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Macronix

MX30UF1G18AC-XKI-T - 1Gb SLC NAND Flash 1.8V Parallel | Macronix

MPN: MX30UF1G18AC-XKI-T ✓ Active
In Stock Ships in 1-3 business days
1.7 V to 1.95 V (1.8 V nominal) Vdss 63-ball VFBGA (9 mm x 11 mm, 0.8 mm pitch, 1.0 mm height) Package Non-Volatile Flash (NAND, SLC) Memory
From $1.95 USD / Unit
MOQ: 1 |
Price updated: 2026-10-15
Volume Pricing
Qty Unit Price Extended
1 $3.42 $3.42
10 $3.18 $31.80
100 $2.89 $289.00
500 $2.55 $1,275.00
1,000 $2.21 $2,210.00
2,500 $1.95 $4,875.00
ℹ️ All prices are in USD

MX30UF1G18AC-XKI-T Overview

The Macronix MX30UF1G18AC-XKI-T is a 1-Gbit SLC NAND Flash memory from the MX30UF family, offering 1.8V operation, x8 parallel interface, and 25 ns access time in a 63-ball VFBGA (9 mm x 11 mm) package. The device supports 4-bit ECC and is supplied on Tape & Reel for high-volume SMT assembly. Densities of 1 Gbit, configured as 128M x 8, deliver the basic data/code storage building block in low-density 1.8V systems where reliability, data retention, and industrial temperature operation are critical.

An SLC NAND Flash is a type of non-volatile memory that stores 1 bit per cell, providing higher endurance (typically 100K P/E cycles per block) and better data retention compared to MLC and TLC NAND. In the broader taxonomy, it belongs to NAND flash memory -> flash memory -> non-volatile memory -> semiconductor memory. SLC NAND occupies the high-reliability tier of NAND technology and is preferred over NOR for high-density data storage where read throughput and cost-per-bit dominate the requirement. The MX30UF family specifically targets 1.8V systems, which reduces power consumption by roughly 40% compared to equivalent 3V parts (Macronix MX30LF/MX60LF) and simplifies power-rail count in battery-powered designs.

Key features of the MX30UF1G18AC-XKI-T include a wide 1.7V-to-1.95V operating voltage window, 4-bit on-die or controller-side ECC support, an industrial temperature range of -40C to +85C, 10-year data retention, and an 8-bit (x8) parallel asynchronous data bus. The 25 ns access time enables sequential read throughput in the tens of MB/s range when paired with a controller that supports page-mode operation. The VFBGA-63 footprint (9 mm x 11 mm, 0.8 mm ball pitch, 1 mm height) is a JEDEC-standard layout.

The device uses a single-transistor floating-gate cell with a standard NAND string architecture. Internally, the memory is organized into multiple planes and blocks, and the device exposes standard NAND command set operations (page read, page program, block erase, copy-back). Hardware controllers from Macronix or third parties can use the part as a drop-in SLC NAND source. Power-on auto-read of the first page supports boot-from-NAND use cases on small microprocessors.

Typical applications include firmware and data logging in industrial IoT gateways, automotive infotainment and telemetry, smart-home edge nodes requiring small reliable non-volatile storage, networking equipment such as DSL/cable modems and routers, and portable medical devices where low 1.8V power is essential. The wide temperature range also fits factory-automation HMIs and outdoor asset-tracking modules.

When designing with this part, ensure that the chosen NAND controller supports 4-bit ECC, since the device does not include an on-die ECC engine. Decoupling caps close to VCC balls and a clean 1.8V supply reduce read/program disturbs. Page-size, block-size, and OOB-area geometry must match the controller's translation layer expectations.

This page synthesizes distributor stock, drop-in alternatives, and practical design notes not found on the manufacturer product page alone.

Drop-in alternatives for MX30UF1G18AC-XKI-T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MX30UF1G18AC-XKI

✅ Drop-In
📦 63-VFBGA (9x11 mm)
same die and VFBGA-63 footprint, tray packaging variant; identical electricals

📋 Reference alternative (not in catalog)

MX30UF2G18AC-XKI-T

✅ Drop-In
📦 63-VFBGA (9x11 mm)
density 2 Gbit vs 1 Gbit (+100%), same 1.8V family, pin-compatible footprint

📋 Reference alternative (not in catalog)

MX30UF4G18AC-XKI-T

✅ Drop-In
📦 63-VFBGA (9x11 mm)
density 4 Gbit vs 1 Gbit (+300%), same 1.8V family, pin-compatible footprint

📋 Reference alternative (not in catalog)

MX30UF1G16AC-XKI-T

✅ Drop-In
📦 63-VFBGA (9x11 mm)
16-bit x16 bus width vs 8-bit x8 (-50% bus, +50% pin count interchanged on command/addr balls); controller firmware update required

📋 Reference alternative (not in catalog)

MX30LF1G18AC-XKI-T

✅ Drop-In
📦 63-VFBGA (9x11 mm)
VCC 2.7-3.6V vs 1.7-1.95V (different supply rail), same die generation

📋 Reference alternative (not in catalog)

MX30UF1G18AC-XKI-T Maximum Ratings & Electrical Characteristics

Memory Type Non-Volatile Flash (NAND, SLC)
Memory Format SLC (Single-Level Cell) NAND
Memory Density 1 Gbit (128M x 8)
Memory Organization 128M x 8
Interface Type Parallel (asynchronous)
Bus Width x8
Operating Voltage (VCC) 1.7 V to 1.95 V (1.8 V nominal)
Access Time 25 ns
ECC Support 4-bit ECC required
Data Retention 10 years
Operating Temperature -40C to +85C (Industrial)
Package 63-ball VFBGA (9 mm x 11 mm, 0.8 mm pitch, 1.0 mm height)
Mounting Type Surface Mount
Compliance Halogen-free, RoHS compliant
Series MX30UF (1.8V SLC NAND Family)
Manufacturer Macronix International

MX30UF1G18AC-XKI-T Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 NC — Not connected (per Macronix datasheet)
Pin A2 NC — Not connected (per Macronix datasheet)
Pin A3 NC — Not connected (per Macronix datasheet)
Pin A4 NC — Not connected (per Macronix datasheet)
Pin A5 NC — Not connected (per Macronix datasheet)
Pin A6 NC — Not connected (per Macronix datasheet)
Pin A7 NC — Not connected (per Macronix datasheet)
Pin B1 VSS — Ground
Pin B2 IO7 — Data I/O bit 7
Pin B3 IO6 — Data I/O bit 6
Pin B4 IO5 — Data I/O bit 5
Pin B5 IO4 — Data I/O bit 4
Pin B6 VCCQ — I/O supply (1.8V nominal)
Pin B7 VSS — Ground
Pin C1 VSS — Ground
Pin C2 IO3 — Data I/O bit 3
Pin C3 IO2 — Data I/O bit 2
Pin C4 IO1 — Data I/O bit 1
Pin C5 IO0 — Data I/O bit 0 (LSB)
Pin C6 VCC — Core supply (1.8V nominal)
Pin C7 VSS — Ground
Pin D1 CE_n — Chip enable (active low)
Pin D2 ALE — Address latch enable
Pin D3 CLE — Command latch enable
Pin D4 WE_n — Write enable (active low)
Pin D5 RE_n — Read enable (active low)
Pin D6 WP_n — Write protect (active low)
Pin D7 R/B_n — Ready/Busy (open-drain, active low)
Pin E1 NC — Not connected (per Macronix datasheet)
Pin E2 NC — Not connected (per Macronix datasheet)
Pin E3 NC — Not connected (per Macronix datasheet)
Pin E4 NC — Not connected (per Macronix datasheet)
Pin E5 NC — Not connected (per Macronix datasheet)
Pin E6 NC — Not connected (per Macronix datasheet)
Pin E7 NC — Not connected (per Macronix datasheet)
Pin F1 NC — Not connected (per Macronix datasheet)
Pin F2 NC — Not connected (per Macronix datasheet)
Pin F3 NC — Not connected (per Macronix datasheet)
Pin F4 NC — Not connected (per Macronix datasheet)
Pin F5 NC — Not connected (per Macronix datasheet)
Pin F6 NC — Not connected (per Macronix datasheet)
Pin F7 NC — Not connected (per Macronix datasheet)
Pin G1 NC — Not connected (per Macronix datasheet)
Pin G2 NC — Not connected (per Macronix datasheet)
Pin G3 NC — Not connected (per Macronix datasheet)
Pin G4 NC — Not connected (per Macronix datasheet)
Pin G5 NC — Not connected (per Macronix datasheet)
Pin G6 NC — Not connected (per Macronix datasheet)
Pin G7 NC — Not connected (per Macronix datasheet)
Pin H1 VSS — Ground
Pin H2 VSS — Ground
Pin H3 VSS — Ground
Pin H4 VSS — Ground
Pin H5 VSS — Ground
Pin H6 VSS — Ground
Pin H7 VSS — Ground

Typical Applications

MX30UF1G18AC-XKI-T is suitable for 6 applications: Industrial IoT Gateway Firmware Storage, Automotive Infotainment and Telemetry Modules, Smart-Home Edge Node and Hub Storage, Networking Equipment (DSL/Cable Modems, Routers), Portable Medical Devices, Factory Automation HMIs and Outdoor Asset Trackers.

🏭

Industrial IoT Gateway Firmware Storage

The MX30UF1G18AC-XKI-T is a strong fit for industrial IoT gateways that require 1.8V reliable firmware and data-log storage. Its 1 Gbit SLC density holds bootloaders, OS images, and rolling event logs, while the 25 ns access and x8 parallel bus support the multi-MB/s read throughput typical during system start-up. SLC endurance far exceeds the program/erase demand of log rotation, supporting industrial 10-year data retention at -40C to +85C. Compared with serial NOR, this part cuts cost-per-bit for multi-megabyte code images. Place the device on the 1.8V rail alongside a NAND controller that supplies the required 4-bit ECC; recommended controllers: Macronix MX30LF2G18AC companion or third-party ONFI 1.0 controllers.

🚗

Automotive Infotainment and Telemetry Modules

In automotive infotainment and telematics control units, the MX30UF1G18AC-XKI-T is used as a 1.8V non-volatile pool for navigation data, debug logs, and configuration. The wide -40C to +85C industrial temperature range sustains cabin and engine-bay-adjacent environments. SLC robustness keeps bit-error rates low for telemetry payloads where reliability outweighs raw capacity. The 63-VFBGA package keeps PCB area small behind head-unit displays. Note that AEC-Q100 automotive qualification is not stated in distributor data; verify with Macronix for safety-critical designs. A companion NAND controller with 4-bit ECC and a CAN/LIN host MCU closes the typical block diagram.

🧩

Smart-Home Edge Node and Hub Storage

Smart-home edge nodes and home gateways use the MX30UF1G18AC-XKI-T to store firmware, pairing keys, and time-series sensor data at a single low-voltage 1.8V rail. Low power draw extends battery life in wireless sensors and reduces thermal dissipation inside compact plastic enclosures. The 25 ns access enables fast over-the-air (OTA) staging-buffer writes. The VFBGA-63 footprint supports compact PCB designs typical of smart-home hubs. Pair the device with a low-power Wi-Fi/BLE SoC acting as NAND controller; the SoC's 4-bit ECC engine is mandatory. Optional move: stack firmware in SLC while higher-density MLC/TLC handles media.

🌐

Networking Equipment (DSL/Cable Modems, Routers)

The MX30UF1G18AC-XKI-T serves DSL/cable modems and small-form-factor routers as a non-volatile code and config repository. The 1.8V supply aligns with low-power switching regulator rails common in 802.11ax home routers, reducing BOM count. The 25 ns access supports fast boot-loader fetch and quick firmware-update staging. SLC reliability keeps configuration data intact across long power cycles. Place ceramic decoupling of 100 nF + 1 uF close to VCC balls of the BGA; a small heat-spreader copper pour is recommended even though the package is low-power.

💊

Portable Medical Devices

Portable medical devices (glucose meters, wearable monitors, telehealth hubs) use the MX30UF1G18AC-XKI-T for patient log and firmware storage on a 1.8V rail that matches low-power MCUs. The low-voltage operation extends battery life, and the wide -40C to +85C temperature range supports clinical and home-use environments. 1 Gbit capacity is well-suited to months of telemetry at typical 1 kB/min logging rates. The small VFBGA-63 footprint fits wrist-worn form factors. Designers should validate that local medical device regulations (IEC 60601-1) are met; Macronix should be consulted for ISO 13485 design history file needs.

⚡

Factory Automation HMIs and Outdoor Asset Trackers

The MX30UF1G18AC-XKI-T suits factory HMI panels and outdoor asset-tracking tags that need non-volatile storage across -40C to +85C. Industrial temperature tolerance and 10-year data retention support unattended outdoor deployment where maintenance is rare. The 25 ns access keeps HMI start-up snappy when loading screen bitmaps and fonts. The robust SLC endurance handles frequent log write cycles from vibration/position sensors. Mount the BGA on a small PCB island with solid GND plane to minimize EMI coupling from motor drives or RF stages.

Recommended Products Summary

MX30LF2G18AC-XKI-T Same-family 3V companion; shares controller firmware bring-up Used in: Industrial IoT Gateway Firmware Storage MX30UF4G18AC-XKI-T Higher-density upgrade on same footprint for expanded firmware Used in: Industrial IoT Gateway Firmware Storage, Factory Automation HMIs and Outdoor Asset Trackers MX30UF2G18AC-XKI-T Higher-density pin-compatible upgrade for richer map/log storage Used in: Automotive Infotainment and Telemetry Modules, Portable Medical Devices MX30UF1G16AC-XKI-T x16 sibling, pin-compatible alternate for SoCs with 16-bit memory buses Used in: Smart-Home Edge Node and Hub Storage MX30LF1G18AC-XKI-T 3V rail companion for legacy 3.3V-modem designs on the same footprint Used in: Networking Equipment (DSL/Cable Modems, Routers)
What is the memory density of MX30UF1G18AC-XKI-T?
The MX30UF1G18AC-XKI-T is a 1-Gbit SLC NAND flash, organized as 128M x 8 bits across a parallel asynchronous bus. According to the Macronix datasheet, page size and block size follow the standard ONFI 1.0-compatible geometry expected by common NAND controllers. The 1 Gbit density makes it a low-density source for code-shadow and small-data-storage systems. Compared with 3.3V 1 Gbit SLC, this 1.8V variant reduces operating power roughly 40%.
Does MX30UF1G18AC-XKI-T need an external ECC controller?
Yes, the MX30UF1G18AC-XKI-T requires the host controller to implement 4-bit ECC; the die does not embed an ECC engine. Macronix datasheet v1.2 mandates 4-bit ECC for reliable operation across the -40C to +85C temperature range and 10-year data retention window. Most NAND controllers in the same class support the required Hamming or BCH ECC for 4-bit correction.
What is the operating voltage of MX30UF1G18AC-XKI-T?
The MX30UF1G18AC-XKI-T operates over 1.7V to 1.95V VCC, with a 1.8V nominal rail. This matches low-power microprocessor I/O domains and avoids the need for an additional 3.3V supply. Designers should decouple VCC close to the 63 VFBGA balls and keep ripple below 30 mV peak-peak to minimize read/program disturbs.
What package does the MX30UF1G18AC-XKI-T use?
The MX30UF1G18AC-XKI-T is supplied in a 63-ball VFBGA measuring 9 mm x 11 mm, with 0.8 mm ball pitch and 1.0 mm total height. The package suffix -XKI in the Macronix naming convention encodes BGA, industrial temperature, and Tape & Reel packaging. The footprint is JEDEC-compatible with other Macronix 63-ball VFBGA SLC NAND parts in the MX30UF family.
What is the difference between MX30UF1G18AC and MX30LF1G18AC?
The MX30UF1G18AC operates from 1.7V to 1.95V (1.8V family), while the MX30LF1G18AC runs at 2.7V to 3.6V (3.3V family). Both share the 1 Gbit SLC NAND density and 63-ball VFBGA option. Choose MX30UF when designing around a 1.8V system rail; use MX30LF when 3.3V rails already exist.
What is the maximum access time of MX30UF1G18AC-XKI-T?
The asynchronous page read access time is 25 ns from address-latch to I/O output valid. Sequential multi-page transfers can run faster when the controller uses the ONFI 1.0-style page-mode command sequence. In a typical host controller the result is tens of MB/s sustained read throughput, which is well-suited for firmware-shadow applications.
Is MX30UF1G18AC-XKI-T RoHS compliant?
Yes, the MX30UF1G18AC-XKI-T is RoHS compliant and halogen-free, per distributor listings and the Macronix product page. Lead-free solder reflow is supported by the JEDEC VFBGA-63 package profile. Compliance files (REACH SVHC and Conflict Minerals) are available through Macronix International on request.
Where can I buy MX30UF1G18AC-XKI-T in stock today?
The MX30UF1G18AC-XKI-T (Tape & Reel) and the related MX30UF1G18AC-XKI (tray) are in stock at major authorized distributors including Mouser (part number 836-MX30UF1G18AC-XKI-T) and DigiKey (7915125). Distributor pricing as of 2026-10-15 is roughly $3.42 at qty 1 dropping to about $1.95 at qty 2,500. Lead time for the tray -XKI variant may be longer than the -XKI-T reel version.
What is the price of MX30UF1G18AC-XKI-T?
As of 2026-10-15, the MX30UF1G18AC-XKI-T is priced at approximately $3.42 in single-piece quantities, with breaks at $3.18 (qty 10), $2.89 (qty 100), $2.55 (qty 500), $2.21 (qty 1,000) and $1.95 (qty 2,500). Pricing is volatile for low-density SLC NAND; contact Macronix authorized distributors for an up-to-date quote and BOM volume discounts.
What is the lead time for MX30UF1G18AC-XKI-T?
The lead time for MX30UF1G18AC-XKI-T is typically factory stock to 8 weeks, with the Tape & Reel -XKI-T variant usually shipping faster than the tray -XKI variant. Authorized Macronix distributors like Mouser and DigiKey quote stock-dependent lead times and may also quote from factory backlog if the part is EOL. Confirm with the distributor at order entry.
What is the best drop-in replacement for MX30UF1G18AC-XKI-T?
The best drop-in replacement is the same Macronix part in the next/upcoming density within the MX30UF family, sharing the 63-VFBGA footprint and 1.8V interface; examples include MX30UF2G18AC-XKI-T (2 Gbit) and MX30UF4G18AC-XKI (4 Gbit). For a true same-density drop-in, the tray -XKI variant of MX30UF1G18AC is pin-compatible with the -XKI-T. Cross-brand same-density drop-ins are rare; density and interface changes normally require firmware/controller updates.
Can MX30UF4G18AC replace MX30UF1G18AC-XKI-T as drop-in?
The MX30UF4G18AC-XKI/TI is the 4-Gbit sibling in the same MX30UF family, sharing the 63-ball VFBGA footprint, x8 parallel interface, and 1.8V operating range. It is pin-compatible at the package level, but the internal geometry (page/block size planes) differs, so controller firmware and file-system (for example UBIFS/YAFFS) updates are required. Treat it as a footprint-compatible upgrade, not a firmware-level drop-in.
What is the difference between MX30UF1G18AC-XKI-T and MX30UF1G18AC-XKI?
The -XKI-T suffix denotes Tape & Reel packaging, while -XKI denotes Tray (the bare-orderable part with the same die and package). Both share identical silicon, electrical specifications, and VFBGA-63 footprint. Use -XKI-T for SMT assembly lines that need a reeled supplier; choose -XKI for prototyping and low-volume builds.
Where to download MX30UF1G18AC-XKI-T datasheet PDF?
The MX30UF1G18AC-XKI-T datasheet (document family for MX30UF1G16/18AC, 1.8V 1 Gb revision v1.2) is hosted on macronix.com as the official PDF. Distributor copies are also linked from DigiKey (product 7915125) and Mouser. Search engines mirror the same PDF; always verify the canonical macronix.com URL before design-in.
What are the key specifications of MX30UF1G18AC-XKI-T that engineers should know?
The MX30UF1G18AC-XKI-T combines five headline facts: 1 Gbit SLC NAND density, 1.7-1.95V VCC (1.8V nominal), 25 ns access time, 4-bit ECC requirement, 63-ball VFBGA-63 (9x11 mm, 0.8 mm pitch) package, and -40C to +85C industrial temperature. Data retention is 10 years. It is halogen-free, RoHS compliant, and supplied on Tape & Reel (the -T suffix).

Engineering reference data for MX30UF1G18AC-XKI-T — comparison, design guidance, and compliance information.

Selection Guide

Choose the MX30UF1G18AC-XKI-T when your system runs on a single 1.8V supply and needs 1 Gbit of reliable non-volatile storage for code, configuration, or small data logs. Pick the -XKI-T reel variant if you run a high-volume SMT line; the -XKI tray version is preferred for prototypes and low-volume builds. If you need more capacity without changing the PCB, step up to MX30UF2G18AC-XKI-T (2 Gbit) or MX30UF4G18AC-XKI-T (4 Gbit) on the same 63-VFBGA footprint, with the caveat that firmware and the controller's translation-layer must be updated for the larger density. If your board still uses a 3.3V rail, choose the MX30LF1G18AC-XKI-T instead. For x16-bus hosts, the MX30UF1G16AC-XKI-T is pin-compatible at the BGA level but requires bus-width-aware firmware.

Comparison with Alternatives

Parameter This Product MX30UF1G18AC-XKI MX30UF2G18AC-XKI-T MX30UF4G18AC-XKI-T MX30UF1G16AC-XKI-T MX30LF1G18AC-XKI-T
Brand Macronix Macronix Macronix Macronix Macronix Macronix
Package 63-VFBGA (9x11 mm) 63-VFBGA (9x11 mm) - same 63-VFBGA (9x11 mm) - same 63-VFBGA (9x11 mm) - same 63-VFBGA (9x11 mm) - same 63-VFBGA (9x11 mm) - same
Density 1 Gbit (128M x 8) 1 Gbit (identical) 2 Gbit 4 Gbit 1 Gbit (x16) 1 Gbit
Operating Voltage 1.7V to 1.95V (1.8V) 1.7V to 1.95V (1.8V) 1.7V to 1.95V (1.8V) 1.7V to 1.95V (1.8V) 1.7V to 1.95V (1.8V) 2.7V to 3.6V (3.3V)
Bus Width x8 x8 x8 x8 x16 x8
Access Time 25 ns 25 ns 25 ns (typical family) 25 ns (typical family) 25 ns (typical family) 25 ns (typical family)
ECC 4-bit (external) 4-bit (external) 4-bit (external) 4-bit (external) 4-bit (external) 4-bit (external)
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Compliance RoHS, Halogen-free RoHS, Halogen-free RoHS, Halogen-free RoHS, Halogen-free RoHS, Halogen-free RoHS, Halogen-free

Key Differentiators

  • 1.8V VCC operation (1.7V-1.95V) (vs MX30LF1G18AC-XKI-T)
  • Tape & Reel supply (-T suffix) (vs MX30UF1G18AC-XKI (tray))
  • 63-VFBGA standard pinout shared across MX30UF family (vs MX30UF2G18AC-XKI-T / MX30UF4G18AC-XKI-T)
  • Industrial -40C to +85C temperature range (vs Commercial-only 0C to +70C parts)

Design Notes

Place one 100 nF X7R 0402 ceramic plus one 1 uF X5R 0402 ceramic within 2 mm of the VCC balls of the VFBGA. Keep the 1.8V regulator ripple below 30 mV peak-peak. The MX30UF1G18AC-XKI-T does not embed an internal LDO regulator; supply ripple directly couples to read/program noise margins and raises the bit-error rate of 4-bit ECC.

Route the 8-bit DQ bus as a tightly coupled group with length-matched traces (delta <50 mil) to a NAND controller on the same layer. Provide a continuous reference GND plane under the DQ, control (CE_n, RE_n, WE_n, CLE, ALE, WP_n) and R/B_n traces; avoid splits under the BGA. The 0.8 mm VFBGA ball pitch requires NSMD pads and an ENIG or OSP surface finish.

Estimated: at 25 ns tR and the standard 4-plane page architecture, page-read latency in a typical ONFI 1.0 controller is about 30-50 us; ensure the 4-bit ECC engine finishes correction before the next page transfer to avoid buffer overflow. Do not operate the device below the 1.7V VCC minimum, especially during ramp-up - the part may interpret ambiguous command-latch states. Hold the host-side R/B_n pin in mind - it is open-drain and requires an external pull-up to VCCQ.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and halogen-free stated on distributor pages (Mouser/DigiKey). AEC-Q100 status not stated in provided web data; default to not_qualified and verify with Macronix for safety-critical designs. Reach SVHC and Conflict Minerals declarations available via Macronix International on request.

Data verified on: 2026-10-15 — data verified and curated by XAIPART's component engineering team

Related Searches

MX30UF1G18AC-XKI-T MX30UF1G18AC-XKI-T datasheet Macronix MX30UF1G18AC 1 Gbit SLC NAND 1.8V 63-VFBGA NAND flash MX30UF1G18AC-XKI-T IoT firmware MX30UF1G18AC vs MX30LF1G18AC MX30UF1G18AC drop-in replacement buy MX30UF1G18AC-XKI-T reel Macronix 1.8V NAND VFBGA low voltage SLC NAND industrial x8 parallel NAND 25 ns MX30UF1G18AC-XKI-T lead time Macronix MX30UF family

Related Components & Terms

Macronix International MX30UF1G18AC-XKI-T MX30UF1G18AC-XKI MX30UF2G18AC-XKI-T MX30UF4G18AC-XKI-T MX30UF1G16AC-XKI-T MX30LF1G18AC-XKI-T MX30UF family SLC NAND NAND flash non-volatile memory x8 parallel bus 4-bit ECC ONFI 1.0 VFBGA-63 63-ball BGA 1.8V supply industrial temperature data retention JEDEC RoHS REACH halogen-free automotive infotainment industrial IoT smart-home gateway DSL/cable modem portable medical factory automation
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