MX30UF1G18AC-TI-T - 1.8V 1Gb SLC NAND Flash TSOP-48 | Macronix
MPN: MX30UF1G18AC-TI-T ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.45 | $34.50 |
| 100 | $2.95 | $295.00 |
| 500 | $2.55 | $1,275.00 |
| 1,000 | $2.2 | $2,200.00 |
MX30UF1G18AC-TI-T Overview
As a member of the SLC (Single-Level Cell) NAND Flash family, the MX30UF1G18AC-TI-T provides the highest endurance and lowest bit-error rate among NAND technologies, distinguishing it from MLC, TLC, and QLC alternatives. SLC stores one bit per cell, eliminating the multi-level voltage-threshold challenges of denser NAND and delivering typically 10x the endurance of MLC. It belongs to Macronix's 1.8V MX30UF series, complementing the 3V MX30LF and MX60LF lines for systems with mixed-voltage rails, and serves the role of non-volatile code-and-data storage in embedded designs.
Key features include a wide operating supply of 1.7V to 1.95V (1.8V nominal), standard asynchronous NAND timing with a tR/tPROG access window of 25 ns typical, an internal data register for page buffer operations, and hardware block-protection capability via WP#/HOLD# multifunction pins. The 48-TSOP-I package supports both x8 (8-bit) and x16 (16-bit) I/O configurations selectable at power-up by the ALE/CLE command sequence.
Architecturally, the device integrates a charge-pump high-voltage generator for program/erase, an on-chip temperature-compensated reference, and a 2048-byte (x8) / 1024-word (x16) page register for read/program buffering. ONFI 1.0 parameter-page interrogation enables host controllers to query geometry, timing, and ECC requirements at boot, simplifying firmware bring-up in Linux and RTOS environments that include native NAND drivers.
Typical applications include set-top box firmware storage, industrial HMI panel code/asset storage, point-of-sale terminals, automotive infotainment boot media (non-safety-critical), networking switch configuration memory, and Linux-based IoT gateways requiring robust embedded file systems such as UBIFS or JFFS2. Designers choose this part for high write-endurance logging and predictable read latencies rather than raw density.
When designing with this device, verify that the host controller provides a sufficient VCCQ rail at 1.8V (not 3.3V) and reserves dedicated GPIO for WP#, HOLD#, RE#, WE#, and ALE/CLE. Implementation of 4-bit ECC per 512-byte sector using BCH or Hamming software/HW codecs is mandatory; uncorrectable NAND typically causes boot failure or silent data corruption in journaled filesystems.
This page consolidates distributor pricing as of 2026-10-15, drop-in pin-compatible same-package alternatives, practical design guidance, and 4-bit ECC architectural notes not found in the Macronix datasheet summary alone.
Drop-in alternatives for MX30UF1G18AC-TI-T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MX30UF1G18AC-XKI
✅ Drop-In📋 Reference alternative (not in catalog)
MX30UF1G18AC-XQI
✅ Drop-In📋 Reference alternative (not in catalog)
MX30LF1G18AC-TI
✅ Drop-In📋 Reference alternative (not in catalog)
TC58NVG0S3HTA00
✅ Drop-In📋 Reference alternative (not in catalog)
K9F1G08U0D-PIB0
✅ Drop-In📋 Reference alternative (not in catalog)
W29N01HVSIBA
✅ Drop-In📋 Reference alternative (not in catalog)
MX30UF1G18AC-TI-T Maximum Ratings & Electrical Characteristics
| Density | 1 Gbit (128 MB) |
| Memory Technology | SLC NAND Flash |
| Operating Voltage (VCC) | 1.7 V to 1.95 V (1.8 V nominal) |
| Interface | Asynchronous Parallel NAND (ONFI 1.0) |
| Data Bus Width | x8 or x16 (selectable at boot) |
| Page Size | 2048 bytes (x8) / 1024 words (x16) |
| ECC Requirement | 4-bit ECC per 512 bytes |
| Page Read Time (tR) | 25 us typical |
| Block Erase Time (tBERS) | 2 ms typical |
| Program Time (tPROG) | 300 us typical per page |
| Endurance (P/E cycles) | 100,000 per block |
| Data Retention | 10 years |
| Operating Temperature | -40 C to +85 C (industrial) |
| Package | 48-TSOP-I (12 mm x 20 mm) |
| Mounting Type | Surface Mount |
| Compliance Standard | ONFI 1.0 |
| RoHS Status | Compliant |
MX30UF1G18AC-TI-T 48-tsop-i (12 mm x 20 mm) Pin Configuration Guide
Pin configuration for MX30UF1G18AC-TI-T (48-tsop-i (12 mm x 20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MX30UF1G18AC-TI-T.
Refer to the datasheet for full pin configuration.
Typical Applications
MX30UF1G18AC-TI-T is suitable for 6 applications: Set-Top Box Firmware Storage, Industrial HMI Panel Asset Storage, Point-of-Sale Terminal Non-Volatile Memory, Networking Switch Configuration Memory, Linux-Based IoT Gateway File System, Automotive Infotainment Boot Media.
Set-Top Box Firmware Storage
The MX30UF1G18AC-TI-T provides 128 MB of non-volatile storage for set-top box firmware, configuration, and channel databases. Its 100,000 P/E cycle endurance per block handles daily software updates and channel-list writes without wearing out within the product's 7-10 year service life. The 1.8V supply matches SoCs such as the Broadcom BCM7271 and MStar MSD6A802, eliminating level shifters on the memory bus. ONFI 1.0 parameter-page interrogation lets the bootloader auto-detect geometry and timing, simplifying firmware bring-up across product variants.
Recommended
Industrial HMI Panel Asset Storage
The MX30UF1G18AC-TI-T is well-suited to industrial HMI panels storing application images, fonts, and recipe databases. Its 48-TSOP-I package and -40C to +85C industrial rating address factory-floor thermal extremes, while SLC's 100,000 cycle endurance supports write-heavy recipe updates in process-control environments. The 4-bit ECC requirement is handled by typical HMI SoCs such as the TI Sitara AM335x or NXP i.MX 6ULL, ensuring reliable 24/7 operation across the panel's 10-year target lifetime.
Recommended
Point-of-Sale Terminal Non-Volatile Memory
The MX30UF1G18AC-TI-T provides reliable storage for POS terminal firmware, transaction logs, and merchant configuration. Its SLC endurance of 100,000 P/E cycles per block supports hundreds of daily database writes without premature wear-out, while 10-year data retention preserves transaction integrity during power-off periods. The TSOP-48 package is easy to assemble and rework on the POS main board, and the 1.8V interface matches modern POS SoCs that have migrated to lower-voltage memory buses for power efficiency.
Recommended
Networking Switch Configuration Memory
The MX30UF1G18AC-TI-T stores boot images, switch firmware, and NVRAM configuration blocks in managed Ethernet switches and routers. Its 25 us page-read latency supports fast boot of Layer 2/3 forwarding engines, and the 4-bit ECC requirement is manageable by typical switch ASICs such as the Broadcom BCM56150 or Marvell 98DX3236. The industrial temperature grade ensures reliable operation in outdoor-cabinet and carrier-grade environments where extended thermal cycling is common.
Recommended
Linux-Based IoT Gateway File System
The MX30UF1G18AC-TI-T is an excellent fit for Linux-based IoT gateways running UBIFS or JFFS2 on top of the raw MTD driver. With 128 MB of space it can hold the root filesystem, application overlays, and persistent logging without BTRFS or ext4 complexity. SLC's predictable error rates simplify the BCH(4,512) ECC implementation in mainline Linux, while 10-year data retention supports unattended edge deployments in smart agriculture, energy metering, and remote-monitoring scenarios.
Recommended
Automotive Infotainment Boot Media
The MX30UF1G18AC-TI-T is used for boot media and asset storage in non-safety-critical automotive infotainment systems such as head units and rear-seat entertainment. Its industrial-grade -40C to +85C rating is suitable for cabin environments, though AEC-Q100 specific qualification requires the dedicated automotive Macronix part number. The 1.8V interface matches NXP i.MX 8 and Qualcomm SA8155 automotive SoCs, enabling direct bus connection without external level translation.
Recommended
Recommended Products Summary
Engineering reference data for MX30UF1G18AC-TI-T — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MX30UF1G18AC-XKI | MX30UF1G18AC-XQI | MX30LF1G18AC-TI | TC58NVG0S3HTA00 | K9F1G08U0D-PIB0 | W29N01HVSIBA |
|---|---|---|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Macronix | Toshiba (Kioxia) | Samsung | Winbond |
| Package | 48-TSOP-I (12 mm x 20 mm) | 48-TSOP-I (12 mm x 20 mm) - same | 48-TSOP-I (12 mm x 20 mm) - same | 48-TSOP-I (12 mm x 20 mm) - same | 48-TSOP-I (12 mm x 20 mm) - same | 48-TSOP-I (12 mm x 20 mm) - same | 48-TSOP-I (12 mm x 20 mm) - same |
| Density | 1 Gbit (128 MB) | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Operating Voltage (VCC) | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 2.7 V to 3.6 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V |
| Memory Technology | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND |
| Bus Width | x8 / x16 selectable | x8 / x16 selectable | x8 / x16 selectable | x8 / x16 selectable | x8 / x16 selectable | x8 only | x8 / x16 selectable |
| ECC Requirement | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes |
| Endurance (P/E cycles) | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C (extended screening) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Compliance | ONFI 1.0, RoHS | ONFI 1.0, RoHS | ONFI 1.0, RoHS | ONFI 1.0, RoHS | ONFI 1.0, RoHS | ONFI 1.0, RoHS | ONFI 1.0, RoHS |
Key Differentiators
- 1.8V supply rail matches modern low-power SoCs (vs MX30LF1G18AC-TI)
- Selectable x8 / x16 bus interface (vs K9F1G08U0D-PIB0)
- 100,000 P/E endurance with 10-year retention (vs W29N01HVSIBA)
- ONFI 1.0 standard compliance for cross-vendor interop (vs TC58NVG0S3HTA00)
Design Notes
The MX30UF1G18AC-TI-T requires a stable 1.8V VCC rail (1.7V-1.95V) for both core and I/O. Designers must NOT connect a 3.3V supply, as is common with the 3V MX30LF1G18AC variant - the pinout is identical but VCC tolerance is not. Decouple VCC and VSS with 0.1 uF X7R ceramic capacitors placed within 5 mm of the package, plus a bulk 4.7 uF tantalum for transient suppression during program/erase. Voltage droop below 1.7V causes read errors that 4-bit ECC may not correct, leading to bad-block remap storms.
NAND asynchronous I/O traces on the host PCB should be length-matched within +/-2 mm across all 8 or 16 DQ lines, plus RE#, WE#, CLE, and ALE, to minimize skew. Series 33 ohm damping resistors near the driver help suppress ringing when the bus capacitance exceeds 20 pF (typical when multiple devices share the bus). Place a ground guard trace between I/O and adjacent noise sources such as DC-DC converter switching nodes. Refer to the Macronix AC timing section for tREA, tRHZ, and tRHOH requirements specific to this part.
A common mistake is omitting the 4-bit ECC step at the host. The Macronix datasheet states that 4-bit BCH or Hamming per 512-byte sector is mandatory, but many evaluation boards ship with ECC disabled to speed up read benchmarks. Always verify ECC enable in the bootloader before mounting any filesystem (UBIFS/JFFS2) - raw NAND access without ECC silently corrupts data after several months of retention cycling. Boot-time ECC verification routines should also double-read critical boot sectors with two independent ECC passes.
Compliance Information
RoHS compliant per Macronix product page. ONFI 1.0 compliance ensures cross-vendor interoperability. Industrial -40C to +85C temperature grade. Not AEC-Q100 qualified - refer to Macronix for automotive-grade variants.
