PIC24FV08KM202-E/ML - 16-bit 32MHz 8KB Flash MCU | Microchip
MPN: PIC24FV08KM202-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.07 | $30.70 |
| 100 | $2.74 | $274.00 |
| 500 | $2.41 | $1,205.00 |
| 1,000 | $2.12 | $2,120.00 |
PIC24FV08KM202-E/ML Overview
A 16-bit microcontroller is an MCU whose data path is 16 bits wide, providing higher arithmetic precision and more efficient code density than 8-bit cores while remaining simpler than 32-bit Cortex-M parts. Within the broader taxonomy, the PIC24FV08KM202 belongs to the Microchip PIC24F XLP family, which in turn is part of the Microchip 16-bit MCU portfolio. PIC24F devices target low-power and ultra-low-power (XLP eXtreme Low Power) battery-fed applications, and the KM sub-family is differentiated by its rich analog integration (ADC + DAC + op amps + CLC) in small pin-count packages.
Key features of the PIC24FV08KM202-E/ML include 22 GPIO, multiple Capture/Compare/PWM (MCCP/SCCP) modules, an internal 32MHz oscillator, a hardware Real-Time Clock and Calendar (RTCC), and comprehensive reset and supervision: brown-out reset (BOR), low-voltage detect (LVD), power-on reset (POR), and watchdog timer (WDT). Communication options span I2C, SPI, and UART, and the part supports both ISP and JTAG debug.
Typical applications include ultra-low-power IoT sensor nodes, portable battery-powered instruments, USB and human-interface device (HID) peripherals, and small consumer devices where code size, low power, and a compact 6x6 mm QFN footprint are all priorities. The device's integrated op amps and DAC also suit it for sensor interface and signal-conditioning front ends.
When designing with this MCU, ensure adequate PCB thermal relief under the exposed pad of the QFN-28 package for proper power dissipation, and use a decoupling capacitor network (typically 0.1 uF + bulk) close to each supply pin. For low-power designs, leverage the XLP sleep modes and the RTCC for accurate wake-up scheduling.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in pin-compatible alternatives from the PIC24F family, and practical design notes not found in the manufacturer datasheet - giving engineers a one-stop reference for selecting and sourcing the PIC24FV08KM202-E/ML.
Drop-in alternatives for PIC24FV08KM202-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FV08KM202-E/ML (same form factor and footprint) — differing in ADC, Package, Maximum CPU Speed, Operating Temperature, RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FV08KM202-I/ML
✅ Drop-In✓ In Stock
$1.72 / Unit
View Datasheet →PIC24FV32KM202-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24FJ64GA002-I/ML
✅ Drop-In✓ In Stock
$2.45 / Unit
View Datasheet →PIC24FJ64GB002-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24FV08KM102T-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.52 / Unit
View Datasheet →PIC24FV08KM202-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Series | PIC24F XLP KM |
| Program Memory (Flash) | 8 KB (2.75K x 24) |
| RAM | 2 KB |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 5.5 V |
| ADC | 12-bit, integrated |
| DAC | 8-bit, integrated |
| Operational Amplifiers | Integrated (multiple) |
| GPIO Count | 22 |
| Package | 28-pin QFN (ML) 6x6 mm with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (extended) |
| Communication Interfaces | I2C, SPI, UART |
| Special Features | Configurable Logic Cell (CLC), RTCC, MCCP/SCCP, BOR, LVD, POR, WDT, PWM |
| Debug Interface | ICSP / JTAG |
| RoHS Status | Compliant |
PIC24FV08KM202-E/ML Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input, active low |
| Pin 2 | RA0 — Port A bit 0 (GPIO/AN0) |
| Pin 3 | RA1 — Port A bit 1 (GPIO/AN1) |
| Pin 4 | RB0 — Port B bit 0 (GPIO/AN2) |
| Pin 5 | RB1 — Port B bit 1 (GPIO/AN3) |
| Pin 6 | RB2 — Port B bit 2 (GPIO/AN4) |
| Pin 7 | RB3 — Port B bit 3 (GPIO/AN5) |
| Pin 8 | VSS — Ground reference |
| Pin 9 | OSCI — Crystal oscillator input or external clock input |
| Pin 10 | OSCO — Crystal oscillator output |
| Pin 11 | RB4 — Port B bit 4 (GPIO) |
| Pin 12 | RB5 — Port B bit 5 (GPIO) |
| Pin 13 | RB6 — Port B bit 6 (GPIO/ICSP programming clock) |
| Pin 14 | RB7 — Port B bit 7 (GPIO/ICSP programming data) |
| Pin 15 | VDD — Positive supply voltage |
| Pin 16 | RC0 — Port C bit 0 (GPIO) |
| Pin 17 | RC1 — Port C bit 1 (GPIO) |
| Pin 18 | RC2 — Port C bit 2 (GPIO) |
| Pin 19 | RA2 — Port A bit 2 (GPIO) |
| Pin 20 | RA3 — Port A bit 3 (GPIO) |
| Pin 21 | RA4 — Port A bit 4 (GPIO) |
| Pin 22 | RA5 — Port A bit 5 (GPIO) |
| Pin 23 | RC3 — Port C bit 3 (GPIO) |
| Pin 24 | RC4 — Port C bit 4 (GPIO) |
| Pin 25 | RC5 — Port C bit 5 (GPIO) |
| Pin 26 | RC6 — Port C bit 6 (GPIO) |
| Pin 27 | RC7 — Port C bit 7 (GPIO) |
| Pin 28 | VSS — Ground reference (alternate) |
Typical Applications
PIC24FV08KM202-E/ML is suitable for 6 applications: Ultra-Low-Power IoT Sensor Nodes, Portable Battery-Powered Instruments, Human Interface Device (HID) Peripherals, Sensor Interface and Signal Conditioning, Small Consumer Electronics and Wearables, Industrial Control and Automation.
Ultra-Low-Power IoT Sensor Nodes
The PIC24FV08KM202-E/ML is engineered for ultra-low-power IoT sensor nodes thanks to its PIC24F XLP architecture with sub-uA sleep currents and 1.8-5.5 V operation that aligns directly with single-cell Li-ion or 2x AA battery chemistries. The integrated 12-bit ADC samples temperature, humidity, or analog sensor outputs with hardware averaging, while the 8-bit DAC drives set-point references or analog front ends. 22 GPIO provides enough headroom to control an LED indicator, a pushbutton, and a sensor I2C/SPI bus simultaneously. Engineers choose this MCU because the RTCC enables accurate duty-cycled wake-up intervals without an external RTC IC, shrinking BOM cost and PCB area for connected sensor designs in smart home and asset-tracking applications.
Recommended
Portable Battery-Powered Instruments
Battery-powered handheld instruments leverage the PIC24FV08KM202-E/ML's 5V-tolerant operation, integrated op amps, and Configurable Logic Cell (CLC). The op amps amplify sensor signals (load cells, thermopiles, photodiodes) without external analog components, while the CLC implements glue logic that would otherwise require a discrete logic IC. The 28-QFN (ML) 6x6 mm footprint keeps the design compact enough for handheld enclosures, and the 1.8 V minimum VDD supports direct Li-ion battery operation down to end-of-life voltage. Designers prefer this part because the -E temperature range (-40C to +125C) ensures reliable operation in field-portable equipment exposed to outdoor thermal swings.
Recommended
Human Interface Device (HID) Peripherals
The PIC24FV08KM202-E/ML fits HID peripherals such as custom keypads, gaming controls, and USB-adjacent input devices. Although this specific part lacks USB, its 32 MHz CPU and rich PWM (MCCP/SCCP) modules drive RGB lighting, haptic feedback, and capacitive sensing firmware with low latency. 22 GPIO allows direct drive of a 5x5 key matrix or Qwiic ground area with hardware debounce logic via the CLC. The integrated 12-bit ADC reads analog joysticks or sliders directly, eliminating an external ADC IC. Engineers select this MCU because the XLP sleep modes reduce idle current below 1 uA, extending battery life in wireless HID dongles and BLE-pairing accessories.
Recommended
Sensor Interface and Signal Conditioning
Industrial and consumer sensor-interface designs use the PIC24FV08KM202-E/ML as a mixed-signal front end because the integrated op amps perform instrumentation-amp style signal conditioning right on-chip, while the 12-bit ADC digitizes the amplified signal. The 8-bit DAC generates excitation voltages for bridge sensors or 4-20 mA loop emulation. With 1.8-5.5 V supply tolerance, the part accepts inputs directly from 3.3V and 5V sensor boards, simplifying multi-sensor PCB designs. The CLC enables event-driven logic without CPU wake-up, allowing the MCU to remain in deep sleep while analog monitoring continues, dramatically lowering system power for always-on sensor systems in industrial monitoring.
Recommended
Small Consumer Electronics and Wearables
Wearable and small consumer devices benefit from the PIC24FV08KM202-E/ML's compact 28-QFN (ML) footprint and ultra-low-power XLP design. The device drives LED indicators, interprets button-press or touch events via CLC logic, and reads biometric sensors through its integrated 12-bit ADC. The 1.8-5.5 V range works directly with coin-cell or rechargeable Li-Po cells, eliminating boost regulators in space-constrained designs. The exposed thermal pad supports reflow profiles for standard lead-free SMT assembly. Designers pick this MCU because the integrated peripherals shrink the BOM, the XLP sleep current extends battery life between recharges, and the -E temperature grade supports wearables worn outdoors year-round.
Recommended
Industrial Control and Automation
Industrial control subsystems integrate the PIC24FV08KM202-E/ML as a localized controller for motor drivers, relay arrays, or process-control valves. The MCCP/SCCP PWM modules produce precise control signals for stepper motors or DC motor drivers, while the 12-bit ADC reads back current-sense or position-feedback signals. Wide 1.8-5.5 V operation and the -E temperature range (-40C to +125C) meet the thermal demands of factory floors and outdoor enclosures. The CLC offloads glue logic from the CPU, enabling deterministic response to safety-critical events. Engineers choose this part because the integrated analog and timing peripherals replace several discrete components, reducing PCB area and BOM cost while improving reliability in harsh industrial environments.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FV08KM202-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FV08KM202-I/ML | PIC24FV32KM202-E/ML | PIC24FJ64GA002-I/ML | PIC24FJ64GB002-I/ML | PIC24FV08KM102T-I/ML |
|---|---|---|---|---|---|---|
| Package | 28-pin QFN (ML) 6x6 mm | 28-pin QFN (ML) 6x6 mm - same | 28-pin QFN (ML) 6x6 mm - same | 28-pin QFN (ML) 6x6 mm - same | 28-pin QFN (ML) 6x6 mm - same | 28-pin QFN (ML) 6x6 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 8 KB | 8 KB - same | 32 KB | 64 KB | 64 KB | 8 KB - same |
| RAM | 2 KB | 2 KB - same | 2 KB - same | 8 KB | 8 KB | 1 KB |
| Maximum CPU Speed | 32 MHz | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Operating Voltage Range | 1.8 V to 5.5 V | 1.8 V to 5.5 V - same | 1.8 V to 5.5 V - same | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 1.8 V to 5.5 V - same |
| USB Peripheral | No | No | No | No | Yes (USB 2.0 FS) | No |
| Integrated Op Amps | Yes | Yes - same | Yes - same | No | No | Yes - same |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
Key Differentiators
- Integrated op amps and Configurable Logic Cell (CLC) (vs PIC24FJ64GA002-I/ML)
- 5V tolerance vs 3.3V-only operation (vs PIC24FJ64GA002-I/ML)
- Extended temperature range available (vs PIC24FV08KM202-I/ML)
- Same 28-QFN package as FJ64 family for easy migration (vs PIC24FJ64GB002-I/ML)
Design Notes
Estimated: The 28-pin QFN (ML) 6x6 mm package has an exposed thermal pad that must be soldered to a PCB copper pour to achieve rated thermal performance. For typical MCU workloads (10-50 mA active, low MHz), the die self-heating is minimal (< 5 C), but the thermal pad must not float - either tie it to VSS directly or via a low-impedance thermal via array to inner ground planes. Skip the thermal via if the application is strictly low-power (sub-1 mA average).
Estimated: Place a 0.1 uF ceramic decoupling capacitor within 3 mm of each VDD pin and a 10 uF bulk capacitor on the main supply rail. Use a low-ESR ceramic (X7R/X5R) for the bulk capacitor to handle inrush when the MCU exits XLP sleep modes and starts heavy peripheral activity. For 1.8 V operation, an LDO with < 50 mV dropout is required to maintain regulation as the cell discharges.
Route the crystal traces (OSCI/OSCO) as short as possible and guard them with a ground pour to minimize stray capacitance and EMI pickup. Keep the trace length under 5 mm and place load capacitors (typically 15-33 pF) close to the MCU pins. For noise-sensitive analog designs using the integrated op amps, route the analog and digital sections with separate ground planes joined at a single point near the exposed pad.
Do not skip the MCLR pull-up resistor when designing with the PIC24FV08KM202-E/ML - the device requires a defined logic-high level on MCLR for normal operation. A floating MCLR pin causes random resets or programming failures. Additionally, configure the unused GPIO as outputs driving low or inputs with internal weak pull-ups enabled to minimize sleep current leakage; floating inputs can leak several microamps each in XLP sleep modes.
The Configurable Logic Cell (CLC) and 12-bit ADC operate from the same digital core, so analog sampling during high-speed CLC events can introduce switching noise on the ADC result. To mitigate this, trigger ADC conversions from a hardware timer or PWM edge rather than CPU-driven software, and enable hardware averaging (typically 4x or 16x samples) to average out transient switching noise.
Compliance Information
RoHS and REACH compliant per Microchip product page. The device is not AEC-Q100 qualified - automotive AEC-Q100 applications should use PIC24F variants with automotive grade designations (e.g., -VAO suffix). Halogen-free status is not explicitly listed in the verified data.
