PC28F640P30BF65B-TR - 64Mb Parallel NOR Flash, 52MHz | Micron
MPN: PC28F640P30BF65B-TR ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.75 | $37.50 |
| 100 | $3.3 | $330.00 |
| 500 | $2.85 | $1,425.00 |
| 1,000 | $2.55 | $2,550.00 |
PC28F640P30BF65B-TR Overview
A NOR Flash (Not-OR, technically "Not AND" wired-OR array) is a non-volatile memory class that supports random read access at byte or word granularity and executes code directly from the array (execute-in-place, XIP). This positions NOR above serial NOR for high-bandwidth or random-latency-sensitive workloads such as boot ROM, FPGA configuration shadowing, and embedded firmware storage. NOR sits within the broader hierarchy: NOR Flash -> parallel NOR -> non-volatile memory -> memory ICs -> semiconductors.
Key features include 64 Mb density, a bottom-boot 128-KB uniform plus 4-KB parameter block architecture, 52 MHz synchronous burst reads, and individual block locking with a one-time programmable (OTP) security region. The device supports a hardware RESET# pin plus a RST# configuration input, WP#/ACC high-voltage protection/unprotect, and configurable read-array, read-ID, read-status, erase, and program command sets.
The P30 architecture implements a multiplexed Address/Status/Command interface on DQ[15:0] with separate chip-enable (CE#), output-enable (OE#), and write-enable (WE#) controls, plus a synchronous burst pin group (AVD#, ADV#, CLK, WAIT). Block erase and word program operations typically complete in 0.4 s and 100 us respectively, with a 100K endurance rating per block.
Typical applications include networking line-card boot, industrial controller firmware storage, automotive infotainment boot ROM, point-of-sale terminals, printer firmware, and any embedded system requiring execute-in-place with deterministic read latency. The 64-ball EasyBGA footprint also suits small-form-factor PCB designs.
When designing with this device, place VCC and VCCQ decoupling (0.1 uF and 1 uF ceramic) within 5 mm of the package balls, keep CE# transitions clean during burst reads, and avoid long parallel bus stubs above 50 mm to preserve the 52 MHz timing margin.
This page synthesizes distributor stock, pricing tiers, drop-in alternatives, and design notes to complement the manufacturer datasheet.
Drop-in alternatives for PC28F640P30BF65B-TR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PC28F640P30BF65B-TR (same form factor and footprint) — differing in Memory Type, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PC28F640P30BF65B
✅ Drop-In✓ In Stock
$5.03 / Unit
View Datasheet →PC28F640P30BF65A
✅ Drop-In📋 Reference alternative (not in catalog)
RC28F640P30BF65A
✅ Drop-In📋 Reference alternative (not in catalog)
PC28F640P30TF65B-TR
✅ Drop-In📋 Reference alternative (not in catalog)
PC28F640P30BF65B
✅ Drop-In✓ In Stock
$5.03 / Unit
View Datasheet →PC28F640P30BF65B-TR Maximum Ratings & Electrical Characteristics
| Density | 64 Mbit (4M x 16) |
| Memory Type | Non-Volatile Flash (NOR) |
| Process Technology | P30-65nm Axcell |
| Boot Block Location | Bottom |
| Architecture | 128 KB uniform blocks + 4 KB parameter blocks |
| VCC (Core) Range | 1.7 V to 2.0 V |
| VCCQ (I/O) Range | 1.7 V to 3.6 V |
| Interface | Parallel (asynchronous + synchronous burst) |
| Synchronous Burst Frequency | 52 MHz |
| Asynchronous Access Time | 65 ns (75 ns in some datasheet revisions) |
| Package | 64-ball EasyBGA (10x13 mm) |
| Operating Temperature | -40 C to +85 C |
| Block Erase Time (typ.) | 0.4 s |
| Word Program Time (typ.) | 100 us |
| Endurance (per block) | 100,000 cycles |
| Data Retention | 20 years (typical) |
| Compliance | RoHS |
PC28F640P30BF65B-TR 64-ball easybga (10x13 mm) Pin Configuration Guide
Pin configuration for PC28F640P30BF65B-TR (64-ball easybga (10x13 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PC28F640P30BF65B-TR.
Refer to the datasheet for full pin configuration.
Typical Applications
PC28F640P30BF65B-TR is suitable for 6 applications: Industrial Controller Boot Storage, Networking Line-Card Firmware, Automotive Infotainment Boot ROM, POS and Retail Terminal Firmware, Printer and Office Imaging Firmware, FPGA Configuration Shadow Memory.
Industrial Controller Boot Storage
The PC28F640P30BF65B-TR fits industrial controller boot storage thanks to its 64 Mbit (4M x 16) density, deterministic 65 ns asynchronous access, and bottom-boot 4 KB parameter blocks for frequent-write configuration storage at the low-address region. The 52 MHz synchronous burst interface allows direct execute-in-place (XIP) of controller firmware at boot, removing the need for a separate boot-loader SDRAM copy. The -40 C to +85 C industrial temperature range and 100,000-cycle block endurance comfortably handle decades of PLC firmware updates on the factory floor.
Recommended
Networking Line-Card Firmware
In networking line cards, the PC28F640P30BF65B-TR stores router firmware, FPGA bit-stream shadows, and bootloader images. Its 1.7-2.0 V VCC and 1.7-3.6 V VCCQ split rails interface naturally with 1.8 V PHY/MAC cores while driving 3.3 V bus multiplexers. The 52 MHz synchronous burst delivers up to 104 MB/s read throughput, which is sufficient to shadow a 32 MB FPGA bitstream in roughly 300 ms during field upgrade. Hardware RESET# and WP#/ACC pins support field-recovery modes where a remote operator can force a rollback to factory image.
Recommended
Automotive Infotainment Boot ROM
Automotive infotainment head units benefit from the PC28F640P30BF65B-TR's 64 Mbit density, which is enough for the HMI operating system kernel and 30-40 MB of cold-boot assets. The EasyBGA 10x13 mm package occupies minimal PCB real estate behind the radio module. While the part is rated -40 C to +85 C (industrial-grade, not AEC-Q100), Alliance Memory manufactures the same die under license for second-source security of supply. Designers should verify that downstream head-unit AEC-Q100 requirements are met by the specific lot, or upgrade to a Q100-qualified variant if available.
Recommended
POS and Retail Terminal Firmware
Point-of-sale terminals, handheld scanners, and receipt printers rely on small-footprint parallel NOR for fast deterministic boot. The PC28F640P30BF65B-TR provides 64 Mbit in a 64-ball EasyBGA footprint that fits beneath a BGA-constrained main PCB. Synchronous burst reads let the terminal reach its payment-ready state in well under 1 second from power-on, a critical UX metric in retail. Bottom-boot parameter blocks (4 KB at the lowest addresses) let terminal managers push configuration tables (tax tables, store IDs) without disturbing the main OS image block.
Recommended
Printer and Office Imaging Firmware
Office printers need fast, deterministic firmware boot to reduce first-page-out time, and the PC28F640P30BF65B-TR's 52 MHz burst reads give the engine controller immediate access to font tables, raster image processors, and rendering macros. The 4 KB parameter blocks at the bottom of the address map provide protected storage for toner-yield counters and calibration constants that update frequently during the printer's lifetime. Industrial temperature tolerance supports operation in warm engine compartments that run continuously.
Recommended
FPGA Configuration Shadow Memory
Mid-range FPGAs require 32-128 Mbit of non-volatile configuration storage, and the PC28F640P30BF65B-TR fits the lower-density end of this application. The device supports fast parallel loads to the FPGA's mode pins (Slave Parallel), reducing configuration time versus serial NOR. A second PC28F640P30BF65B-TR can be added to provide dual-image fallback for field-upgrade safety, with the FPGA's logic selecting which bank to load from. Hardware RESET# and WP# pins allow in-system protection against accidental writes during reconfig.
Recommended
Recommended Products Summary
Engineering reference data for PC28F640P30BF65B-TR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PC28F640P30BF65B | PC28F640P30BF65A | RC28F640P30BF65A | PC28F640P30TF65B-TR | PC28F640P30BF65B |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Alliance Memory |
| Package | 64-ball EasyBGA (10x13 mm) | 64-ball EasyBGA (10x13 mm) | 64-ball EasyBGA (10x13 mm) | 64-ball EasyBGA (10x13 mm) | 64-ball EasyBGA (10x13 mm) | 64-ball EasyBGA (10x13 mm) |
| Density | 64 Mbit (4M x 16) | 64 Mbit (4M x 16) | 64 Mbit (4M x 16) | 64 Mbit (4M x 16) | 64 Mbit (4M x 16) | 64 Mbit (4M x 16) |
| Boot Block Location | Bottom | Bottom | Bottom | Bottom | Top | Bottom |
| Synchronous Burst Frequency | 52 MHz | 52 MHz | 52 MHz | 52 MHz | 52 MHz | 52 MHz |
| Asynchronous Access Time | 65 ns | 65 ns | 65 ns | 65 ns | 65 ns | 65 ns |
| VCC (Core) Range | 1.7 V to 2.0 V | 1.7 V to 2.0 V | 1.7 V to 2.0 V | 1.7 V to 2.0 V | 1.7 V to 2.0 V | 1.7 V to 2.0 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Lifecycle Status | NRND (Micron original) | NRND | NRND | NRND | NRND | Active (Alliance Memory second-source) |
Key Differentiators
- Second-source availability under Alliance Memory license (vs PC28F640P30BF65B (Alliance Memory))
- Reel packaging variant for SMT production (vs PC28F640P30BF65B (Tray))
- Bottom-boot block layout for parameter-block-intensive firmware (vs PC28F640P30TF65B-TR)
Design Notes
Estimated: Place one 0.1 uF X7R ceramic decoupling capacitor within 5 mm of each VCC (A1 region) and VCCQ (B1 region) ball, plus a single 4.7 uF bulk tantalum or ceramic on each rail. BGA balls have low inherent inductance, but multiple parallel capacitors are still recommended to handle synchronous-burst current spikes (up to ~30 mA transient during burst reads).
Keep the CE#, OE#, WE# traces short and matched (within 5 mm) to preserve the 65 ns asynchronous timing margin at room temperature. Avoid placing the EasyBGA more than 50 mm away from the host controller; longer stubs cause ringing on the synchronous burst clock and may force the host to drop to 40 MHz burst. Use a 4-layer PCB with a continuous ground plane beneath the BGA for the best signal-integrity margin.
Do not assert WP#/ACC above VHWH (typically 9 V) unless intentionally unlocking the device - the high-voltage unlock can erase security bits if the wrong sequence is sent. After any program or erase operation, issue the Read Status Register command and poll bit 7 (SR[7]) before returning to Read Array, or the data bus will present the status byte instead of array data. Always issue the Reset command before any power-down to place the flash in standby and avoid in-flight write corruption.
Compliance Information
Industrial-grade (-40 C to +85 C). AEC-Q100 status not qualified for this specific MPN; verify with Micron for automotive-grade alternatives if required.
