PIC24FV08KM202-I/ML - 16-Bit XLP MCU 8KB Flash 28-QFN | Microchip
MPN: PIC24FV08KM202-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.2 | $3.20 |
| 10 | $2.85 | $28.50 |
| 100 | $2.4 | $240.00 |
| 500 | $2.05 | $1,025.00 |
| 1,000 | $1.72 | $1,720.00 |
PIC24FV08KM202-I/ML Overview
A 16-bit PIC microcontroller is a member of the wider microcontroller hierarchy that sits between 8-bit MCU cores and 32-bit Cortex-M devices, offering a balanced trade-off between deterministic interrupt latency, computational throughput, and code density for real-time control. PIC24F devices are specifically designed for low-power and mixed-signal embedded applications, sitting in Microchip's portfolio between the baseline PIC16 family and the high-performance dsPIC and 32-bit families. The 'FV' prefix in PIC24FV08KM202 indicates the wide-voltage 2.0V-5.5V variant, and 'XLP' stands for eXtreme Low Power, with sleep currents in the nanoampere range.
Key features include the integrated 12-bit ADC with up to 500 ksps conversion rate, dual operational amplifiers that can be configured as programmable gain amplifiers, an 8-bit DAC for bias or setpoint generation, and the Configurable Logic Cell which allows designers to create custom combinational and sequential logic without external gates. The XLP architecture delivers typical sleep currents below 60 nA with RTC running, and the device supports multiple low-power modes (Sleep, Idle, Doze) controlled via the Power-Saving Modes register set.
Typical applications include battery-powered sensor nodes, portable medical devices, low-power wireless sensor transmitters, energy harvesting systems, and industrial sensor interfaces requiring on-chip signal conditioning. The integrated op-amps and DAC simplify analog front-end designs, reducing BOM and PCB area versus discrete implementations. Designers often pair the part with an external EEPROM for data logging and a low-power radio module for IoT endpoints.
When designing with this MCU, pay attention to the wide-voltage analog specifications: the ADC and op-amp performance varies with VDD, and the QFN exposed pad must be soldered to the PCB ground plane for proper thermal dissipation and electrical reference. Always use the latest MPLAB X IDE with the XC16 compiler for code generation, and consult the family reference manual for peripheral driver libraries.
Drop-in alternatives for PIC24FV08KM202-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FV08KM202-I/ML (same form factor and footprint) — differing in ADC, Package, Operating Temperature, Comparators, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FV08KM202-E/ML
✅ Drop-In✓ In Stock
$2.12 / Unit
View Datasheet →PIC24FV08KM102-I/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24FV08KM102-I/SP
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.97 / Unit
View Datasheet →PIC24FV08KM102-E/SS
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.18 / Unit
View Datasheet →PIC24FV08KM102T-I/ML
✅ Drop-In✓ In Stock
$1.52 / Unit
View Datasheet →PIC24FV08KM202-I/ML Maximum Ratings & Electrical Characteristics
| Core | PIC24F 16-bit RISC |
| CPU Speed (Max) | 32 MHz |
| Program Memory (Flash) | 8 KB (2.75K x 24) |
| SRAM | 2 KB |
| Operating Voltage (Vdd) | 2.0 V to 5.5 V |
| ADC | 12-bit, up to 500 ksps |
| DAC | 8-bit |
| Op Amps | 2 integrated |
| Comparators | Integrated |
| Configurable Logic Cell (CLC) | Yes |
| Capture/Compare/PWM | 3 x 16-bit |
| Package | 28-QFN (6x6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +85 C (Industrial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC24FV08KM202-I/ML Pin Configuration
| Pin 1 | RA0 — Analog input / digital I/O |
| Pin 2 | RA1 — Analog input / digital I/O |
| Pin 3 | RA2 — Analog input / digital I/O / op-amp output |
| Pin 4 | RA3 — Analog input / digital I/O |
| Pin 5 | RA4 — Digital I/O |
| Pin 6 | RA5 — Digital I/O |
| Pin 7 | RA6 — Digital I/O / oscillator |
| Pin 8 | RA7 — Digital I/O / oscillator |
| Pin 9 | VSS — Ground |
| Pin 10 | VDD — Positive supply (2.0V-5.5V) |
| Pin 11 | RB0 — Digital I/O / analog input |
| Pin 12 | RB1 — Digital I/O / analog input |
| Pin 13 | RB2 — Digital I/O / analog input |
| Pin 14 | RB3 — Digital I/O / analog input |
| Pin 15 | RB4 — Digital I/O |
| Pin 16 | RB5 — Digital I/O |
| Pin 17 | RB6 — Digital I/O / programming clock |
| Pin 18 | RB7 — Digital I/O / programming data |
| Pin 19 | VSS — Ground |
| Pin 20 | VDD — Positive supply (2.0V-5.5V) |
| Pin 21 | RC0 — Digital I/O / analog input |
| Pin 22 | RC1 — Digital I/O / analog input |
| Pin 23 | RC2 — Digital I/O / analog input / DAC output |
| Pin 24 | RC3 — Digital I/O / analog input |
| Pin 25 | RC4 — Digital I/O |
| Pin 26 | RC5 — Digital I/O |
| Pin 27 | RC6 — Digital I/O |
| Pin 28 | RC7 — Digital I/O |
| Pin EP | EP — Exposed thermal pad - connect to VSS ground plane |
Typical Applications
PIC24FV08KM202-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Portable Medical Monitoring Devices, Industrial Sensor Signal Conditioning, Consumer Wearable Electronics, Energy Harvesting Wireless Switches, Automotive Sensor Interface Modules.
Battery-Powered IoT Sensor Nodes
The PIC24FV08KM202-I/ML fits IoT sensor endpoints because its XLP architecture achieves sleep currents below 60 nA with the RTCC running, extending coin-cell battery life to multiple years in duty-cycled applications. The integrated 12-bit ADC with 500 ksps conversion rate directly digitizes sensor outputs without external signal conditioning, while the dual on-chip op-amps can be configured as programmable-gain stages for thermocouple or strain-gauge bridges. The 28-QFN 6x6 mm footprint plus 8KB Flash accommodates small LoRaWAN or Wireless M-Bus protocol stacks, and the 2.0V-5.5V operating range supports both 3V lithium and 5V USB-powered configurations without level shifters. Engineers typically pair this MCU with an SPI-connected sub-GHz radio like the Microchip RN2483 for complete sensor-to-cloud endpoints.
Recommended
Portable Medical Monitoring Devices
The PIC24FV08KM202-I/ML is well-suited for portable medical devices such as pulse oximeters, glucose meters, and wearable health monitors, where its XLP nanoampere sleep currents extend battery life while the integrated analog peripherals simplify the front-end. The dual on-chip op-amps serve as transimpedance amplifiers for photodiode current-to-voltage conversion in SpO2 sensors, while the 12-bit ADC digitizes the result without an external ADC. The 8-bit DAC provides bias voltage generation for sensor calibration, and the CLC block implements hardware-level PWM blanking and pulse timing without CPU intervention. Operating from a single CR2032 coin cell or 2xAAA batteries, the wide 2.0V-5.5V range accommodates battery discharge curves without boost converters.
Recommended
Industrial Sensor Signal Conditioning
The PIC24FV08KM202-I/ML targets industrial 4-20 mA loop-powered transmitters, RTD signal conditioners, and bridge sensor interfaces where its integrated analog reduces BOM. The two on-chip op-amps can be cascaded as a two-stage instrumentation amplifier for strain-gauge or load-cell signal chains, achieving gains up to 1000 with the internal resistor network. The 12-bit ADC provides 500 ksps conversion, sufficient for vibration monitoring and process control loops. The Configurable Logic Cell (CLC) implements hardware-level zero-crossing detection and PWM synchronization for motor-control feedback without CPU wake-up, and the wide 2.0V-5.5V range supports both 24V loop-powered (via shunt) and 5V supply configurations across factory automation systems.
Recommended
Consumer Wearable Electronics
The PIC24FV08KM202-I/ML fits wearable devices such as fitness bands, smart watches, and hearable accessories where the 28-QFN 6x6 mm footprint and XLP power profile enable compact, battery-friendly designs. Sleep currents under 60 nA allow the device to remain in deep sleep for days between button presses or sensor events, while the integrated op-amps and 12-bit ADC handle heart-rate photoplethysmography (PPG) signal conditioning. The 8-bit DAC drives haptic feedback motor control via PWM, and the 3 x 16-bit CCP modules provide timer-based LED driver control for status indicators. Operating from 2.0V to 5.5V, the part supports both rechargeable Li-ion (3.7V nominal) and coin-cell batteries used in wearable form factors.
Recommended
Energy Harvesting Wireless Switches
The PIC24FV08KM202-I/ML enables self-powered wireless light switches and remote controls that harvest energy from button presses or solar cells, eliminating battery replacement. The XLP architecture wakes from sleep on a GPIO interrupt, processes the event, transmits via an SPI-connected radio, and returns to nanoampere sleep - all within milliseconds, conserving harvested energy. The wide 2.0V-5.5V operating range accepts variable supercapacitor voltages from energy-harvesting circuits without regulation. The integrated 8-bit DAC can drive a piezoelectric sounder for click feedback, and the CLC implements hardware-level debounce and pulse validation without CPU wake-up, further reducing energy consumption. Typical designs pair this MCU with the EnOcean ECO 200 kinetic harvester or equivalent.
Recommended
Automotive Sensor Interface Modules
The PIC24FV08KM202-I/ML can serve automotive sensor interface modules (with the -E/ML extended temperature variant qualifying for underhood applications up to +125 C). Its integrated analog front-end - 12-bit ADC, 8-bit DAC, and dual op-amps - replaces discrete components in tire-pressure monitoring sensors (TPMS), seat-occupancy detectors, and climate-control NTC thermistor interfaces. The 32 MHz CPU speed supports CAN-LIN protocol bridging with software stacks, and the CLC implements hardware-level watchdog and timeout functions. Operating from automotive 12V battery rails (regulated down to 5V or 3.3V), the part tolerates load-dump transients when paired with proper TVS protection. Note: the -I/ML variant is industrial-grade; specify -E/ML for AEC-Q100-like qualification profiles.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FV08KM202-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FV08KM202-E/ML | PIC24FV08KM102-I/ML | PIC24FV08KM102-I/SP | PIC24FV08KM102-E/SS |
|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-SPDIP - different footprint | 28-SSOP - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 8 KB | 8 KB (same) | 16 KB (+100%) | 16 KB (+100%) | 16 KB (+100%) |
| SRAM | 2 KB | 2 KB (same) | 2 KB (same) | 2 KB (same) | 2 KB (same) |
| Operating Voltage | 2.0V to 5.5V | 2.0V to 5.5V (same) | 2.0V to 5.5V (same) | 2.0V to 5.5V (same) | 2.0V to 5.5V (same) |
| Temperature Range | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| ADC Resolution | 12-bit | 12-bit (same) | 12-bit (same) | 12-bit (same) | 12-bit (same) |
| Integrated Op-Amps | 2 | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
Key Differentiators
- XLP nanoampere sleep current with integrated 12-bit ADC, 8-bit DAC, and dual op-amps (vs PIC24FJ64GA002-I/ML)
- Configurable Logic Cell (CLC) for hardware-level custom logic (vs PIC24FJ32GA102-I/ML)
- Wide 2.0V to 5.5V operating range across full industrial temperature (vs PIC24F08KM202 (non-FV))
Design Notes
The XLP architecture delivers sleep currents below 60 nA with RTCC running, but actual current depends heavily on which peripherals remain enabled. Always disable unused peripherals via PMD registers before entering Sleep, and configure unused I/O pins as outputs driven low to avoid floating-input leakage. For battery-life estimation, use the Microchip XLP Battery Life Estimator tool with measured duty-cycle parameters rather than datasheet minimums - typical application currents are 5-10x higher than best-case figures.
The 28-QFN package includes an exposed thermal pad that MUST be soldered to a copper ground plane for proper thermal dissipation. Use an array of thermal vias (typically 9-12 vias, 0.3 mm drill) under the EP to conduct heat to inner PCB copper layers. Per Microchip AN2070 QFN package guidelines, the thermal pad solder paste stencil should be a 1:1 ratio with the pad, and reflow profile should not exceed 260 C peak per J-STD-020 MSL3 classification.
Place a 100 nF decoupling capacitor as close as possible to each VDD pin (typically pins 10 and 20 on the 28-QFN). Add a bulk 4.7 uF or 10 uF tantalum/ceramic capacitor near the MCU VDD for low-frequency noise suppression. Keep analog input traces short and isolated from digital switching signals; use a separate analog ground plane if the design includes precision 12-bit ADC measurements. Per Microchip AN1365 PCB design guidelines, maintain a 0.25 mm clearance between analog and digital ground regions, joined at a single point near the MCU VSS pin.
Do not forget the MCLR pull-up resistor (typically 10 kohm) - leaving MCLR floating can cause erratic resets or programming failures. Configure the Configuration Words (FICD, FWDT, FOSC, etc.) correctly during code development; default unprogrammed configuration bits can result in unexpected oscillator selection or watchdog behavior. The 12-bit ADC requires the AVDD pin to be connected even when not using the ADC, otherwise floating input channels can couple noise into adjacent analog pins.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose PIC24FV08KM202-E/ML for extended temperature operation approaching automotive-grade. Halogen-free per Microchip environmental compliance documentation.
