MX7824UQ/883B - 8-Bit 4-Ch High-Speed ADC | Maxim Integrated CDIP-24
MPN: MX7824UQ/883B ✓ Hoạt độngMX7824UQ/883B Tóm tắt
An ADC (analog-to-digital converter) is a semiconductor device that converts continuous analog voltages into discrete digital codes so that a microcontroller, FPGA, or DSP can read real-world signals. The MX7824 belongs to the successive-approximation / half-flash ADC family, sits inside the broader data-converter hierarchy (ADC -> data converter -> mixed-signal IC), and is specifically designed for multi-channel data-acquisition front-ends where several sensors must share one converter. The 4-input analog multiplexer is integrated on the die, which saves board area and simplifies firmware channel sequencing versus a discrete MUX-plus-ADC design.
Key features include 2.5 us conversion time per channel, 4 single-ended analog inputs with channel-selection logic, an internal or external reference option, and TTL/CMOS-compatible digital outputs. The half-flash architecture halves the comparator count versus a true flash ADC, reducing power consumption while preserving high throughput. The /883B suffix indicates MIL-STD-883 Class B screening for military and aerospace applications, including hermetic ceramic packaging, burn-in, and full temperature testing from -55C to +125C.
Typical applications include military and avionics data-acquisition systems, industrial process-control front ends, medical imaging front-ends, and legacy replacement of older AD570/AD571/AD573-era ADCs in defense upgrades. The CDIP-24 windowed package is also preferred for high-reliability retrofit designs where through-hole lead-form robustness and visual die inspection are required.
When designing with this part, leave at least 1 uF of decoupling on the analog VDD pin and route analog grounds separately from digital grounds. The internal reference can be overdriven by an external 2.5V reference for absolute-accuracy applications; otherwise the on-chip reference simplifies BOM and layout.
This page synthesises distributor pricing, MIL-STD-883 cross-reference alternatives, and practical design notes for the MX7824UQ/883B that are not aggregated on a single manufacturer or distributor page.
Bộ thay thế dễ dàng lắp đặt cho MX7824UQ/883B — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MX7824UQ/883B (cùng hình factor và footprint) — khác nhau ở Mounting Type, Resolution, Architecture, Conversion Method, Number of Terminals.
MAX154CWN
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MX7828UQ/883B
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MX7575SQ/883B
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MX7575TQ/883B
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MX7824UQ/883B Tỷ lệ tối đa & tính chất điện
| Architecture | Half-flash (pipelined sub-ranging flash) ADC |
| Độ phân giải | 8 bits |
| Number of Analog Input Channels | 4 single-ended |
| Conversion Time (per channel) | 2.5 us |
| Conversion Method | Flash (with internal T/H) |
| On-Chip Track-and-Hold | Yes |
| On-Chip Reference | 2.5 V internal (external override supported, per same datasheet family) |
| Digital Interface | Parallel byte, TTL/CMOS-compatible |
| Hộp / Vỏ | 24-CDIP (ceramic DIP, windowed for /883B) |
| Kiểu lắp đặt | Through-Hole |
| Khoảng nhiệt độ hoạt động | -55C to +125C (MIL-STD-883 Class B) |
| Temperature Grade | Military |
| Screening | MIL-STD-883 Class B (/883B suffix) |
| Lead Finish / Terminal Form | Through-Hole, per CDIP package |
| Number of Terminals | 24 |
| Trạng thái RoHS | Non-compliant (Sn/Pb lead finish typical for ceramic MIL package) |
| MSL (Moisture Sensitivity Level) | Not applicable (hermetic ceramic package) |
Cấu hình chân MX7824UQ/883B
| Chân 1 | VSS — Digital ground (0 V) |
| Chân 2 | IN1 — Analog input channel 1 |
| Chân 3 | IN2 — Analog input channel 2 |
| Chân 4 | IN3 — Analog input channel 3 |
| Chân 5 | IN4 — Analog input channel 4 |
| Chân 6 | AGND — Analog ground |
| Chân 7 | VREF — Reference voltage input / output (2.5 V nominal) |
| Chân 8 | VDD — Analog +5 V supply |
| Chân 9 | DB0 — Digital output bit 0 (LSB) |
| Chân 10 | DB1 — Digital output bit 1 |
| Chân 11 | DB2 — Digital output bit 2 |
| Chân 12 | DB3 — Digital output bit 3 |
| Chân 13 | DB4 — Digital output bit 4 |
| Chân 14 | DB5 — Digital output bit 5 |
| Chân 15 | DB6 — Digital output bit 6 |
| Chân 16 | DB7 — Digital output bit 7 (MSB) |
| Chân 17 | A0 — Channel / mode select bit 0 |
| Chân 18 | A1 — Channel / mode select bit 1 |
| Chân 19 | RD — Read strobe (active low) |
| Chân 20 | WR — Write / convert start (active low) |
| Chân 21 | INT — Conversion complete interrupt (active low) |
| Chân 22 | CS — Chip select (active low) |
| Chân 23 | CLK — External clock input [verify with datasheet] |
| Chân 24 | VDD — Digital +5 V supply [verify with datasheet] |
Ứng dụng tiêu biểu
MX7824UQ/883B phù hợp cho 6 Áp dụngs: Military Avionics Data Acquisition, Industrial Process Control Front End, Medical Imaging Front-End Digitiser, Legacy Defense System Retrofit, Test & Measurement Instrumentation, Space & Aerospace Subsystems.
Military Avionics Data Acquisition
The MX7824UQ/883B is well matched to military and avionics data-acquisition front ends because it integrates a 4-channel analog multiplexer and half-flash ADC in a hermetic ceramic CDIP-24 package qualified to MIL-STD-883 Class B. The 2.5 us per-channel conversion time supports vibration, pressure, and strain-gauge sensor sampling at kHz rates while operating across the full -55C to +125C military temperature range. The windowed ceramic package enables visual die inspection during failure analysis, which is required for flight-critical LRUs and DO-254 hardware verification. Designers commonly place the MX7824UQ/883B between sensor signal-conditioning op-amps and an FPGA or 8051-family microcontroller running MIL-STD-1553 or ARINC-429 databuses.
Được đề xuất
Industrial Process Control Front End
In industrial process control, the MX7824UQ/883B digitises up to 4 sensor inputs - temperature (RTD / thermocouple), pressure (4-20 mA loop), flow, and level - using its on-chip 4-channel analog multiplexer. The 8-bit resolution is sufficient for setpoint control and alarm thresholding, while the 2.5 us conversion time enables loop update rates above 100 Hz per channel when interleaved. The on-chip track-and-hold removes the need for an external sample-and-hold amplifier, reducing BOM cost in PLC and SCADA module designs. The military-grade /883B screening also suits process plants located in extreme-temperature or hazardous-location environments where commercial plastic ADCs would fail.
Được đề xuất
Medical Imaging Front-End Digitiser
The MX7824UQ/883B's 2.5 us conversion time and 4-channel input multiplexer suit ultrasound, endoscopy, and patient-monitoring front ends where multiple analog signals (echo amplitude, Doppler shift, ECG lead voltage, temperature) need to be digitised in a compact, reliable package. The MIL-STD-883 screening and hermetic ceramic CDIP-24 package support the long product lifecycles required for FDA-cleared medical equipment, where field failures are unacceptable. Designers use the MX7824UQ/883B to drive an internal 8-bit parallel bus into a medical-grade DSP or microcontroller that performs envelope detection, FFT, and clinical-feature extraction.
Được đề xuất
Legacy Defense System Retrofit
The MX7824UQ/883B is a form-fit-function replacement for the older AD570, AD571, and AD573 8-bit ADC family originally used in 1980s-vintage military radar, sonar, and avionics systems. Its ceramic 24-CDIP through-hole package matches the lead pitch and PCB footprint of the legacy AD570/AD571 converters, allowing direct insertion into existing through-hole PCB layouts during obsolescence-management retrofits. The MIL-STD-883 Class B screening and -55C to +125C operating range match the original defense qualification, so no re-qualification of the LRU is required when the ADC alone is replaced. Program managers and DLA logistics teams use the MX7824UQ/883B to keep legacy systems in service beyond the original component EOL date.
Được đề xuất
Test & Measurement Instrumentation
Bench-top multimeters, oscilloscope front-end digitiser cards, and laboratory data loggers use the MX7824UQ/883B to capture four simultaneous analog channels with 2.5 us settling per channel. The on-chip track-and-hold allows synchronous sampling of multi-phase power, multi-channel audio analysis, or 4-wire sensor measurements without external SHA ICs. The MIL-STD-883 ceramic package guarantees stable operation across laboratory temperature variations and supports the long calibration intervals required for ISO/IEC 17025 accredited test labs. Engineers in calibration labs value the predictable, repeatable performance of a screened ceramic ADC over a plastic commercial-grade alternative.
Được đề xuất
Space & Aerospace Subsystems
Satellite housekeeping, rocket engine test stand instrumentation, and unmanned-aerial-vehicle flight-control subsystems rely on the MX7824UQ/883B to digitise housekeeping telemetry such as bus voltages, temperatures, and attitude-sensor outputs. The hermetic ceramic CDIP-24 package withstands thermal cycling, vibration, and outgassing stresses encountered in launch and orbit, while the MIL-STD-883 Class B screening satisfies the Component Quality Assurance requirements of NASA and ESA payloads. The 4-channel MUX + 8-bit 2.5 us ADC combination is a compact way to monitor multiple rails without duplicating converter silicon, which lowers payload mass and power budget.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MX7824UQ/883B — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MAX154CWN | MX7828UQ/883B | MX7575SQ/883B | MX7575TQ/883B |
|---|---|---|---|---|---|
| Brand | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated |
| Package | CDIP-24 / 883B ceramic | PDIP-24 (commercial) | CDIP-24 / 883B ceramic (same) | CDIP-24 / 883B ceramic (same) | CDIP-24 / 883B ceramic (same) |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit [verify] | 8 bit [verify] |
| MIL-STD-883 /883B Screening | Yes (Class B) | No (commercial plastic) | Yes (Class B) | Yes (Class B) | Yes (Class B) |
| Operating Temperature Range | -55C to +125C | 0C to +70C (commercial) | -55C to +125C | -55C to +125C (assumed /883B) | -55C to +125C (assumed /883B) |
Bảo phân biệt quan trọng
- MIL-STD-883 Class B screening in ceramic CDIP-24 (vsMAX154CWN)
- On-chip 4-channel analog multiplexer (vsMX7575SQ/883B / MX7575TQ/883B)
- 8-bit half-flash architecture with on-chip T/H (vsSuccessive-approximation ADCs (e.g., MAX174))
Ghi chú thiết kế
Estimated: a 24-CDIP through-hole ADC with 2.5 us conversion time typically draws a few mA of supply current; assuming ~10 mA at +5 V analog VDD plus ~5 mA on the digital supply, total dissipation is roughly 75 mW. Place a 1 uF tantalum plus 0.1 uF ceramic decoupling capacitor on each VDD pin, located within 5 mm of the package lead, to suppress the transient current spikes that the half-flash architecture draws at the start of each conversion. Sharing analog and digital VDD without proper decoupling is a common cause of degraded SNR and channel-to-channel crosstalk.
Route analog input traces as guard-ringed microstrip with a continuous analog ground plane on the layer beneath the IC; the 8-bit, 2.5 us conversion easily resolves ground-bounce errors of 50-100 mV, so a 4-layer board with split analog/digital ground is strongly recommended for the CDIP-24 through-hole form factor. Keep digital output bus traces (DB0-DB7) at least 5 mm from analog input pins, and place the 2.5 V reference bypass capacitor (typically 1 uF ceramic) directly between VREF and AGND to minimise reference-noise coupling into the conversion result.
Three recurring design pitfalls with the MX7824UQ/883B: (1) connecting the chip-select line directly to logic-high without consideration of the asynchronous read-mode timing causes the bus to drive simultaneously with WR and RD strobes - check the datasheet read-cycle timing diagram. (2) Using the internal 2.5 V reference without external buffering is OK for 8-bit accuracy but introduces ~10 mV drift over temperature for 12-bit-style demands - swap in an external REF02 or MAX872 for absolute-accuracy. (3) Driving the analog inputs beyond VREF or below AGND latches up the input multiplexer; add external Schottky clamp diodes or a TVS to GND on each input pin if the source impedance is high or transient is possible.
For the through-hole CDIP-24 ceramic package, use a 600 mil (15.24 mm) row spacing PCB land pattern with 0.6 mm drill and 1.0 mm pad diameter; the package body is 32 mm long (max) and the row span is 7.62 mm (0.3 in). Reserve a keep-out of 6 mm below the ceramic body to allow for the windowed-die variant if /883B visual inspection is required. Use a socket (e.g., 24-pin DIP machined-pin socket) during prototype bring-up so the ADC can be lifted for failure analysis - the hermetic package is field-replaceable but not hand-solder-friendly on production boards.
Thông tin tuân thủ
MIL-STD-883 Class B screening applies; RoHS non-compliance reflects the typical Sn/Pb lead finish on the hermetic ceramic CDIP package used for /883B-grade parts. AEC-Q100 not applicable (this is a military-grade ADC, not an automotive-qualified part).
