PIC24F32KA302-I/ML - 16-bit XLP MCU, 32KB Flash, 28-QFN | Microchip
MPN: PIC24F32KA302-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.83 | $4.83 |
| 10 | $4.34 | $43.40 |
| 100 | $3.83 | $383.00 |
| 500 | $3.45 | $1,725.00 |
| 1,000 | $3.2 | $3,200.00 |
PIC24F32KA302-I/ML Overview
An XLP microcontroller is a class of low-power MCU engineered for battery-powered and energy-harvesting designs. PIC24F XLP parts add nanoWatt features such as Deep Sleep mode with Real-Time Clock/Calendar (RTCC), Deep Sleep Brown-Out Reset (DSBOR), Deep Sleep Watchdog Timer (DSWDT), and ultra-low sleep currents in the order of tens of nanoamps. Within the broader taxonomy, this part belongs to microcontroller -> 16-bit MCU -> PIC24F family -> XLP low-power sub-family -> embedded processing semiconductor.
Key features include 17 general-purpose I/O pins, multiple serial interfaces (UART, SPI, I²C), a 12-bit ADC with up to 16 channels, a Charge Time Measurement Unit (CTMU) for capacitive touch sensing, up to 5 CCP/ECCP modules, and a wide operating voltage range of 1.8 V to 3.6 V. The -I industrial temperature grade supports -40 °C to +85 °C operation, making the part suitable for harsh environments and outdoor installations.
Architecturally, the PIC24F32KA302 uses a 16-bit modified Harvard RISC core with a hardware Multiply/Divide unit and a vectored interrupt controller. The QFN-28 package exposes a thermal pad that bonds to PCB copper to reduce θJA, which improves sustained performance when the device runs peripherals such as the ADC and CTMU continuously.
Typical applications include battery-powered IoT sensor nodes, wearable fitness bands, portable medical monitors, low-energy wireless HMI controllers, capacitive touch keypads, and remote environmental dataloggers. The combination of deep-sleep RTCC, 12-bit ADC and CTMU makes it especially suited to designs that must wake briefly, take a measurement, and return to nanoamp currents.
When designing with the PIC24F32KA302-I/ML, place 100 nF decoupling on each VDD pin, tie all VSS pins together through the exposed pad, and respect the 1.8 V–3.6 V supply window. For capacitive touch, follow Microchip's CTMU layout guidelines and use guard traces.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten BOM selection and PCB bring-up.
Drop-in alternatives for PIC24F32KA302-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F32KA302-I/ML (same form factor and footprint) — differing in Core Architecture, Package, Timers, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24F32KA302-E/ML
✅ Drop-In✓ In Stock
$2.98 / Unit
View Datasheet →PIC24F32KA302T-I/ML
✅ Drop-In✓ In Stock
$3.45 / Unit
View Datasheet →PIC24F32KA302-H/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F32KA302-I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24F32KA301-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F32KA302-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC 16-bit modified Harvard RISC |
| Family | PIC24F XLP (eXtreme Low Power) |
| CPU Core Width | 16-bit |
| Maximum Clock Frequency | 32 MHz |
| Performance | 16 MIPS |
| Program Memory (Flash) | 32 KB (11K x 24 words) |
| Data RAM | 2 KB |
| EEPROM | 512 B |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 17 |
| ADC | 12-bit, up to 16 channels |
| CTMU | Yes (Charge Time Measurement Unit) |
| Timers | 5x 16-bit, plus RTCC in Deep Sleep |
| CCP / ECCP Modules | Up to 5 |
| Communication | UART, SPI, I²C |
| Operating Temperature | -40 °C to +85 °C (Industrial, -I) |
| Package | 28-pin QFN (6 x 6 mm) with exposed thermal pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC24F32KA302-I/ML Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input, active low |
| Pin 2 | RA0 — Port A bit 0 / analog input AN0 |
| Pin 3 | RA1 — Port A bit 1 / analog input AN1 |
| Pin 4 | RB0 — Port B bit 0 / analog input AN2 |
| Pin 5 | RB1 — Port B bit 1 / analog input AN3 |
| Pin 6 | RB2 — Port B bit 2 / analog input AN4 |
| Pin 7 | RB3 — Port B bit 3 / analog input AN5 |
| Pin 8 | VSS — Ground reference |
| Pin 9 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| Pin 10 | RB4 — Port B bit 4 / analog input AN6 |
| Pin 11 | RB5 — Port B bit 5 / analog input AN7 |
| Pin 12 | RB6 — Port B bit 6 / ICS PGC |
| Pin 13 | RB7 — Port B bit 7 / ICS PGD |
| Pin 14 | RA2 — Port A bit 2 / analog input AN8 |
| Pin 15 | RA3 — Port A bit 3 / analog input AN9 / VREF+ |
| Pin 16 | RA4 — Port A bit 4 / analog input AN10 / VREF- |
| Pin 17 | RA5 — Port A bit 5 / analog input AN11 |
| Pin 18 | RA6 — Port A bit 6 / oscillator output |
| Pin 19 | RA7 — Port A bit 7 / oscillator input |
| Pin 20 | VSS — Ground (second VSS pin) |
| Pin 21 | VDD — Positive supply (second VDD pin) |
| Pin 22 | RB8 — Port B bit 8 / analog input AN12 |
| Pin 23 | RB9 — Port B bit 9 / analog input AN13 |
| Pin 24 | RB10 — Port B bit 10 / analog input AN14 |
| Pin 25 | RB11 — Port B bit 11 / analog input AN15 |
| Pin 26 | RB12 — Port B bit 12 |
| Pin 27 | RB13 — Port B bit 13 |
| Pin 28 | RB14 — Port B bit 14 |
Typical Applications
PIC24F32KA302-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Node, Wearable Fitness Band, Portable Medical Monitor, Capacitive Touch Keypad, Remote Environmental Datalogger, Low-Energy Wireless HMI Controller.
Battery-Powered IoT Sensor Node
The PIC24F32KA302-I/ML is a strong fit for battery-powered IoT sensor nodes because its XLP architecture adds Deep Sleep RTCC, DSBOR and DSWDT functions that keep the chip drawing nanoamp-level currents between measurement events. A typical duty cycle of one wake per minute at 32 MHz with a 3.3 V coin-cell battery yields multi-year battery life when the 12-bit ADC and CTMU are only powered during the active window. The 32 KB Flash is enough for a sensor-fusion algorithm and a sub-GHz radio driver over SPI, and 2 KB RAM accommodates buffer storage. Compared with running a Cortex-M0+ at the same average load, the XLP RTCC in Deep Sleep eliminates the need for an external RTC chip, reducing BOM cost and PCB area.
Recommended
Wearable Fitness Band
For wearable fitness bands, the PIC24F32KA302-I/ML combines a 16 MIPS core (fast enough for heart-rate and step-count DSP loops) with Deep Sleep currents below 100 nA when the RTCC is running. The CTMU peripheral enables low-cost capacitive touch buttons on the band strap without an external touch IC, and the 17 I/O pins drive an OLED display, a BLE link through SPI, and a 3-axis accelerometer over I²C. The 28-QFN (6 x 6 mm) footprint fits inside a wristband module, and the exposed pad keeps the die cool under continuous BLE transmit bursts. Compared with discrete RTC + microcontroller solutions, integrating the RTCC and CTMU on-die cuts quiescent current and BOM by roughly 30 percent.
Recommended
Portable Medical Monitor
In portable medical monitors such as pulse-oximeter fingertip probes or single-lead ECG patches, the PIC24F32KA302-I/ML delivers the deterministic 16-bit performance and 12-bit ADC accuracy required for vital-sign sampling. Its 1.8 V to 3.6 V supply range lets a single Li-Ion cell power the design through an LDO, while the XLP sleep mode extends battery runtime between patient charges. The 32 KB Flash stores a fixed DSP filter chain and a simple BLE-LE GATT service, and 2 KB RAM is enough for rolling sample buffers. Compared with 8-bit MCUs at the same MIPS, the 16-bit core simplifies FIR filter math and improves signal-to-noise ratio by 3-4 dB in the same band.
Recommended
Capacitive Touch Keypad
The PIC24F32KA302-I/ML is ideal for capacitive touch keypads thanks to its on-chip CTMU (Charge Time Measurement Unit), which measures capacitance changes on PCB pads without an external touch controller. Combined with the 12-bit ADC and 17 I/O pins, the MCU can scan 12-16 keys plus a slider in a few milliseconds, then return to Deep Sleep with RTCC wake. The 28-QFN footprint fits behind a glass or plastic overlay, and the XLP sleep currents allow battery-powered remote controls to last years on two AAA cells. Compared with mechanical keypads, CTMU-based touch reduces wear, enables sealed IP-rated enclosures, and lowers per-button BOM cost by roughly 50 percent.
Recommended
Remote Environmental Datalogger
For remote environmental dataloggers deployed in agricultural, weather or asset-tracking use cases, the PIC24F32KA302-I/ML runs the sensor stack at 16 MIPS and sleeps with RTCC wake-up between samples. Its wide 1.8-3.6 V operating window accepts unregulated 2x AA alkaline batteries, while the 12-bit ADC multiplexes temperature, humidity and soil-moisture sensors through a CTMU-driven multiplexer. The 32 KB Flash and 2 KB RAM comfortably hold an SD-card FAT logger or a LoRaWAN stack via SPI. Compared with always-on microcontrollers, the XLP deep-sleep profile typically reduces average current by 90 percent, extending field deployment to multiple years on alkaline cells.
Recommended
Low-Energy Wireless HMI Controller
The PIC24F32KA302-I/ML can act as the HMI controller in low-energy wireless products like smart thermostats, BLE door locks or LoRa-based industrial gauges. Its 17 I/O pins drive a segmented LCD via the charge pump, a rotary encoder through CCP/ECCP, and a status LED through PWM, while UART/SPI/I²C talk to the wireless companion chip. The XLP sleep mode with RTCC preserves battery life during standby, and the 32 KB Flash holds a slim GUI state machine. Compared with 32-bit Cortex-M0+ parts, this PIC24F XLP variant achieves comparable HMI latency at lower active power and a smaller BOM count thanks to integrated CTMU and RTCC.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F32KA302-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F32KA302-E/ML | PIC24F32KA302T-I/ML | PIC24F32KA302-H/ML | PIC24F32KA302-I/MM | PIC24F32KA301-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6 x 6 mm) with EP | 28-QFN (6 x 6 mm) with EP - same | 28-QFN (6 x 6 mm) with EP - same | 28-QFN (6 x 6 mm) with EP - same | 28-QFN (6 x 6 mm) with EP - same | 28-QFN (6 x 6 mm) with EP - same |
| Core | PIC24F 16-bit XLP | PIC24F 16-bit XLP - same | PIC24F 16-bit XLP - same | PIC24F 16-bit XLP - same | PIC24F 16-bit XLP - same | PIC24F 16-bit XLP - same die family |
| Max Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Flash | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 16 KB (-50%) |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB (-50%) |
| EEPROM | 512 B | 512 B | 512 B | 512 B | 512 B | 512 B |
Key Differentiators
- Lowest-power Deep Sleep with on-die RTCC (vs PIC24F32KA302T-I/ML)
- Highest available Flash in PIC24F32KA3xx QFN-28 family (vs PIC24F32KA301-I/ML)
- Compact 6x6 mm QFN with exposed thermal pad (vs PIC24F32KA302-I/SP (SPDIP-28))
Design Notes
Place a 100 nF decoupling capacitor as close as possible to each VDD pin (pins 9 and 21 on the 28-QFN) and tie all VSS pins to a single ground plane. The exposed thermal pad under the package must be soldered to PCB copper and stitched with at least nine thermal vias to the inner ground plane. Estimated: with θJA around 30 C/W on a 2 oz copper 4-layer board, the die can dissipate roughly 2.5 W at 85 °C ambient, well above typical PIC24F operating power.
Respect the 1.8 V–3.6 V VDD window of the PIC24F32KA302-I/ML. Brown-out and Deep-Sleep BOR thresholds are configured in the FDEVOPT1 / FBOOT configuration words. For battery-powered designs, follow Microchip XLP application notes AN1416 and TB3065 to keep Deep Sleep currents in the nanoamp range, and disable unused peripherals in the PMD registers before entering Sleep. Estimated: leaving UART and ADC enabled typically raises Deep Sleep current by 5-10 µA.
For capacitive-touch designs that use the on-chip CTMU, keep touch traces short, route them on a single layer, and surround them with a grounded guard trace to prevent moisture false triggers. Add a 4.7 nF to 10 nF series capacitor on each CTMU channel to set the charge time constant and improve noise immunity. Place the touch sensor electrodes on the opposite side of the PCB from any switching power supply or high-speed signals.
Do not assume PIC24F32KA302-I/ML firmware will fit on a PIC24F32KA301-I/ML because the smaller die halves Flash and RAM. The configuration words, ICD pins (RB6/RB7) and JTAG/ICSP allocation must match the chosen package variant. When migrating from QFN-28 (-I/ML) to SPDIP-28 (-I/SP) or SOIC-28 (-I/SO), the PCB must be redesigned because the footprints differ.
Compliance Information
RoHS compliant per Microchip product page. AEC-Q100 grade not advertised for the /ML industrial variant; Automotive-grade PIC24F parts carry the -VAO or -EP suffix. Lead-free and halogen-free per Microchip environmental compliance datasheet.
