MX30LF4G18AC-TI-T - 4Gbit SLC NAND Flash, 3V, TSOP-48 | Macronix
MPN: MX30LF4G18AC-TI-T ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.85 | $4.85 |
| 10 | $4.32 | $43.20 |
| 100 | $3.78 | $378.00 |
| 500 | $3.4 | $1,700.00 |
| 1,000 | $3.05 | $3,050.00 |
MX30LF4G18AC-TI-T Overview
An SLC (Single-Level Cell) NAND Flash is a non-volatile memory technology that stores one bit per memory cell, providing higher write endurance (typically 60k-100k P/E cycles), faster write performance, and lower bit error rates than MLC or TLC NAND. SLC NAND sits below raw NAND in the storage hierarchy - between NOR Flash (byte-addressable, slower write) and managed NAND (eMMC/UFS with built-in controllers). Because raw SLC NAND requires an external Flash controller (or FTL in software), it is favored in cost-sensitive, reliability-critical designs where the host MCU or ASIC already includes a NAND controller.
Key features of the MX30LF4G18AC-TI-T include a 20 ns access time, ONFI 1.0 parameter page compatibility, 4-bit ECC requirement per 528-byte sector, 8-bit data bus, and a 10-year data retention rating. The device supports single-plane and dual-plane operations, hardware data protection via WP#, and a standard command set (read, program, erase, block management) consistent with the ONFI 1.0 specification. The wide temperature operating range (-40C to +85C) suits industrial and automotive-adjacent applications.
At the architectural level, the device is organized into 4096 blocks of 128 KB plus spare area, with each page holding 2 KB + 64 B spare (x8 mode). Page program is typically 300 us and block erase around 2 ms, enabling deterministic write timing for industrial firmware updates and fast boot storage. The 4-bit ECC requirement means the system controller must implement a BCH or Reed-Solomon engine to correct raw bit errors before they exceed the ECC budget.
Typical applications include industrial embedded Linux systems, automotive infotainment boot media, networking equipment firmware storage, factory automation controllers, and ruggedized IoT gateways that demand long-term reliability under wide temperature swings.
When designing with raw NAND, ensure the host controller implements 4-bit ECC per 528-byte sector, plan for bad-block management in software, and reserve enough boot time for NAND initialization. The TSOP-48 footprint is widely supported by surface-mount assembly lines but requires careful PCB layout to keep the 8-bit parallel bus impedance-controlled for signal integrity at 20 ns access speeds.
This page synthesizes distributor pricing, same-brand density/package variants, and practical ECC and layout design notes not consolidated in any single manufacturer or distributor source.
Drop-in alternatives for MX30LF4G18AC-TI-T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MX30LF4G18AC-TI-T (same form factor and footprint) — differing in Access Time (tRC), Block Size, Interface, Memory Type, Page Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MX30LF4G28AD-TI-T
✅ Drop-In📋 Reference alternative (not in catalog)
MX30LF4G18AC-XKI/TRAY
✅ Drop-In📋 Reference alternative (not in catalog)
MX30LF4G18AC-TI
✅ Drop-In📋 Reference alternative (not in catalog)
MX30LF2G18AC-TI
✅ Drop-In📋 Reference alternative (not in catalog)
MT29F4G08ABADAWP-IT:D
✅ Drop-In✓ In Stock
$5.45 / Unit
View Datasheet →K9F4G08U0F
✅ Drop-In📋 Reference alternative (not in catalog)
MX30LF4G18AC-TI-T Maximum Ratings & Electrical Characteristics
| Memory Type | Non-volatile NAND Flash (SLC) |
| Density | 4 Gbit (512 Mbyte) |
| Organization | 512M x 8 bit |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Interface | Parallel (asynchronous), ONFI 1.0 compliant |
| Data Bus Width | 8 bit |
| Access Time (tRC) | 20 ns (typical) |
| Page Size | 2048 byte + 64 byte spare area |
| Block Size | 64 pages (128 KB + 4 KB spare) |
| Required ECC | 4-bit ECC per 528-byte sector |
| Program Time (typical) | 300 us per page |
| Erase Time (typical) | 2 ms per block |
| Data Retention | 10 years |
| Operating Temperature | -40 C to +85 C (industrial) |
| Package | 48-pin TSOP-I (12 mm x 20 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
MX30LF4G18AC-TI-T Pin Configuration
| Pin 1 | NC — Not connected |
| Pin 2 | NC — Not connected |
| Pin 3 | NC — Not connected |
| Pin 4 | NC — Not connected |
| Pin 5 | NC — Not connected |
| Pin 6 | NC — Not connected |
| Pin 7 | VSS — Ground |
| Pin 8 | NC — Not connected |
| Pin 9 | CE# — Chip Enable (active low) |
| Pin 10 | RE# — Read Enable (active low) |
| Pin 11 | WE# — Write Enable (active low) |
| Pin 12 | ALE — Address Latch Enable |
| Pin 13 | CLE — Command Latch Enable |
| Pin 14 | NC — Not connected |
| Pin 15 | NC — Not connected |
| Pin 16 | NC — Not connected |
| Pin 17 | NC — Not connected |
| Pin 18 | NC — Not connected |
| Pin 19 | NC — Not connected |
| Pin 20 | NC — Not connected |
| Pin 21 | VSS — Ground |
| Pin 22 | NC — Not connected |
| Pin 23 | NC — Not connected |
| Pin 24 | NC — Not connected |
| Pin 25 | NC — Not connected |
| Pin 26 | NC — Not connected |
| Pin 27 | NC — Not connected |
| Pin 28 | NC — Not connected |
| Pin 29 | I/O0 — Data input/output 0 |
| Pin 30 | I/O1 — Data input/output 1 |
| Pin 31 | I/O2 — Data input/output 2 |
| Pin 32 | I/O3 — Data input/output 3 |
| Pin 33 | VSS — Ground |
| Pin 34 | I/O4 — Data input/output 4 |
| Pin 35 | I/O5 — Data input/output 5 |
| Pin 36 | I/O6 — Data input/output 6 |
| Pin 37 | I/O7 — Data input/output 7 |
| Pin 38 | WP# — Write Protect (active low) |
| Pin 39 | VSS — Ground |
| Pin 40 | NC — Not connected |
| Pin 41 | NC — Not connected |
| Pin 42 | NC — Not connected |
| Pin 43 | R/B# — Ready/Busy (open drain, active low) |
| Pin 44 | NC — Not connected |
| Pin 45 | NC — Not connected |
| Pin 46 | NC — Not connected |
| Pin 47 | VCC — Power supply (2.7-3.6 V) |
| Pin 48 | VCC — Power supply (2.7-3.6 V) |
Typical Applications
MX30LF4G18AC-TI-T is suitable for 7 applications: Industrial Embedded Linux Boot and Root Filesystem, Automotive Infotainment and Telematics Storage, Networking Equipment Firmware Storage, Factory Automation PLC and HMI Data Logging, Ruggedized IoT Gateways and Edge Devices, Point-of-Sale Terminals and Receipt Printers, Medical Monitoring Device Local Storage.
Industrial Embedded Linux Boot and Root Filesystem
The MX30LF4G18AC-TI-T is well-suited as raw NAND storage for industrial embedded Linux systems where UBI/JFFS2 filesystems need a reliable non-volatile medium. Its 512 Mbyte density comfortably holds a compressed kernel (typically 4-10 MB), initramfs, and a read-write rootfs for industrial control software. The 20 ns access time and 300 us page-program time allow fast boot sequences at 3.3 V. With 4-bit ECC per 528-byte sector handled by the host SoC's NAND controller, sustained write endurance in the tens of thousands of P/E cycles is sufficient for typical industrial update workloads.
Recommended
Automotive Infotainment and Telematics Storage
The MX30LF4G18AC-TI-T serves as boot or media-storage NAND in automotive infotainment head units and telematics control units where -40C to +85C industrial temperature grade is mandatory. Its 512 Mbyte capacity holds navigation maps, audio buffers, and firmware updates for the head unit's MCU. The 48-TSOP-I footprint is widely accepted by automotive Tier-1 EMS lines. Designers should pair this part with an automotive-grade MCU containing an ONFI-compatible NAND controller and 4-bit ECC hardware. For fully automotive-qualified parts, consider AEC-Q100-specific alternatives, but for non-safety-critical infotainment this part is widely deployed.
Recommended
Networking Equipment Firmware Storage
In routers, switches, and small-cell base stations, the MX30LF4G18AC-TI-T provides 512 Mbyte of reliable SLC NAND for storing bootloaders, kernel images, and configuration databases. SLC's high write endurance (60k-100k P/E cycles typical) and 10-year data retention per Macronix make it ideal for gear that may be deployed for a decade without NAND replacement. The 20 ns access time enables fast boot at network-reboot scenarios. Combined with ECC handled by the network processor's NAND interface, the part supports robust remote firmware updates required for field-deployed networking equipment.
Recommended
Factory Automation PLC and HMI Data Logging
Programmable Logic Controllers (PLCs) and Human-Machine Interfaces (HMIs) use the MX30LF4G18AC-TI-T to log process data, alarms, and recipe parameters in non-volatile storage. The 512 Mbyte capacity stores months of trend logs and machine recipes; the -40C to +85C range handles factory floor thermal swings. With 4-bit ECC implemented in the PLC's MCU, bit errors from long-term wear are corrected transparently. The 48-TSOP package and 2.7-3.6 V supply integrate cleanly into 3.3 V PLC power architectures without level shifters.
Recommended
Ruggedized IoT Gateways and Edge Devices
Outdoor and industrial IoT gateways use the MX30LF4G18AC-TI-T to store OTA update staging areas, edge-compute ML models, and time-series sensor buffers. Its 512 Mbyte capacity holds multiple versions of OTA payloads for safe A/B update schemes; the -40C to +85C temperature rating ensures operation in unconditioned enclosures. The ONFI 1.0 interface simplifies firmware driver reuse across gateway generations. Low standby current and 3 V operation also suit battery-backed or solar-powered IoT deployments where energy efficiency matters.
Recommended
Point-of-Sale Terminals and Receipt Printers
POS terminals and thermal receipt printers use the MX30LF4G18AC-TI-T to store transaction logs, tax tables, and firmware. The 512 Mbyte density holds years of audit logs in compressed form; SLC endurance ensures millions of write cycles over a 7-10 year product lifetime. The 48-TSOP-I package simplifies assembly of compact retail hardware, and 2.7-3.6 V operation matches the 3.3 V rails common in POS motherboards. With 4-bit ECC managed by the terminal's application processor, data integrity for compliance-sensitive transaction records is preserved.
Recommended
Medical Monitoring Device Local Storage
Patient monitors and ambulatory medical devices use the MX30LF4G18AC-TI-T to buffer vital-sign trends, alarm logs, and device settings between power cycles. The 10-year data retention per Macronix ensures long-term log integrity, and -40C to +85C operation tolerates sterilisation and transportation extremes. The 512 Mbyte capacity records continuous multi-parameter waveforms for hours-to-days of patient episodes. SLC's higher endurance versus MLC/TLC is critical for the constant small-write pattern of vital-sign logging. Pair the part with a medical-grade MCU providing 4-bit ECC for safe patient-data storage.
Recommended
Recommended Products Summary
Engineering reference data for MX30LF4G18AC-TI-T — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MX30LF4G28AD-TI-T | MX30LF4G18AC-XKI/TRAY | MX30LF4G18AC-TI | MX30LF2G18AC-TI | MT29F4G08ABADAWP | K9F4G08U0F |
|---|---|---|---|---|---|---|---|
| Package | 48-TSOP-I (12x20 mm) | 48-TSOP-I (same) | 48-TSOP-I (same) | 48-TSOP-I (same) | 48-TSOP-I (same) | 48-TSOP-I (same) | 48-TSOP-I (same) |
| Brand | Macronix | Macronix | Macronix | Macronix | Macronix | Micron Technology | Samsung Electronics |
| Density | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit | 2 Gbit (-50%) | 4 Gbit | 4 Gbit |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Interface | Parallel x8, ONFI 1.0 | Parallel x8, ONFI | Parallel x8, ONFI 1.0 | Parallel x8, ONFI 1.0 | Parallel x8, ONFI 1.0 | Parallel x8, ONFI | Parallel x8 |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20-25 ns | 25 ns |
| Required ECC | 4-bit per 528 B | 4-bit per 528 B | 4-bit per 528 B | 4-bit per 528 B | 4-bit per 528 B | 4-bit per 512 B | 1-bit per 512 B (may require external ECC) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Key Differentiators
- Standard ONFI 1.0 parameter page and command set (vs MX30LF2G18AC-TI)
- Industrial -40 C to +85 C operating range (vs MX30LF4G18AC-XKI/TRAY)
- Macronix second-source supply chain (vs MT29F4G08ABADAWP (Micron))
Design Notes
The MX30LF4G18AC-TI-T requires a 4-bit ECC engine (BCH or Reed-Solomon) per 528-byte sector. Without this ECC, raw bit errors from endurance wear and retention loss will accumulate and corrupt data within months of use. Ensure your host MCU/ASIC has hardware ECC or implement a software BCH engine in firmware before bringing up NAND. Confirm ECC strength with the controller vendor's validated driver list.
The 8-bit parallel NAND bus must be length-matched within ~25 mm and routed with a 50 ohm characteristic impedance to avoid reflections at the 20 ns access time. Place a 0.1 uF decoupling capacitor near each VCC pin (pins 47, 48) and a single 4.7 uF bulk capacitor on the VCC rail. Keep the 8 I/O traces away from switching power inductors or clock signals to minimize crosstalk, and provide a solid ground plane under the TSOP-48 footprint for thermal dissipation and controlled impedance.
Do not skip bad-block management in firmware. The MX30LF4G18AC-TI-T ships with factory-marked bad blocks (per ONFI 1.0 in the initial invalid block table), and additional blocks may fail over operational life. Read and respect the bad-block markers during initial scan, mark new bad blocks on first erase failure, and avoid re-using flagged blocks. Linux MTD's UBI layer and most bare-metal NAND drivers handle this transparently if configured correctly.
The MX30LF4G18AC-TI-T draws ~30 mA active and ~50 uA standby per the Macronix datasheet. During page program (300 us) and block erase (2 ms) operations, peak current can reach 50 mA; ensure the 3.3 V rail can supply this without droop. Place a 10 uF tantalum or ceramic bulk capacitor adjacent to the VCC pins to handle transient inrush during program/erase bursts. In battery-backed designs, gate the VCC rail with a load switch to drop standby current to <1 uA.
Although NAND Flash does not dissipate significant heat, sustained page-program operations in tight enclosures can raise junction temperature. Estimated: at 50 mA active current and 3.3 V VCC, power dissipation is 165 mW; with theta_JA ~80 C/W for TSOP-48, junction temperature rise above ambient is ~13 C. Ensure ambient temperature stays within the derating curve or use a heat-spreading copper pour on the PCB to keep the part within its -40 C to +85 C operating range.
Compliance Information
RoHS and lead-free per Macronix product page. Not AEC-Q100 qualified - for AEC-Q100 automotive designs use automotive-graded SLC NAND. Industrial temperature grade -40 C to +85 C. Halogen-free status not explicitly stated in retrieved data.
