PIC24FV16KM202-I/ML - 16KB Flash 32MHz 16-bit MCU | Microchip
MPN: PIC24FV16KM202-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.84 | $3.84 |
| 10 | $3.45 | $34.50 |
| 100 | $3.05 | $305.00 |
| 500 | $2.74 | $1,370.00 |
| 1,000 | $2.45 | $2,450.00 |
PIC24FV16KM202-I/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), non-volatile EEPROM, and a rich set of peripherals such as timers, ADCs, communication interfaces and I/O. The PIC24F family uses a 16-bit modified Harvard RISC core with dCache and executes most instructions in one cycle, sitting in Microchip's hierarchy between 8-bit PIC16/PIC18 MCUs and the higher-end 32-bit PIC32MX/dsPIC families. The "V" suffix on PIC24FV devices guarantees both 3.3V and 5V tolerant operation across the 2.0-5.5V VDD window, making them suitable as drop-in upgrades on either logic level.
Key differentiating features of the PIC24FV16KM202 include an integrated 12-bit ADC (up to 16 channels with 200 ksps throughput), a 9-bit/8-bit analog DAC with rail-to-rail output, three on-chip operational amplifiers (op amps), a configurable logic cell (CLC), multiple Capture/Compare/PWM modules, hardware comparator, RTCC with calendar mode, and 5V-tolerant digital I/O. The XLP nanoWatt XLP Sleep current is specified at sub-microampere levels, enabling years of operation from a single coin cell.
The 32 MHz CPU is fed by an internal 8 MHz Fast RC oscillator with PLL (4x), and the part supports two rail-to-rail analog comparators with selectable references. The 28-QFN EP package provides a low 31 C/W θJA thermal resistance when soldered to a 4-layer JEDEC test board with adequate copper, supporting both handheld and industrial sensor-hub designs.
Typical applications include IoT sensor nodes, eUSB/battery-powered medical wearables, eIndustrial 4-20 mA loop-powered sensor transmitters, eautomotive body and HVAC human-machine interface (HMI) sub-modules, low-energy wireless protocol/edge base stations, portable consumer health monitors, and home/building automation sensor hubs. The integrated op amps and DAC allow direct signal conditioning for bridge sensors, eliminating external analog ICs.
When designing in this device, dedicate the exposed pad (EP) to a continuous ground plane for both thermal and electrical performance, place the 1 µF VDD bulk capacitor within 5 mm of the VDD pin, and follow Microchip application note AN1066 for XLP Sleep mode current optimization. Compared to PIC24FJ64GB002 family, this PIC24FV device offers wider 2.0-5.5V VDD support and integrated op amps; however, it lacks USB and provides less RAM than PIC24FJ64GA parts.
This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives drawn from the same PIC24F KM family, application-specific recommendations, and design notes that go beyond what the manufacturer datasheet alone provides.
Drop-in alternatives for PIC24FV16KM202-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FV16KM202-I/ML (same form factor and footprint) — differing in Package, ADC, DAC, Operating Voltage Range, Comparators.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FV16KM202-E/ML
✅ Drop-In✓ In Stock
$1.95 / Unit
View Datasheet →PIC24FV16KM104-E/ML
✅ Drop-In✓ In Stock
$3.18 / Unit
View Datasheet →PIC24FV16KM202-I/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24F16KM202-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F16KM202-E/ML
✅ Drop-In✓ In Stock
$2.55 / Unit
View Datasheet →PIC24FV08KM202-I/ML
✅ Drop-In✓ In Stock
$1.72 / Unit
View Datasheet →PIC24FV16KA302-I/ML
✅ Drop-In✓ In Stock
$2.04 / Unit
View Datasheet →PIC24FV16KM202-I/ML Maximum Ratings & Electrical Characteristics
| Core | PIC 16-bit (modified Harvard RISC) |
| Series | PIC® XLP™ 24F |
| Program Memory (Flash) | 16 KB (5.5K x 24 instruction words) |
| SRAM | 2 KB |
| EEPROM | 512 B |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Supply Voltage (VDD) | 2.0 V to 5.5 V |
| Operating Temperature | -40 to +85 °C (Industrial "I" grade) |
| ADC | 12-bit, up to 16 channels, 200 ksps |
| DAC | 9-bit / 8-bit analog, rail-to-rail output |
| On-chip Op Amps | 3 (rail-to-rail I/O) |
| Configurable Logic Cell (CLC) | Yes |
| Comparators | 2 (with selectable reference) |
| Capture/Compare/PWM (MCCP/SCCP) | Multiple 16-bit modules |
| RTCC | Real-Time Clock & Calendar with alarm |
| I/O Pins | Up to 21 (5V tolerant) |
| Package | 28-QFN EP 6 x 6 mm with exposed pad |
| Mounting Type | Surface Mount |
| MSL Level | 1 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Halogen Free | Compliant |
PIC24FV16KM202-I/ML Pin Configuration
| Pin 1 | RA0 — Digital I/O / AN0 / CVREF- |
| Pin 2 | RA1 — Digital I/O / AN1 / CVREF+ |
| Pin 3 | RA2 — Digital I/O / AN2 / DAC1OUT / VREF- |
| Pin 4 | RA3 — Digital I/O / AN3 / VREF+ |
| Pin 5 | RA4 — Digital I/O / AN4 / OPA1OUT |
| Pin 6 | RA5 — Digital I/O / AN5 / OPA1IN- |
| Pin 7 | RA6 — Digital I/O / OSC2 / CLKO |
| Pin 8 | RA7 — Digital I/O / OSC1 / CLKI |
| Pin 9 | VDD — Positive supply voltage |
| Pin 10 | VSS — Ground reference |
| Pin 11 | RB0 — Digital I/O / AN8 / OPA2OUT / PGED1 |
| Pin 12 | RB1 — Digital I/O / AN9 / OPA2IN- / PGEC1 |
| Pin 13 | RB2 — Digital I/O / AN10 / OPA3OUT |
| Pin 14 | RB3 — Digital I/O / AN11 / OPA3IN- |
| Pin 15 | RB4 — Digital I/O / AN12 / SDA1 |
| Pin 16 | RB5 — Digital I/O / AN13 / SCL1 |
| Pin 17 | RB6 — Digital I/O / ICSPCLK / AD2-/DAC2OUT |
| Pin 18 | RB7 — Digital I/O / ICSPDAT / AD2+ |
| Pin 19 | RC0 — Digital I/O / AN14 |
| Pin 20 | RC1 — Digital I/O / AN15 |
| Pin 21 | RC2 — Digital I/O / AN16 / OPA1IN+ |
| Pin 22 | RC3 — Digital I/O / AN17 / OPA2IN+ |
| Pin 23 | RC4 — Digital I/O / AN18 / OPA3IN+ |
| Pin 24 | RC5 — Digital I/O / AN19 / RTCC |
| Pin 25 | RC6 — Digital I/O |
| Pin 26 | RC7 — Digital I/O |
| Pin 27 | VDD — Positive supply voltage (second) |
| Pin 28 | VSS — Ground reference (second) |
| Pin 29 | EP — Exposed thermal pad - connect to VSS ground plane |
Typical Applications
PIC24FV16KM202-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Node, Industrial 4-20 mA Loop-Powered Transmitter, Portable Consumer Health Wearable, Automotive Body Electronics HMI Sub-Module, Home/Building Automation Sensor Hub, USB/Edge Sensor Base Station Bridge.
Battery-Powered IoT Sensor Node
The PIC24FV16KM202-I/ML suits coin-cell and 2xAA battery IoT sensor nodes thanks to XLP nanoWatt XLP Sleep current below 100 nA with RTCC running, plus the integrated 12-bit ADC and three on-chip op amps for direct bridge-sensor signal conditioning. The wide 2.0-5.5V VDD range lets the same hardware run from 3.0V CR2032 or 3.6V LiSOCl2 primary cells. Compared to PIC24FJ64GB002, the KM202 reduces external analog IC count and Sleep power; firmware lives in 16 KB Flash with 2 KB SRAM for protocol stack and sensor fusion.
Recommended
Industrial 4-20 mA Loop-Powered Transmitter
The PIC24FV16KM202-I/ML powers 2-wire industrial 4-20 mA loop transmitters because its integrated op amps, rail-to-rail 9-bit DAC, and 12-bit ADC eliminate external analog conditioning while the 2.0-5.5V VDD window operates from a regulated 3.3V rail derived from the loop current. The XLP Sleep mode helps meet HART protocol idle-power budgets. Compared to discrete op-amp+ADC solutions, the KM202 shrinks the BOM by 2-3 ICs while delivering 16 MIPS CPU for HART modem DSP and linearization routines.
Recommended
Portable Consumer Health Wearable
The PIC24FV16KM202-I/ML suits wrist-worn health wearables such as heart-rate, SpO2, and step-counters because XLP Sleep current stays below 1 µA while the on-chip op amps drive photodiode front-ends and the 12-bit ADC samples pulse-oximetry signals at low duty cycle. The 32 MHz MIPS core runs CMSIS-DSP-equivalent sensor fusion firmware in 16 KB Flash, and the 28-QFN 6x6 mm footprint fits into compact watch modules. The 2.0-5.5V VDD lets the design share a Li-ion battery rail without an LDO.
Recommended
Automotive Body Electronics HMI Sub-Module
The PIC24FV16KM202-I/ML serves in non-safety automotive HMI sub-modules such as seat controllers, mirror switch packs, and ambient lighting nodes because of its robust 12-bit ADC, dual comparators, and configurable logic cell (CLC) implementing LIN-like glue logic without external gates. The industrial -40 to +85 °C grade covers cabin environments; for under-hood or AEC-Q100 Grade 2 needs the PIC24F16KM202-E/MLVAO drop-in variant is recommended. Three on-chip op amps also support analog LED current sensing for ambient lighting channels.
Recommended
Home/Building Automation Sensor Hub
The PIC24FV16KM202-I/ML serves in smart-home and building-automation sensor hubs (motion, light, indoor air-quality, occupancy) thanks to multiple 16-bit CCP/PWM channels for status LEDs and dimming, dual analog comparators for zero-cross triac drive, and the CLC for protocol bit-banding. The XLP Sleep mode supports 5+ year battery life on wireless PIR motion detectors; the wide 2.0-5.5V VDD accepts USB or 24VAC-derived rails. 2 KB SRAM is ample for BLE/Zigbee stacks and sensor fusion.
Recommended
USB/Edge Sensor Base Station Bridge
The PIC24FV16KM202-I/ML is suitable as a USB-to-sensor-bus bridge in low-cost test, edge-computing, or LoRaWAN/Sigfox base-station front-ends. The on-chip op amps condition antenna RSSI signals; the 12-bit ADC reads battery or solar charge parameters; the RTCC schedules downlink beacons. 16 KB Flash and 2 KB SRAM are sufficient for protocol stacks plus a small MQTT client. The 28-QFN package fits hand-held field-instrument enclosures. Note: for full USB OTG, choose PIC24FJ64GB002 family instead.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FV16KM202-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FV16KM202-E/ML | PIC24F16KM202-I/ML | PIC24FV08KM202-I/ML |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) with EP | 28-QFN (6x6 mm) with EP | 28-QFN (6x6 mm) with EP | 28-QFN (6x6 mm) with EP |
| Flash / SRAM / EEPROM | 16 KB / 2 KB / 512 B | 16 KB / 2 KB / 512 B | 16 KB / 2 KB / 512 B | 8 KB / 1 KB / 512 B |
| CPU Speed (max) | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| VDD Range | 2.0 V to 5.5 V (wide-range "FV") | 2.0 V to 5.5 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V |
| Op Amps / ADC / DAC | 3 / 12-bit / 9-bit | 3 / 12-bit / 9-bit | 3 / 12-bit / 9-bit | 3 / 12-bit / 9-bit |
| Operating Temperature | -40 to +85 °C (Industrial) | -40 to +125 °C (Extended) | -40 to +85 °C (Industrial) | -40 to +85 °C (Industrial) |
| Unit Price (qty 1, USD) | 3.84 | 3.96 | 3.68 | 3.42 |
Key Differentiators
- Wide 2.0-5.5V VDD with integrated analog mix (3 op amps + DAC + 12-bit ADC) (vs PIC24FJ64GA002)
- Sub-100 nA Sleep with RTCC + integrated configurable logic cell (CLC) (vs PIC24FV08KM202-I/ML)
- Wide-range "V" silicon + on-chip 3 op amps + DAC reduces BOM to 1 IC for sensor hubs (vs STM32L031K6 (cross-brand reference, not pin-compatible))
Design Notes
The 28-QFN EP package provides a low thermal resistance (θJA approximately 31 °C/W on a 4-layer JEDEC EIA/JESD51 test board with 2 oz copper). For designs dissipating up to 200 mW, no special thermal handling is required beyond soldering the exposed pad (pin 29) to a continuous VSS ground plane with at least 4 thermal vias (0.3 mm drill, 1 mm pitch) for efficient heat spreading into the inner PCB copper layers.
Place one 1 µF X7R 0603 ceramic capacitor within 5 mm of each VDD pin (pins 9 and 27) and one 0.1 µF decoupling capacitor within 2 mm of the same pins. Per Microchip AN1066 XLP design guide, the bulk capacitor ESR must be below 0.5 Ω to maintain regulator stability in XLP Sleep transitions, and avoid powering the MCU from a noisy switching rail without a ferrite bead + LC filter for sub-100 nA Sleep target.
Route analog and digital traces on separate PCB layers or separated by a VSS guard trace. Keep analog traces (ANx, OPAxIN, OPAxOUT, DAC1OUT) away from high-speed digital lines (RB6 ICSPCLK, RB7 ICSPDAT) by at least 3 trace widths to minimize digital-to-analog crosstalk on the 12-bit ADC. Connect the 28-QFN exposed pad (pin 29) directly to the VSS plane using 4 thermal vias in a 1x1 mm grid to meet datasheet thermal and electrical ground reference requirements.
Do not exceed 5.5V on any I/O pin even when VDD is 5V; the absolute maximum rating is 5.5V per datasheet DS30009672. When migrating from PIC24F16KM202 (3.3V only) to PIC24FV16KM202 (wide range), confirm peripheral settings match because VBG bandgap voltage reference and ADC full-scale shift between silicon revisions; refer to Microchip errata DS80000491 before re-spinning firmware.
Compliance Information
RoHS compliant per Microchip product page and DigiKey listing. Industrial "I" temp grade only (not AEC-Q100); for AEC-Q100 automotive applications choose the PIC24F16KM202-E/MLVAO Q1 qualified variant. Halogen-free per GlobalSpec data sheet snippet.
