety.
Compliance Information
AEC-Q100 qualified per Micron automotive UFS datasheet; IT suffix indicates industrial/automotive temperature grade. RoHS compliance confirmed by distributor listings. Halogen-free status not stated in the verified web data.
