PIC18F2580-E/ML - 8-bit MCU, 32KB Flash, ECAN, 28-QFN | Microchip
MPN: PIC18F2580-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.19 | $10.19 |
| 10 | $9.18 | $91.80 |
| 100 | $8.05 | $805.00 |
| 500 | $7.2 | $3,600.00 |
| 1,000 | $6.5 | $6,500.00 |
PIC18F2580-E/ML Overview
Key features include a maximum CPU clock speed of 40 MHz (10 MIPS instruction throughput), 25 general-purpose digital I/O pins, and a 4.2 V to 5.5 V supply voltage range. The PIC18F2580 belongs to Microchip's PIC18F2480/2580/4480/4580 family, which adds an ECAN controller (compliant with CAN 2.0B active) on top of the standard PIC18 peripheral set. Compared to non-ECAN PIC18F2x20/2x21 devices, the ECAN module is the principal differentiator for automotive and industrial node communications.
The device uses Microchip's nanoWatt Technology for power-conscious designs, offering idle, sleep, and run modes with controlled clock switching to minimize current consumption. The 10-bit A/D converter provides up to 8 input channels (depending on package), supporting both single-ended and differential conversions. Peripherals also include two capture/compare/PWM (ECCP) modules, a USART with LIN support, an MSSP for SPI and I2C, two analog comparators, and a hardware real-time clock counter.
Typical applications include CAN-based automotive body and chassis networks, industrial CANopen and DeviceNet nodes, sensor and actuator interfacing, building automation nodes, and embedded control requiring deterministic serial communication. The wide 5 V supply range aligns with industrial 24 V systems after regulator stepping, and the small 6x6 mm QFN footprint enables compact module designs where board space is constrained.
When designing with this part, ensure the exposed pad of the QFN package is soldered to a sufficiently large copper pour for thermal dissipation, because all QFN ground and thermal connections route through it. Verify CAN bus termination (120 ohm) at both ends of the bus and use a CAN transceiver such as MCP2551 or TJA1050 between the ECAN pins and the physical bus. The 'E' suffix indicates the extended industrial temperature grade (-40C to +125C).
This page synthesizes distributor pricing, drop-in alternatives drawn from the same PIC18F2x80 family and competitor QFN-28 microcontrollers, and practical design notes that go beyond the manufacturer datasheet to help hardware engineers shorten integration time.
Drop-in alternatives for PIC18F2580-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F2580-E/ML (same form factor and footprint) — differing in Core Architecture, Package, Timers, ADC, CAN Module.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F2580-I/ML
✅ Drop-In✓ In Stock
$4.31 / Unit
View Datasheet →PIC18F2580T-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F2480-E/ML
✅ Drop-In✓ In Stock
$4.15 / Unit
View Datasheet →PIC18F2480T-I/ML
✅ Drop-In✓ In Stock
$4.85 / Unit
View Datasheet →PIC18F2585-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC18F2680-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC18F2580-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC18, 8-bit |
| Program Memory (Flash) | 32 KB |
| Data Memory (SRAM) | 1536 bytes |
| EEPROM | 256 bytes |
| Maximum CPU Clock | 40 MHz (10 MIPS) |
| Supply Voltage (Vdd) | 4.2 V to 5.5 V |
| I/O Pins | 25 |
| A/D Converter | 10-bit, up to 8 channels (package dependent) |
| CAN Module | ECAN (CAN 2.0B active), 1 channel |
| Communication Peripherals | 1x USART (LIN), 1x MSSP (SPI/I2C) |
| PWM / CCP | 2x ECCP (Enhanced Capture/Compare/PWM) |
| Analog Comparators | 2 |
| Timers | 1x 8-bit, 3x 16-bit |
| Package | 28-pin QFN (ML) 6x6 mm with exposed pad |
| Operating Temperature (E suffix) | -40C to +125C (extended industrial) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| Power-Saving Modes | nanoWatt Technology: Run, Idle, Sleep, deep Sleep |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Lead-Free (per Microchip product page) |
PIC18F2580-E/ML Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input, active-low |
| Pin 2 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| Pin 3 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| Pin 4 | RA2/AN2/VREF- — Digital I/O / Analog input channel 2 / A/D negative reference |
| Pin 5 | RA3/AN3/VREF+ — Digital I/O / Analog input channel 3 / A/D positive reference |
| Pin 6 | RA4/T0CKI — Digital I/O / Timer0 clock input |
| Pin 7 | RA5/AN4 — Digital I/O / Analog input channel 4 |
| Pin 8 | Vss — Ground reference |
| Pin 9 | OSC1/CLKIN — Crystal oscillator input / external clock input |
| Pin 10 | OSC2/CLKOUT — Crystal oscillator output / clock output |
| Pin 11 | RC0/T1OSO — Digital I/O / Timer1 oscillator output |
| Pin 12 | RC1/T1OSI — Digital I/O / Timer1 oscillator input |
| Pin 13 | RC2/CCP1 — Digital I/O / Capture/Compare/PWM 1 output |
| Pin 14 | RC3 — Digital I/O |
| Pin 15 | RC4 — Digital I/O |
| Pin 16 | RC5 — Digital I/O |
| Pin 17 | RC6/TX/CK — USART transmit / I2C clock |
| Pin 18 | RC7/RX/DT — USART receive / I2C data |
| Pin 19 | Vss — Ground reference |
| Pin 20 | Vdd — Positive supply voltage (4.2 V to 5.5 V) |
| Pin 21 | RB0/INT0 — Digital I/O / External interrupt 0 |
| Pin 22 | RB1/INT1 — Digital I/O / External interrupt 1 |
| Pin 23 | RB2 — Digital I/O |
| Pin 24 | RB3 — Digital I/O |
| Pin 25 | RB4 — Digital I/O |
| Pin 26 | RB5 — Digital I/O |
| Pin 27 | RB6/PGC — Digital I/O / In-circuit debugger clock |
| Pin 28 | RB7/PGD — Digital I/O / In-circuit debugger data |
| Pin 29 | EP — Exposed thermal pad - must be soldered to ground for thermal dissipation |
Typical Applications
PIC18F2580-E/ML is suitable for 6 applications: Automotive CAN Bus Nodes, Industrial CANopen / DeviceNet Modules, Building Automation Sensor Nodes, Medical Diagnostic Device Communication, Sensor and Actuator Interfaces with PWM Control, Embedded Data Acquisition Modules.
Automotive CAN Bus Nodes
The PIC18F2580-E/ML's integrated ECAN controller (CAN 2.0B active) makes it a natural fit for automotive body and chassis network nodes such as lighting controllers, mirror adjusters, and HVAC modules. The 25 I/O pins and 10-bit A/D converter handle typical automotive sensor interfaces including temperature, position, and current sensing, while the extended -40C to +125C temperature grade meets under-hood and cabin requirements. Pairing the MCU with an MCP2551 high-speed CAN transceiver delivers a complete physical-layer node. The 32 KB Flash accommodates OSEK/OSEKtime-style or AUTOSAR-lite CAN stacks, and the 1536-byte SRAM handles message buffering.
Recommended
Industrial CANopen / DeviceNet Modules
Industrial control networks built on CANopen (CiA 401/402/404) and DeviceNet rely on the PIC18F2580-E/ML's ECAN hardware acceleration for real-time deterministic messaging. The 40 MHz / 10 MIPS core runs CANopen stack layers without throughput bottlenecks, while the 10-bit A/D supports analog sensor inputs for pressure, level, or vibration monitoring. The wide 4.2 V to 5.5 V supply range accommodates 5 V regulated rails from industrial 24 V bus systems, and the QFN-28 (ML) 6x6 mm footprint fits in compact DIN-rail-mounted modules.
Recommended
Building Automation Sensor Nodes
Building automation systems that wire lighting, HVAC, and access-control sensors over BACnet, KNX, or proprietary CAN-based fieldbuses leverage the PIC18F2580-E/ML's combination of ECAN, ADC, and PWM. The nanoWatt Technology sleep modes drop current consumption during idle intervals between transmissions, extending battery or harvested-energy operation for wireless bridge nodes. The 2x ECCP modules drive LED dimmers or small motor controllers, while the hardware real-time clock counter supports time-stamped event logging on a building automation backbone.
Recommended
Medical Diagnostic Device Communication
Distributed medical diagnostic systems use CAN-bus backbones for inter-module communication, and the PIC18F2580-E/ML's ECAN and 10-bit A/D support this application. The MCU's 10-bit ADC accommodates signal conditioning of physiological sensors such as thermistors, photodiodes, or pressure transducers in patient monitors or laboratory analyzers. The 32 KB Flash hosts the CANopen medical-device profile stacks, and the extended industrial temperature grade supports clinical environments with stable thermal characteristics. Compliance with IEC 60601 series requirements is the system integrator's responsibility.
Recommended
Sensor and Actuator Interfaces with PWM Control
Beyond CAN networking, the PIC18F2580-E/ML's dual Enhanced Capture/Compare/PWM (ECCP) modules plus three additional 16-bit timers drive stepper motors, DC motors, and servo actuators in industrial control. The 10-bit A/D with up to 8 input channels reads analog feedback signals from current-sense amplifiers, position encoders, or strain-gauge bridges, while the USART/MSSP peripherals connect to serial sensors or external displays. The 256-byte EEPROM stores calibration coefficients without external memory, reducing BOM cost for closed-loop control systems.
Recommended
Embedded Data Acquisition Modules
The PIC18F2580-E/ML's 10-bit ADC, ECAN, and USART make it a strong fit for distributed data-acquisition modules that report sensor readings to a central controller over CAN or RS-485 (via USART). The 1536-byte SRAM buffers acquired samples between transmissions, while the 256-byte EEPROM logs non-volatile calibration data and module identity. With nanoWatt Technology, idle modules consume minimal current until polled. The QFN-28 (ML) 6x6 mm footprint is ideal for compact sensor-head designs where PCB area is at a premium.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F2580-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F2580-I/ML | PIC18F2580T-E/ML | PIC18F2480-E/ML | PIC18F2585-E/ML | PIC18F2680-E/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-28 (ML) 6x6 mm | QFN-28 (ML) 6x6 mm - same | QFN-28 (ML) 6x6 mm - same | QFN-28 (ML) 6x6 mm - same | QFN-28 (ML) 6x6 mm - same | QFN-28 (ML) 6x6 mm - same |
| Program Memory (Flash) | 32 KB | 32 KB | 32 KB | 16 KB (-50%) | 48 KB (+50%) | 64 KB (+100%) |
| SRAM | 1536 bytes | 1536 bytes | 1536 bytes | 1536 bytes | 3328 bytes | 3328 bytes |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Maximum CPU Clock | 40 MHz (10 MIPS) | 40 MHz (10 MIPS) | 40 MHz (10 MIPS) | 40 MHz (10 MIPS) | 40 MHz (10 MIPS) | 40 MHz (10 MIPS) |
| CAN Module | ECAN (CAN 2.0B active), 1 channel | ECAN (CAN 2.0B active), 1 channel | ECAN (CAN 2.0B active), 1 channel | ECAN (CAN 2.0B active), 1 channel | ECAN (CAN 2.0B active), 1 channel | ECAN (CAN 2.0B active), 1 channel |
| A/D Converter | 10-bit, 8 channels | 10-bit, 8 channels | 10-bit, 8 channels | 10-bit, 8 channels | 10-bit, 8 channels | 10-bit, 8 channels |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| I/O Pins | 25 | 25 | 25 | 25 | 25 | 25 |
Key Differentiators
- Integrated ECAN controller without external bus controller (vs PIC18F2520-E/ML)
- Extended industrial temperature grade for harsh environments (vs PIC18F2580-I/ML)
- Larger Flash memory with same QFN-28 footprint (vs PIC18F2480-E/ML)
Design Notes
Estimated: the PIC18F2580-E/ML QFN-28 (ML) 6x6 mm package dissipates heat through the exposed thermal pad (EP, pin 29), which must be soldered to a ground-connected copper pour of at least 25 mm^2 to keep junction temperature within the -40C to +125C operating range. At full 40 MHz operation and 5 V Vdd with all peripherals active, typical I_dd is approximately 15-25 mA; using nanoWatt sleep modes reduces this to under 1 uA. For an accurate thermal analysis, Microchip's PIC18F2480/2580 family datasheet provides theta_JA values for various copper-pour sizes.
Place a 100 nF decoupling capacitor as close as possible to Vdd pins 11 and 28, with trace length under 5 mm. Add a bulk 10 uF tantalum or ceramic capacitor on the same Vdd rail. For CAN bus applications, place MCP2551 or TJA1050 transceiver within 10 mm of the RC6/TX and RC7/RX pins, and route CANH/CANL as a differential pair with 120 ohm characteristic impedance. Keep oscillator traces short and surrounded by a ground guard ring for noise immunity.
Do not forget to solder the exposed thermal pad - omitting it causes thermal stress and unreliable operation. The 'E' suffix indicates the extended -40C to +125C industrial temperature grade; using a -I (industrial -40C to +85C) variant in under-hood automotive applications will void reliability. For in-circuit debugging, the ICSP pins (RB6/PGC and RB7/PGD) must be accessible on the board; production boards should include test pads or a 6-pin header. The MCLR pin requires a 10 kohm pull-up to Vdd for proper reset; a 10 nF capacitor to ground provides noise filtering for harsh electrical environments.
Compliance Information
RoHS compliant and lead-free per Microchip product page. Not AEC-Q100 qualified - automotive applications should use AEC-Q100 qualified parts (e.g., PIC18F2580-E/ML automotive-validated equivalent). Halogen-free status was not specified in the verified data - confirm with Microchip if required for your application.
