N25Q128A13ESFA0F - 128Mb SPI NOR Flash 108MHz | Micron
MPN: N25Q128A13ESFA0F ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.9 | $39.00 |
| 100 | $3.55 | $355.00 |
| 500 | $3.2 | $1,600.00 |
| 1,000 | $2.95 | $2,950.00 |
Drop-in alternatives for N25Q128A13ESFA0F — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MT25QL128ABB8E12-0AUT
✅ Drop-In✓ In Stock
$3.62 / Unit
View Datasheet →MT25QL128ABB8ESF-0AUT
✅ Drop-In✓ In Stock
$4.02 / Unit
View Datasheet →MT25QL128ABB8ESF-0AIT
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
N25Q128A13ESFA0F Maximum Ratings & Electrical Characteristics
| Memory Type | Serial NOR Flash Memory |
| Density | 128 Mbit (16 MB) |
| Organization | 16M x 8 |
| Interface | SPI (Standard / Dual / Quad I/O) |
| Max Clock Frequency | 108 MHz |
| Supply Voltage | 3 V / 3.3 V |
| Access Time | 7 ns |
| Subsector Erase | 4 KByte (boot sectors) |
| XiP Support | Yes (Execute-In-Place) |
| Mounting Type | Surface Mount |
| Package | 16-Pin SO W (SOIC wide-body, 300 mil) |
| Packaging | Tape & Reel (T/R) |
N25Q128A13ESFA0F 16-pin so w (soic wide-body, 300 mil) Pin Configuration Guide
Complete pinout information for N25Q128A13ESFA0F (16-pin so w (soic wide-body, 300 mil) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for N25Q128A13ESFA0F.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
N25Q128A13ESFA0F is suitable for 6 applications: FPGA Configuration Storage, Embedded Processor Boot Flash, Networking and Telecom Equipment, Industrial Automation Controllers, Consumer Electronics Firmware Storage, Automotive and Rugged Electronics.
FPGA Configuration Storage
The N25Q128A13ESFA0F stores FPGA bitstreams where its 128 Mbit density and quad-I/O 108 MHz interface shorten configuration time substantially. A quad-I/O read at 108 MHz delivers roughly four times the bandwidth of legacy single-bit SPI at the same clock, which cuts configuration latency for large devices. The XiP-enabled array also permits direct memory-mapped access in some processor-attached flows. Placed on the dedicated FPGA configuration bank with 10K-100K pull-ups on CS# and DQ3, the part handles power-on bitstream loads reliably; verify vendor-specific configuration opcode support in your platform loader before release.
Recommended
Embedded Processor Boot Flash
As boot memory for ARM Cortex-class SoCs and MCUs, the N25Q128A13ESFA0F provides XiP execution so the processor can fetch code directly from the flash array without a full shadow-to-RAM step, reducing boot latency and RAM cost. The single 3V supply matches typical embedded I/O rails, eliminating level shifters. The 4-Kbyte subsector erase lets firmware reserve small parameter blocks that can be rewritten without erasing the whole device. Designers should confirm the bootloader recognizes the Micron JEDEC ID, or update it when migrating to the MT25Q generation, since ID bytes differ between families.
Recommended
Networking and Telecom Equipment
Routers, switches, and line cards use the N25Q128A13ESFA0F for BIOS, firmware images, and configuration data. The 16 MB capacity holds multiple firmware images plus a factory-default fallback image, supporting safe dual-image update schemes. Quad SPI at 108 MHz accelerates firmware decompression at power-up, and the 4-Kbyte boot subsectors isolate per-port configuration tables. The wide-body SOIC handles the extended temperature environment of telecom closets when the appropriate grade is selected. Layout practice: keep the flash close to the host CPU and route the four data lines as a matched quad group for signal integrity at 108 MHz.
Recommended
Industrial Automation Controllers
PLCs, motor drives, and factory sensors use serial NOR flash for firmware and recipe storage. The N25Q128A13ESFA0F's 3V operation integrates with standard industrial logic rails, and its fine 4-Kbyte erase granularity supports frequent logging of process parameters without wearing the entire array. Quad-I/O mode shortens the code-fetch time of RTOS-based control loops, contributing to deterministic startup. In electrically noisy panels, place the flash within 50 mm of the host controller, use series termination on SCLK, and verify HOLD#/DQ3 is actively driven in quad mode, since leaving it floating corrupts quad reads.
Recommended
Consumer Electronics Firmware Storage
Set-top boxes, smart displays, and appliances boot from the N25Q128A13ESFA0F, where its 16 MB capacity accommodates compressed Linux images plus OTA update staging. The XiP feature allows memory-mapped execution during early boot before code is copied to DDR, and quad-SPI 108 MHz reads keep decompression time acceptable to users. The wide-body SOIC is hand-solderable for service and rework, an advantage over fine-pitch BGA boot flash. Tape-and-reel packaging suits high-volume SMT assembly. Cost-sensitive designs should compare current N25Q versus MT25QL128 pricing, as generation transition often shifts the price crossover.
Recommended
Automotive and Rugged Electronics
For telematics units, dashboard controllers, and rugged data loggers, the N25Q128A13ESFA0F family (and its AUT-grade MT25QL128ABB8ESF-0AUT drop-in) provides code and calibration storage on the 3V rail common to automotive microcontrollers. The 4-Kbyte subsectors isolate CAN calibration tables that are rewritten in the field, extending array life. The SOIC-W package tolerates vibration better than fine-pitch alternatives and simplifies inspection. Designs targeting AEC-Q100 programs should specify the AUT-qualified MT25QL128 variant, which shares the footprint, so no PCB redesign is needed when hardening an existing N25Q design.
Recommended
Recommended Products Summary
Engineering reference data for N25Q128A13ESFA0F — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT25QL128ABB8E12-0AUT | MT25QL128ABB8ESF-0AUT | MT25QL128ABB8ESF-0AIT |
|---|---|---|---|---|
| Package | 16-SO W (300 mil) | 16-SO W (300 mil) - same footprint | 16-SO W (300 mil) - same footprint | 16-SO W (300 mil) - same footprint |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 128 Mbit (16 MB) | 128 Mbit | 128 Mbit | 128 Mbit |
| Supply Voltage | 3 V / 3.3 V | 3 V (QL type) | 3 V (QL type) | 3 V (QL type) |
| Max Clock Frequency | 108 MHz | 108 MHz | 108 MHz | 108 MHz |
| Subsector Erase | 4 KByte | 4 KByte | 4 KByte | 4 KByte |
| XiP Support | Yes | Yes | Yes | Yes |
| Temperature Grade | [DATA_NEEDED] | Industrial (-40C to +85C) | Automotive grade (AUT) | Industrial (-40C to +85C) |
Key Differentiators
- 16-pin wide-body SOIC footprint (vs W25Q128JV (Winbond))
- XiP-enabled quad I/O at 108 MHz (vs MT25QL128ABB8E12-0AUT)
- 4-Kbyte boot subsector erase (vs MT25QL128ABB8ESF-0AUT)
Design Notes
When operating quad-I/O reads at the full 108 MHz clock, treat DQ0-DQ3 as a matched bus: route the four data lines as a length-matched group and keep SCLK to CS# skew small. Hold the HOLD#/DQ3 line actively driven in quad mode - it becomes an active data pin, and a floating or weakly pulled pin corrupts quad reads. Series termination (22-33 ohm) on SCLK at the driver reduces ringing on multi-inch traces common in networking line cards.
The N25Q package suffix matters: ESF is the 16-pin SO wide body, while other suffixes (e.g. ESE) map to 8-pad packages with entirely different footprints. Second, when replacing N25Q128A13 with the MT25Q generation, update bootloader JEDEC ID checks - MT25Q reports a different manufacturer/device ID and some strict loaders refuse to initialize. Third, verify quad-mode opcodes your host uses; command sets are highly but not perfectly compatible across generations.
Decouple VCC with a 100 nF ceramic capacitor placed within 3 mm of the supply pin, plus a 4.7-10 uF bulk capacitor per flash bank. Connect the wide-body SOIC thermal land and exposed copper to a solid ground pour to reduce ground bounce during erase operations, which draw the highest transient currents. Avoid routing the SPI quad group across plane splits; if unavoidable, stitch with ground vias adjacent to the crossing.
Estimated: erase/program operations draw peak currents well above typical read current on serial NOR flash; budget the 3.3V rail with headroom and verify regulator transient response during chip-erase, which can last tens of seconds at elevated average current. Sequence the 3V rail with the host I/O rail or use bus-hold/pull-downs on CS# so the flash does not see an unterminated clocked input while unpowered.
Compliance Information
Compliance status not stated in the provided web data. Consult the Micron product page for the current RoHS/REACH declarations for N25Q128A13ESFA0F.
