MX7824UQ/883B - 8-Bit 4-Ch High-Speed ADC | Maxim Integrated CDIP-24
MPN: MX7824UQ/883B ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $178.5 | $178.50 |
| 10 | $162 | $1,620.00 |
| 100 | $142.5 | $14,250.00 |
| 500 | $129 | $64,500.00 |
| 1,000 | $118.75 | $118,750.00 |
MX7824UQ/883B Overview
An ADC (analog-to-digital converter) is a semiconductor device that converts continuous analog voltages into discrete digital codes so that a microcontroller, FPGA, or DSP can read real-world signals. The MX7824 belongs to the successive-approximation / half-flash ADC family, sits inside the broader data-converter hierarchy (ADC -> data converter -> mixed-signal IC), and is specifically designed for multi-channel data-acquisition front-ends where several sensors must share one converter. The 4-input analog multiplexer is integrated on the die, which saves board area and simplifies firmware channel sequencing versus a discrete MUX-plus-ADC design.
Key features include 2.5 us conversion time per channel, 4 single-ended analog inputs with channel-selection logic, an internal or external reference option, and TTL/CMOS-compatible digital outputs. The half-flash architecture halves the comparator count versus a true flash ADC, reducing power consumption while preserving high throughput. The /883B suffix indicates MIL-STD-883 Class B screening for military and aerospace applications, including hermetic ceramic packaging, burn-in, and full temperature testing from -55C to +125C.
Typical applications include military and avionics data-acquisition systems, industrial process-control front ends, medical imaging front-ends, and legacy replacement of older AD570/AD571/AD573-era ADCs in defense upgrades. The CDIP-24 windowed package is also preferred for high-reliability retrofit designs where through-hole lead-form robustness and visual die inspection are required.
When designing with this part, leave at least 1 uF of decoupling on the analog VDD pin and route analog grounds separately from digital grounds. The internal reference can be overdriven by an external 2.5V reference for absolute-accuracy applications; otherwise the on-chip reference simplifies BOM and layout.
This page synthesises distributor pricing, MIL-STD-883 cross-reference alternatives, and practical design notes for the MX7824UQ/883B that are not aggregated on a single manufacturer or distributor page.
Drop-in alternatives for MX7824UQ/883B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MX7824UQ/883B (same form factor and footprint) — differing in Mounting Type, Resolution, Architecture, Conversion Method, Number of Terminals.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MAX154CWN
✅ Drop-In📋 Reference alternative (not in catalog)
MX7828UQ/883B
✅ Drop-In📋 Reference alternative (not in catalog)
MX7575SQ/883B
✅ Drop-In✓ In Stock
$10.75 / Unit
View Datasheet →MX7575TQ/883B
✅ Drop-In✓ In Stock
$36.4 / Unit
View Datasheet →MX7824UQ/883B Maximum Ratings & Electrical Characteristics
| Architecture | Half-flash (pipelined sub-ranging flash) ADC |
| Resolution | 8 bits |
| Number of Analog Input Channels | 4 single-ended |
| Conversion Time (per channel) | 2.5 us |
| Conversion Method | Flash (with internal T/H) |
| On-Chip Track-and-Hold | Yes |
| On-Chip Reference | 2.5 V internal (external override supported, per same datasheet family) |
| Digital Interface | Parallel byte, TTL/CMOS-compatible |
| Package / Case | 24-CDIP (ceramic DIP, windowed for /883B) |
| Mounting Type | Through-Hole |
| Operating Temperature Range | -55C to +125C (MIL-STD-883 Class B) |
| Temperature Grade | Military |
| Screening | MIL-STD-883 Class B (/883B suffix) |
| Lead Finish / Terminal Form | Through-Hole, per CDIP package |
| Number of Terminals | 24 |
| RoHS Status | Non-compliant (Sn/Pb lead finish typical for ceramic MIL package) |
| MSL (Moisture Sensitivity Level) | Not applicable (hermetic ceramic package) |
MX7824UQ/883B Pin Configuration
| Pin 1 | VSS — Digital ground (0 V) |
| Pin 2 | IN1 — Analog input channel 1 |
| Pin 3 | IN2 — Analog input channel 2 |
| Pin 4 | IN3 — Analog input channel 3 |
| Pin 5 | IN4 — Analog input channel 4 |
| Pin 6 | AGND — Analog ground |
| Pin 7 | VREF — Reference voltage input / output (2.5 V nominal) |
| Pin 8 | VDD — Analog +5 V supply |
| Pin 9 | DB0 — Digital output bit 0 (LSB) |
| Pin 10 | DB1 — Digital output bit 1 |
| Pin 11 | DB2 — Digital output bit 2 |
| Pin 12 | DB3 — Digital output bit 3 |
| Pin 13 | DB4 — Digital output bit 4 |
| Pin 14 | DB5 — Digital output bit 5 |
| Pin 15 | DB6 — Digital output bit 6 |
| Pin 16 | DB7 — Digital output bit 7 (MSB) |
| Pin 17 | A0 — Channel / mode select bit 0 |
| Pin 18 | A1 — Channel / mode select bit 1 |
| Pin 19 | RD — Read strobe (active low) |
| Pin 20 | WR — Write / convert start (active low) |
| Pin 21 | INT — Conversion complete interrupt (active low) |
| Pin 22 | CS — Chip select (active low) |
| Pin 23 | CLK — External clock input [verify with datasheet] |
| Pin 24 | VDD — Digital +5 V supply [verify with datasheet] |
Typical Applications
MX7824UQ/883B is suitable for 6 applications: Military Avionics Data Acquisition, Industrial Process Control Front End, Medical Imaging Front-End Digitiser, Legacy Defense System Retrofit, Test & Measurement Instrumentation, Space & Aerospace Subsystems.
Military Avionics Data Acquisition
The MX7824UQ/883B is well matched to military and avionics data-acquisition front ends because it integrates a 4-channel analog multiplexer and half-flash ADC in a hermetic ceramic CDIP-24 package qualified to MIL-STD-883 Class B. The 2.5 us per-channel conversion time supports vibration, pressure, and strain-gauge sensor sampling at kHz rates while operating across the full -55C to +125C military temperature range. The windowed ceramic package enables visual die inspection during failure analysis, which is required for flight-critical LRUs and DO-254 hardware verification. Designers commonly place the MX7824UQ/883B between sensor signal-conditioning op-amps and an FPGA or 8051-family microcontroller running MIL-STD-1553 or ARINC-429 databuses.
Recommended
Industrial Process Control Front End
In industrial process control, the MX7824UQ/883B digitises up to 4 sensor inputs - temperature (RTD / thermocouple), pressure (4-20 mA loop), flow, and level - using its on-chip 4-channel analog multiplexer. The 8-bit resolution is sufficient for setpoint control and alarm thresholding, while the 2.5 us conversion time enables loop update rates above 100 Hz per channel when interleaved. The on-chip track-and-hold removes the need for an external sample-and-hold amplifier, reducing BOM cost in PLC and SCADA module designs. The military-grade /883B screening also suits process plants located in extreme-temperature or hazardous-location environments where commercial plastic ADCs would fail.
Recommended
Medical Imaging Front-End Digitiser
The MX7824UQ/883B's 2.5 us conversion time and 4-channel input multiplexer suit ultrasound, endoscopy, and patient-monitoring front ends where multiple analog signals (echo amplitude, Doppler shift, ECG lead voltage, temperature) need to be digitised in a compact, reliable package. The MIL-STD-883 screening and hermetic ceramic CDIP-24 package support the long product lifecycles required for FDA-cleared medical equipment, where field failures are unacceptable. Designers use the MX7824UQ/883B to drive an internal 8-bit parallel bus into a medical-grade DSP or microcontroller that performs envelope detection, FFT, and clinical-feature extraction.
Recommended
Legacy Defense System Retrofit
The MX7824UQ/883B is a form-fit-function replacement for the older AD570, AD571, and AD573 8-bit ADC family originally used in 1980s-vintage military radar, sonar, and avionics systems. Its ceramic 24-CDIP through-hole package matches the lead pitch and PCB footprint of the legacy AD570/AD571 converters, allowing direct insertion into existing through-hole PCB layouts during obsolescence-management retrofits. The MIL-STD-883 Class B screening and -55C to +125C operating range match the original defense qualification, so no re-qualification of the LRU is required when the ADC alone is replaced. Program managers and DLA logistics teams use the MX7824UQ/883B to keep legacy systems in service beyond the original component EOL date.
Recommended
Test & Measurement Instrumentation
Bench-top multimeters, oscilloscope front-end digitiser cards, and laboratory data loggers use the MX7824UQ/883B to capture four simultaneous analog channels with 2.5 us settling per channel. The on-chip track-and-hold allows synchronous sampling of multi-phase power, multi-channel audio analysis, or 4-wire sensor measurements without external SHA ICs. The MIL-STD-883 ceramic package guarantees stable operation across laboratory temperature variations and supports the long calibration intervals required for ISO/IEC 17025 accredited test labs. Engineers in calibration labs value the predictable, repeatable performance of a screened ceramic ADC over a plastic commercial-grade alternative.
Recommended
Space & Aerospace Subsystems
Satellite housekeeping, rocket engine test stand instrumentation, and unmanned-aerial-vehicle flight-control subsystems rely on the MX7824UQ/883B to digitise housekeeping telemetry such as bus voltages, temperatures, and attitude-sensor outputs. The hermetic ceramic CDIP-24 package withstands thermal cycling, vibration, and outgassing stresses encountered in launch and orbit, while the MIL-STD-883 Class B screening satisfies the Component Quality Assurance requirements of NASA and ESA payloads. The 4-channel MUX + 8-bit 2.5 us ADC combination is a compact way to monitor multiple rails without duplicating converter silicon, which lowers payload mass and power budget.
Recommended
Recommended Products Summary
Engineering reference data for MX7824UQ/883B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MAX154CWN | MX7828UQ/883B | MX7575SQ/883B | MX7575TQ/883B |
|---|---|---|---|---|---|
| Brand | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated |
| Package | CDIP-24 / 883B ceramic | PDIP-24 (commercial) | CDIP-24 / 883B ceramic (same) | CDIP-24 / 883B ceramic (same) | CDIP-24 / 883B ceramic (same) |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit [verify] | 8 bit [verify] |
| MIL-STD-883 /883B Screening | Yes (Class B) | No (commercial plastic) | Yes (Class B) | Yes (Class B) | Yes (Class B) |
| Operating Temperature Range | -55C to +125C | 0C to +70C (commercial) | -55C to +125C | -55C to +125C (assumed /883B) | -55C to +125C (assumed /883B) |
Key Differentiators
- MIL-STD-883 Class B screening in ceramic CDIP-24 (vs MAX154CWN)
- On-chip 4-channel analog multiplexer (vs MX7575SQ/883B / MX7575TQ/883B)
- 8-bit half-flash architecture with on-chip T/H (vs Successive-approximation ADCs (e.g., MAX174))
Design Notes
Estimated: a 24-CDIP through-hole ADC with 2.5 us conversion time typically draws a few mA of supply current; assuming ~10 mA at +5 V analog VDD plus ~5 mA on the digital supply, total dissipation is roughly 75 mW. Place a 1 uF tantalum plus 0.1 uF ceramic decoupling capacitor on each VDD pin, located within 5 mm of the package lead, to suppress the transient current spikes that the half-flash architecture draws at the start of each conversion. Sharing analog and digital VDD without proper decoupling is a common cause of degraded SNR and channel-to-channel crosstalk.
Route analog input traces as guard-ringed microstrip with a continuous analog ground plane on the layer beneath the IC; the 8-bit, 2.5 us conversion easily resolves ground-bounce errors of 50-100 mV, so a 4-layer board with split analog/digital ground is strongly recommended for the CDIP-24 through-hole form factor. Keep digital output bus traces (DB0-DB7) at least 5 mm from analog input pins, and place the 2.5 V reference bypass capacitor (typically 1 uF ceramic) directly between VREF and AGND to minimise reference-noise coupling into the conversion result.
Three recurring design pitfalls with the MX7824UQ/883B: (1) connecting the chip-select line directly to logic-high without consideration of the asynchronous read-mode timing causes the bus to drive simultaneously with WR and RD strobes - check the datasheet read-cycle timing diagram. (2) Using the internal 2.5 V reference without external buffering is OK for 8-bit accuracy but introduces ~10 mV drift over temperature for 12-bit-style demands - swap in an external REF02 or MAX872 for absolute-accuracy. (3) Driving the analog inputs beyond VREF or below AGND latches up the input multiplexer; add external Schottky clamp diodes or a TVS to GND on each input pin if the source impedance is high or transient is possible.
For the through-hole CDIP-24 ceramic package, use a 600 mil (15.24 mm) row spacing PCB land pattern with 0.6 mm drill and 1.0 mm pad diameter; the package body is 32 mm long (max) and the row span is 7.62 mm (0.3 in). Reserve a keep-out of 6 mm below the ceramic body to allow for the windowed-die variant if /883B visual inspection is required. Use a socket (e.g., 24-pin DIP machined-pin socket) during prototype bring-up so the ADC can be lifted for failure analysis - the hermetic package is field-replaceable but not hand-solder-friendly on production boards.
Compliance Information
MIL-STD-883 Class B screening applies; RoHS non-compliance reflects the typical Sn/Pb lead finish on the hermetic ceramic CDIP package used for /883B-grade parts. AEC-Q100 not applicable (this is a military-grade ADC, not an automotive-qualified part).
