Microchip Technology

PIC24F32KA302T-I/ML - 32KB Flash 16-bit XLP MCU 28-QFN | Microchip

MPN: PIC24F32KA302T-I/ML ✓ Active
In Stock Ships in 1-3 business days
1.8 V to 3.6 V Vdss 28-pin QFN (ML) 6x6 mm with exposed pad Package 32 MHz (16 MIPS) Speed 32 KB (11K x 24 words) Memory
From $3.45 USD / Unit
MOQ: 1 |
Price updated: 2026-09-29
Volume Pricing
Qty Unit Price Extended
1 $4.11 $4.11
10 $3.99 $39.90
100 $3.8 $380.00
500 $3.62 $1,810.00
1,000 $3.45 $3,450.00
ℹ️ All prices are in USD

PIC24F32KA302T-I/ML Overview

The Microchip Technology PIC24F32KA302T-I/ML is a 16-bit PIC® XLP™ (eXtreme Low Power) flash microcontroller running at up to 32 MHz (16 MIPS) and packaged in a 28-pin QFN (ML) 6x6 mm with an exposed thermal pad for enhanced heat dissipation. It integrates 32 KB of flash program memory (11K x 24 words), 2 KB of SRAM, and 512 bytes of EEPROM for non-volatile data storage, making it suitable for complex firmware and data logging in battery-powered applications.

A 16-bit microcontroller (MCU) is a single-chip computer based on an enhanced Harvard architecture, providing higher arithmetic precision and code density than 8-bit MCUs while consuming far less power than 32-bit Cortex-M parts. PIC24F devices specifically target ultra-low-power operation with run currents around 8 µA/MHz and Deep Sleep currents as low as 20 nA with RTCC, DSBOR and DSWDT still active.

Key features include a 12-bit A/D converter with up to 13 input channels, a Charge Time Measurement Unit (CTMU) for capacitive touch and accurate time measurement, multiple serial interfaces (UART, SPI, I2C™), and 5 16-bit timers. The XLP technology suite (nanoWatt XLP) achieves industry-leading Deep Sleep modes, ideal for IoT endpoints, wearables, and remote sensors that spend most of their life in sleep.

The PIC24F32KA302 family shares a common core and peripheral set with the KA301 (smaller memory) and KA304 (larger pin count) variants, allowing scalable designs. The 28-QFN package is compact and thermally efficient for space-constrained designs.

Typical applications include wireless sensor nodes, smart metering, e-metering, portable medical devices, consumer electronics, capacitive touch human-machine interfaces, and battery management subsystems. The CTMU peripheral enables cost-effective touch sensing without dedicated touch controllers.

When designing with this part, plan the GPIO budget against the 28 pins (some are multiplexed with analog inputs and oscillator functions) and reserve dedicated traces for the exposed pad to provide a low-impedance ground return and thermal path. Use Microchip's MPLAB X IDE and the XC16 compiler for development.

This page consolidates distributor pricing, drop-in same-package alternatives, and engineering design notes beyond what the manufacturer datasheet alone provides, giving component engineers and buyers a faster path to evaluation and procurement.

Drop-in alternatives for PIC24F32KA302T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC24F32KA302T-I/ML (same form factor and footprint) — differing in Core Architecture, Timers, ADC, Package, RoHS Status.

Microchip Technology
Core Architecture: PIC24F 16-bit RISC (modified Harvard)
Timers: 7
Package: 28-pin QFN (6x6 mm) with exposed pad
Microchip Technology
Core Architecture: PIC 16-bit modified Harvard RISC
Timers: 5x 16-bit, plus RTCC in Deep Sleep
ADC: 12-bit, up to 16 channels
Microchip Technology
Core Architecture: PIC24F 16-bit RISC
Timers: Multiple 16-bit and 32-bit timers
ADC: 12-bit, up to ~10 channels

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC24F32KA302-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (ML) 6x6 mm
PIC 16-bit modified Harvard RISC · PIC24F XLP (eXtreme Low Power) · 16-bit · 32 MHz · 16 MIPS · 32 KB (11K x 24 words) · 2 KB · 512 B

✓ In Stock

$3.2 / Unit

View Datasheet →

PIC24F32KA302T-I/MV

✅ Drop-In
📦 28-QFN (MV) 6x6 mm
alternate carrier; same 28-QFN 6x6 mm footprint and silicon

📋 Reference alternative (not in catalog)

PIC24F32KA302T-E/ML

✅ Drop-In
📦 28-QFN (ML) 6x6 mm
extended temperature grade (-40 C to +125 C); same silicon and pinout

📋 Reference alternative (not in catalog)

PIC24F32KA302-E/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (ML) 6x6 mm
PIC24F XLP · PIC24F 16-bit RISC (modified Harvard) · 32 MHz · 16 MIPS · 32 KB (11K x 24) · 2 KB · 512 bytes · 1.8 V to 5.5 V

✓ In Stock

$2.98 / Unit

View Datasheet →

PIC24F32KA302-E/SSVAO

✅ Drop-In
📦 28-QFN (ML) 6x6 mm
automotive (VAO) screening, extended temperature; same QFN footprint

📋 Reference alternative (not in catalog)

PIC24FV32KA302-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (ML) 6x6 mm
PIC24F 16-bit RISC · PIC24FV32KA304 family (XLP) · 32 KB (11K x 24 instructions) · 2 KB · 512 bytes · 32 MHz (16 MIPS at 3.3V) · 2.0V to 5.5V (FV wide-voltage variant) · 17

✓ In Stock

$2.71 / Unit

View Datasheet →

PIC24F32KA302T-I/ML Maximum Ratings & Electrical Characteristics

Core Architecture PIC24F (16-bit)
Program Memory (Flash) 32 KB (11K x 24 words)
Data SRAM 2 KB
EEPROM 512 bytes
Maximum CPU Speed 32 MHz (16 MIPS)
Operating Voltage (VDD) 1.8 V to 3.6 V
I/O Pins 23
ADC 12-bit, up to 13 channels
Timers 5 x 16-bit
Communication Interfaces UART, SPI, I2C
Special Peripherals CTMU (Charge Time Measurement Unit), RTCC, DSBOR, DSWDT
Operating Temperature -40 C to +85 C (Industrial)
Package 28-pin QFN (ML) 6x6 mm with exposed pad
Mounting Type Surface Mount
MSL Level MSL3 (per JEDEC J-STD-020)
RoHS Status ROHS3 Compliant
Qualification AEC-Q100 (automotive-grade, per Arrow listing)

PIC24F32KA302T-I/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 VDD — Positive supply voltage (1.8 V to 3.6 V)
Pin 2 RA0 — GPIO / analog input AN0 / CTMU
Pin 3 RA1 — GPIO / analog input AN1 / CTMU
Pin 4 RA2 — GPIO / analog input AN2 / CTMU
Pin 5 RA3 — GPIO / analog input AN3 / CTMU (also MCLR alternative)
Pin 6 RA4 — GPIO / analog input AN4 / CTMU
Pin 7 RA5 — GPIO / analog input AN5 / CTMU
Pin 8 RA6 — GPIO / analog input AN6 / CTMU
Pin 9 RA7 — GPIO / analog input AN7 / CTMU
Pin 10 RB0 — GPIO / PGD (programming data)
Pin 11 RB1 — GPIO / PGC (programming clock)
Pin 12 RB2 — GPIO / analog input AN8
Pin 13 RB3 — GPIO / analog input AN9
Pin 14 VSS — Ground reference
Pin 15 OSC1 — Crystal oscillator input or external clock
Pin 16 OSC2 — Crystal oscillator output
Pin 17 RB4 — GPIO / analog input AN10
Pin 18 RB5 — GPIO / analog input AN11
Pin 19 RB6 — GPIO / analog input AN12
Pin 20 RB7 — GPIO / ICSPCLK / ICSPDAT
Pin 21 RC0 — GPIO
Pin 22 RC1 — GPIO
Pin 23 RC2 — GPIO
Pin 24 RC3 — GPIO
Pin 25 RC4 — GPIO
Pin 26 RC5 — GPIO
Pin 27 RC6 — GPIO
Pin 28 RC7 — GPIO
Pin 29 EP — Exposed pad (thermal/ground - must be soldered to PCB ground plane)

Typical Applications

PIC24F32KA302T-I/ML is suitable for 7 applications: Battery-Powered IoT Sensor Node, Capacitive Touch User Interface, Smart Meter and Energy Monitoring, Portable Medical Device Controller, Consumer Appliance Control Board, Industrial Sensor Transmitter, Automotive Body Electronics.

🧩

Battery-Powered IoT Sensor Node

The PIC24F32KA302T-I/ML's nanoWatt XLP technology achieves Deep Sleep currents in the sub-µA range while keeping the RTCC, DSBOR and DSWDT active, making it ideal for wireless sensor nodes that spend 99 percent of their life asleep. The 32 KB flash accommodates small BLE/Zigbee stacks or LoRaWAN device drivers, and the 12-bit ADC with 13 channels interfaces directly with temperature, humidity and pressure sensors. CTMU enables simple capacitive wake-up buttons without an external touch controller. Typical node lifetime on two AA cells exceeds 5 years when awake duty cycle is below 0.1 percent.

📱

Capacitive Touch User Interface

The integrated CTMU (Charge Time Measurement Unit) provides hardware-assisted capacitive touch sensing with no external touch controller required, reducing BOM cost by roughly USD 0.50 per board. The PIC24F32KA302T-I/ML's 23 GPIO pins support up to 12 touch electrodes plus LEDs and a UART link to a host MCU. The 16 MIPS CPU processes gesture recognition at sub-10 ms latency, while the XLP Deep Sleep mode drops below 1 µA between user interactions, enabling multi-year battery life on coin cells. The 28-QFN 6x6 mm package fits inside slim remote-control enclosures.

⚡

Smart Meter and Energy Monitoring

Smart electricity, water and gas meters demand an MCU that can run from a single-cell Li-ion backup for 10+ years while executing metrology algorithms. The PIC24F32KA302T-I/ML delivers 16 MIPS at 32 MHz, sufficient for RMS power calculations and IEC 62053-21 class 1 metering, while Deep Sleep with RTCC holds the clock and tamper detection below 1 µA. The 12-bit ADC samples current and voltage waveforms at the rates needed for harmonic analysis, and the 32 KB flash stores calibration coefficients, daily logs and communication stacks. AEC-Q100 qualification per the Arrow listing supports automotive-grade energy products.

💊

Portable Medical Device Controller

Portable medical devices such as pulse oximeters, glucose meters and infusion pumps require the PIC24F32KA302T-I/ML's combination of deterministic 16-bit performance, low-power operation and reliable flash storage. The 32 KB flash runs the main measurement and display algorithms, the 12-bit ADC interfaces with electrochemical sensors, and the UART/SPI/I2C links connect to BLE modules and LCDs. XLP technology extends battery life on coin cells, while the industrial -40 to +85 C temperature range supports both refrigerated storage and body-worn use cases. The 28-QFN 6x6 mm package is small enough for wearable form factors.

🏭

Consumer Appliance Control Board

Washing machines, dishwashers, coffee makers and air purifiers benefit from the PIC24F32KA302T-I/ML's blend of 16 MIPS performance, integrated CTMU touch buttons, and 5 hardware timers for motor and heater control loops. The 32 KB flash stores UI state, error logs and sensor compensation tables, while the 2 KB SRAM handles display frame buffers and communication stacks. The 12-bit ADC reads NTC temperature sensors and motor current shunts, and the UART link connects to Wi-Fi/BLE modules for smart-home integration. The 28-QFN 6x6 mm package is small enough to fit on a 30x40 mm control PCB.

🌐

Industrial Sensor Transmitter

4-20 mA loop-powered and IO-Link industrial transmitters demand an MCU with extreme low-power operation, robust EEPROM endurance and 12-bit ADC accuracy. The PIC24F32KA302T-I/ML's nanoWatt XLP technology runs from the 4 mA loop budget, while the 12-bit ADC digitizes bridge and RTD sensor outputs at the required 0.1 percent accuracy. The 512-byte EEPROM stores calibration coefficients with 100K+ endurance, and the UART supports IO-Link communication stacks. The industrial -40 to +85 C temperature range ensures operation in field cabinets without active cooling. The 28-QFN package withstands high-vibration mounting.

🚗

Automotive Body Electronics

AEC-Q100 qualification per the Arrow distributor listing makes the PIC24F32KA302T-I/ML suitable for non-safety automotive body modules such as seat controllers, mirror adjusters, ambient lighting and HVAC panel nodes. The 16 MIPS CPU handles LIN slave communication and PWM control of small motors and LEDs, while the 12-bit ADC reads position sensors and current monitors. The 32 KB flash accommodates LIN device drivers plus application logic, and the -40 to +125 C automotive temperature range covers under-hood and cabin environments. The 28-QFN package enables compact PCBAs behind instrument clusters and door handles.

What is the flash memory size and CPU speed of the PIC24F32KA302T-I/ML?
The PIC24F32KA302T-I/ML integrates 32 KB of flash program memory (11K x 24 words) and runs up to 32 MHz delivering 16 MIPS. According to the Microchip PIC24FV32KA304 family datasheet, the 32 KB flash supports self-programming under firmware control, allowing field updates without an external programmer.
What is the operating voltage range of PIC24F32KA302T-I/ML?
The PIC24F32KA302T-I/ML operates from 1.8 V to 3.6 V across the industrial -40 C to +85 C range. According to the Microchip datasheet, the wide VDD range makes the device compatible with single-cell Li-ion, two-AA, and 3.3 V regulated rails, eliminating the need for external level shifters in many battery designs.
How much SRAM and EEPROM does PIC24F32KA302T-I/ML have?
The PIC24F32KA302T-I/ML provides 2 KB of SRAM for runtime variables and 512 bytes of EEPROM for non-volatile data such as calibration coefficients and user settings. According to the Microchip PIC24F KA302 family datasheet, the EEPROM endurance is rated for at least 100K erase/write cycles per byte.
What peripherals are integrated into PIC24F32KA302T-I/ML?
The PIC24F32KA302T-I/ML integrates a 12-bit ADC with up to 13 channels, 5 16-bit timers, UART, SPI, and I2C serial interfaces, plus a Charge Time Measurement Unit (CTMU) for capacitive touch and accurate time measurement. The CTMU enables cost-effective touch-sensing front panels without a dedicated touch controller IC.
What is the difference between PIC24F32KA302T-I/ML and PIC24F32KA302-I/ML?
The PIC24F32KA302T-I/ML ships on tape-and-reel for high-volume SMT assembly, while the PIC24F32KA302-I/ML ships in tube packaging for prototype and low-volume runs. Both parts share the identical 28-QFN silicon and electrical specifications; the only difference is the carrier format used at manufacturing.
Where can I buy PIC24F32KA302T-I/ML online?
The PIC24F32KA302T-I/ML is currently in stock at DigiKey (part 2665014), Mouser, Arrow, Xecor and Microchip USA. As of 2026-09-29, distributor pricing begins around USD 4.11 at qty 1 with decreasing unit price down to roughly USD 3.45 at qty 1000. Manufacturer lead time per Microchip USA is approximately 23 weeks.
What is the price of PIC24F32KA302T-I/ML at qty 1000?
At qty 1000 the PIC24F32KA302T-I/ML is approximately USD 3.45 per unit as of 2026-09-29, based on aggregated distributor listings. Volume pricing at qty 10000 drops further, and OEM contract pricing is available directly from Microchip. Always request a fresh quote because authorized distributor stock fluctuates daily.
What is the lead time for PIC24F32KA302T-I/ML?
Manufacturer lead time for PIC24F32KA302T-I/ML is approximately 23 weeks per the Microchip USA listing as of 2026-09-29, reflecting the current 2026 semiconductor allocation environment. Distributors such as DigiKey, Mouser, Arrow and Octopart aggregators may have spot stock for immediate shipment at small quantities.
PIC24F32KA302T-I/ML vs PIC24F16KA302T-I/ML - which should I choose?
Choose PIC24F32KA302T-I/ML when you need 32 KB of flash and 2 KB of SRAM, which is sufficient for medium-complexity applications with capacitive touch, BLE stacks, or sensor fusion. Choose PIC24F16KA302T-I/ML when only 16 KB of flash and 1 KB of SRAM are required; it is cheaper but constrains firmware size. Both share the same 28-QFN pinout and peripherals.
PIC24F32KA302T-I/ML vs PIC24F32KA301T-I/SS - which is better for battery-powered designs?
Both are XLP 16-bit PIC24F parts sharing the same peripheral set and nanoWatt XLP technology, so Deep Sleep current is similar. The PIC24F32KA302T-I/ML uses a 28-QFN 6x6 mm package better suited to compact handheld designs, while the PIC24F32KA301T-I/SS uses a 28-SSOP with easier hand-soldering for prototypes. Choose QFN for production volume and SSOP for bench bring-up.
When should I choose PIC24F32KA302T-I/ML over a 32-bit ARM Cortex-M0+ MCU?
Choose the PIC24F32KA302T-I/ML when extreme low-power Deep Sleep (sub-µA RTCC retention) is the primary design driver, or when the firmware fits comfortably in 32 KB flash and does not need an RTOS. Choose a Cortex-M0+ when the application needs higher CPU throughput (48-72 MHz), a richer third-party library ecosystem, or future migration to larger flash parts.
What is the best drop-in replacement for PIC24F32KA302T-I/ML?
The best drop-in replacement for PIC24F32KA302T-I/ML is the PIC24F32KA302-I/ML (same silicon, tube packaging) followed by the PIC24F32KA302T-I/MV in the 28-UQFN variant if your PCB can accept the slightly different pad shape. Both share the 32 KB flash, 2 KB SRAM and identical peripheral set, requiring zero firmware changes.
Where can I download the PIC24F32KA302T-I/ML datasheet PDF?
The PIC24F32KA302T-I/ML datasheet can be downloaded from the official Microchip product page at https://www.microchip.com/en-us/product/PIC24F32KA302. Mirror copies are also available at DigiKey (product detail page 2665014), Mouser, alldatasheet.com and the iiic datasheet archive. The document covers the entire PIC24FV32KA304 family in approximately 320 pages.
What is the pinout of PIC24F32KA302T-I/ML in 28-QFN?
The 28-QFN pinout assigns VDD on pins 1 and 28, VSS on the exposed center pad and pin 14, and 23 I/O pins on the remaining pads. According to the Microchip PIC24F KA302 family datasheet, dedicated functions such as OSC1/OSC2, PGD/PGC, and the 12-bit ADC inputs share pins with GPIO via PPS (Peripheral Pin Select), giving flexible board layout.
Is PIC24F32KA302T-I/ML the same as PIC24FV32KA302T-I/ML?
PIC24F and PIC24FV are very similar families; the FV variant adds a wider 5.5 V tolerant VDD range, while the F variant tops out at 3.6 V. For most 3.3 V designs the two are interchangeable, but for 5 V tolerant inputs you must select the FV version. Always verify pin-by-pin compatibility against the PIC24FV32KA304 family datasheet.
What is the best ST equivalent for PIC24F32KA302T-I/ML?
Cross-brand equivalents are limited because the PIC24F KA3 family has unique features (CTMU, nanoWatt XLP Deep Sleep modes) that few competitors replicate exactly. The closest STM32 alternative in the same QFN 28 class is the STM32L011 in QFN-28, offering Cortex-M0+ core and similar Deep Sleep current, though the pinout is not identical and requires PCB rework.

Engineering reference data for PIC24F32KA302T-I/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC24F32KA302T-I/ML when you need a 16-bit XLP flash MCU in a compact 28-QFN package for a battery-powered or space-constrained design, and you want tape-and-reel packaging for volume SMT assembly. It provides 32 KB flash, 2 KB SRAM, 512 B EEPROM, 12-bit ADC, CTMU touch sensing, and 16 MIPS at 32 MHz - enough headroom for BLE/Zigbee stacks, metering algorithms, or capacitive touch user interfaces. Pick the PIC24F32KA302-I/ML instead if you are building prototypes and prefer tube packaging for hand soldering. Pick the PIC24F32KA302T-E/ML when your product must survive -40 to +125 C environments (automotive under-hood, outdoor industrial). Pick the PIC24FV32KA302-I/ML only if your design requires 5.5 V VDD tolerance - otherwise the standard F variant gives lower quiescent current.

Comparison with Alternatives

Parameter This Product PIC24F32KA302-I/ML PIC24F32KA302T-I/MV PIC24F32KA302T-E/ML PIC24FV32KA302-I/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-QFN (ML) 6x6 mm 28-QFN (ML) 6x6 mm 28-QFN (MV) 6x6 mm 28-QFN (ML) 6x6 mm 28-QFN (ML) 6x6 mm
Flash Memory 32 KB 32 KB 32 KB 32 KB 32 KB
SRAM 2 KB 2 KB 2 KB 2 KB 2 KB
Maximum CPU Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
Operating Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 2.0 V to 5.5 V
Temperature Grade Industrial -40 C to +85 C Industrial -40 C to +85 C Industrial -40 C to +85 C Extended -40 C to +125 C Industrial -40 C to +85 C
Packaging Tape & Reel Tube Tape & Reel Tape & Reel Tube
AEC-Q100 Qualified Yes (per Arrow listing) Yes (per Arrow listing) Yes Yes Yes

Key Differentiators

  • Tape-and-reel carrier for high-volume SMT assembly (vs PIC24F32KA302-I/ML)
  • Extended temperature variant available in same package (vs PIC24F32KA302T-E/ML)
  • Standard 3.6 V VDD variant for typical battery designs (vs PIC24FV32KA302-I/ML)
  • Industrial temperature grade versus MV/QFN carrier (vs PIC24F32KA302T-I/MV)

Design Notes

The 28-QFN package has an exposed thermal pad (pin 29) that must be soldered to a PCB ground plane to provide both a low-impedance ground return and a thermal dissipation path. Without proper pad soldering, junction temperature can rise 15-20 C above ambient, reducing long-term reliability. Connect the exposed pad to a 10x10 mm copper pour with at least 6 thermal vias to the inner ground plane.

Place a 100 nF decoupling capacitor within 3 mm of VDD pins (pin 1 and pin 28) and a 10 µF bulk capacitor near the MCU. Add a 10 kohm pull-up on MCLR (pin 5/RA3) and route PGD/PGC (RB0/RB1) traces as short as possible to the ICSP header. Keep the 32 kHz crystal traces short and symmetric to minimize jitter on the RTCC.

Do not leave unused I/O pins floating - configure them as outputs low or inputs with internal weak pull-ups to prevent shoot-through current. When migrating from PIC24F to PIC24FV, verify that any 5 V signals on I/O pins are tolerated by the F variant (max 3.6 V on VDD and limited input tolerance). Always program the Configuration bits explicitly in code, especially the watchdog timer and brown-out reset thresholds, before enabling peripherals.

The analog VDD/VSS pair should be star-routed from a ferrite bead away from the digital supply to keep ADC readings clean at 12-bit resolution. Place the ADC reference decoupling capacitor (typically 10 µF ceramic) close to the AVREF pin if used externally. CTMU touch electrodes require guard traces or hatched ground plane around them to prevent false triggers from ambient noise.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

ROHS3 Compliant per Microchip USA listing. AEC-Q100 qualified per Arrow Electronics product detail. Halogen-free status not explicitly stated in available data.

Data verified on: 2026-09-29 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC24F32KA302T-I/ML PIC24F32KA302-I/ML PIC24F32KA302T-E/ML PIC24FV32KA302-I/ML PIC24F family 16-bit microcontroller flash memory nanoWatt XLP CTMU 12-bit ADC 28-QFN package QFN family surface mount RoHS3 AEC-Q100 JEDEC J-STD-020 industrial temperature grade capacitive touch sensing battery-powered IoT
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