PIC32MX675F256H-80V/MR - 80MHz 256KB Flash MCU | Microchip
MPN: PIC32MX675F256H-80V/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.25 | $7.25 |
| 10 | $6.55 | $65.50 |
| 100 | $5.82 | $582.00 |
| 500 | $5.18 | $2,590.00 |
| 1,000 | $4.62 | $4,620.00 |
PIC32MX675F256H-80V/MR Overview
A PIC32MX microcontroller is a 32-bit MIPS-based MCU from Microchip designed to bridge the gap between traditional 8/16-bit PIC controllers and high-end Cortex-M devices. The PIC32 family uses a 5-stage Harvard pipeline and the MIPS16e instruction set, allowing up to 40% smaller code size for compact code. Positioned in the hierarchy MCU -> 32-bit MCU -> MIPS M4K core -> connected MCU, the PIC32MX5/6/7 series specifically targets embedded connectivity.
Key features include 80MHz core speed (105 DMIPS), 256KB Flash, 64KB RAM, USB-OTG with on-chip PHY, 10/100 Ethernet MAC, 53 general-purpose I/O lines, 4 dedicated DMA channels, two I2C, two SPI, five UART, two CAN, and a 16-channel 10-bit ADC. The device supports 2.3V to 3.6V single-supply operation, drawing 73mA/MIPS at full speed. The VQFN-64 9x9 package exposes the thermal pad for improved thermal performance.
The PIC32MX675 uses the MIPS M4K core with hardware multiply/divide, shadow register sets, and a deterministic interrupt controller. Code density is enhanced by MIPS16e compressed instructions. The on-chip USB-OTG PHY and dedicated DMA path eliminate the need for an external PHY and reduce CPU load for full-speed and high-speed USB stacks. Ethernet MAC, USB, and DMA work together, with IPv4 checksum offload to enable robust TCP/IP stacks on a single chip.
Typical applications include industrial Ethernet nodes, USB peripherals and embedded hosts, building automation controllers, point-of-sale terminals, and connected medical devices. The combination of USB-OTG, Ethernet, CAN, and ample GPIO is well suited to factory automation, bridging sensors and HMIs to Ethernet/USB networks.
When designing with this device, ensure the 64-VQFN thermal pad is soldered to a sufficiently large copper pour for heat dissipation, and route the USB DP/DN lines as a 90 ohm differential pair per USB specifications. MPLAB Harmony provides integrated middleware for TCP/IP, USB, and graphics, reducing development time.
This page combines distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet summary.
Drop-in alternatives for PIC32MX675F256H-80V/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX675F256H-80V/MR (same form factor and footprint) — differing in ADC, Ethernet, Operating Temperature, Package, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX675F256H-80I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MX675F256H-V/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MX575F256H-80V/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MX675F256LT-80V/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX675F512H-80V/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX675F256H-80V/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K (32-bit, 5-stage pipeline) |
| Maximum CPU Clock | 80 MHz (105 DMIPS) |
| Program Flash Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| I/O Pins | 53 |
| USB | USB 2.0 OTG with integrated PHY |
| Ethernet | 10/100 MAC with MII/RMII |
| DMA Channels | 4 (dedicated for USB OTG) |
| ADC | 16-channel, 10-bit |
| Communication Peripherals | 2x I2C, 2x SPI, 5x UART, 2x CAN |
| Timers | 5x 16-bit or 2x 32-bit |
| Operating Temperature | -40C to +105C (industrial, 'V' suffix) |
| Package | 64-pin VQFN (9x9 mm) with EP |
| Instruction Set Extensions | MIPS16e for up to 40% smaller code |
| RoHS Status | Compliant |
PIC32MX675F256H-80V/MR Pin Configuration
| Pin 1 | RB15 — General-purpose I/O |
| Pin 2 | RB14 — General-purpose I/O |
| Pin 3 | RB13 — General-purpose I/O / AN13 |
| Pin 4 | RB12 — General-purpose I/O / AN12 |
| Pin 5 | RB11 — General-purpose I/O / AN11 |
| Pin 6 | RB10 — General-purpose I/O / AN10 |
| Pin 7 | RB9 — General-purpose I/O / AN9 |
| Pin 8 | RB8 — General-purpose I/O / AN8 |
| Pin 9 | RB7 — General-purpose I/O / AN7 |
| Pin 10 | RB6 — General-purpose I/O / AN6 |
| Pin 11 | RB5 — General-purpose I/O / AN5 |
| Pin 12 | RB4 — General-purpose I/O / AN4 |
| Pin 13 | RB3 — General-purpose I/O / AN3 |
| Pin 14 | RB2 — General-purpose I/O / AN2 |
| Pin 15 | RB1 — General-purpose I/O / AN1 |
| Pin 16 | RB0 — General-purpose I/O / AN0 |
| Pin 17 | VDD — Power supply 2.3-3.6V |
| Pin 18 | VSS — Ground |
| Pin 19 | RF13 — General-purpose I/O / USB D- related |
| Pin 20 | RF12 — General-purpose I/O / USB D+ related |
| Pin 21 | RF5 — General-purpose I/O |
| Pin 22 | RF4 — General-purpose I/O |
| Pin 23 | RF3 — General-purpose I/O |
| Pin 24 | RF2 — General-purpose I/O |
| Pin 25 | RF1 — General-purpose I/O |
| Pin 26 | RF0 — General-purpose I/O |
| Pin 27 | RD9 — General-purpose I/O |
| Pin 28 | RD8 — General-purpose I/O |
| Pin 29 | RD7 — General-purpose I/O |
| Pin 30 | RD6 — General-purpose I/O |
| Pin 31 | RD5 — General-purpose I/O |
| Pin 32 | RD4 — General-purpose I/O |
| Pin 33 | RD3 — General-purpose I/O |
| Pin 34 | RD2 — General-purpose I/O |
| Pin 35 | RD1 — General-purpose I/O |
| Pin 36 | RD0 — General-purpose I/O |
| Pin 37 | RC15 — General-purpose I/O |
| Pin 38 | RC14 — General-purpose I/O |
| Pin 39 | RC13 — General-purpose I/O |
| Pin 40 | RC12 — General-purpose I/O |
| Pin 41 | VDD — Power supply 2.3-3.6V |
| Pin 42 | VSS — Ground |
| Pin 43 | RG15 — General-purpose I/O |
| Pin 44 | RG14 — General-purpose I/O |
| Pin 45 | RG13 — General-purpose I/O |
| Pin 46 | RG12 — General-purpose I/O |
| Pin 47 | RG9 — General-purpose I/O |
| Pin 48 | RG8 — General-purpose I/O |
| Pin 49 | RG7 — General-purpose I/O |
| Pin 50 | RG6 — General-purpose I/O |
| Pin 51 | RA15 — General-purpose I/O |
| Pin 52 | RA14 — General-purpose I/O |
| Pin 53 | RA9 — General-purpose I/O / MCLR |
| Pin 54 | RA1 — General-purpose I/O |
| Pin 55 | RA0 — General-purpose I/O |
| Pin 56 | VSS — Ground |
| Pin 57 | VDD — Power supply 2.3-3.6V |
| Pin 58 | RF6 — General-purpose I/O |
| Pin 59 | RC1 — General-purpose I/O |
| Pin 60 | RC2 — General-purpose I/O |
| Pin 61 | RC3 — General-purpose I/O |
| Pin 62 | RC4 — General-purpose I/O |
| Pin 63 | OSC1 — Crystal oscillator input |
| Pin 64 | OSC2 — Crystal oscillator output |
Typical Applications
PIC32MX675F256H-80V/MR is suitable for 6 applications: Industrial Ethernet Gateway, USB-OTG Embedded Host/Device, Building Automation Controller, Point-of-Sale Terminal, Connected Medical Device, Industrial CAN Bus Node.
Industrial Ethernet Gateway
The PIC32MX675F256H-80V/MR's integrated 10/100 Ethernet MAC with MII/RMII interfaces and 64KB SRAM makes it ideal for industrial Ethernet gateway designs. The 80MHz MIPS M4K core (105 DMIPS) sustains TCP/IP stack processing while DMA offloads packet buffering, and the on-chip MAC connects to a 25 MHz external PHY such as the LAN8720A or DP83848. With VDD 2.3-3.6V and -40C to +105C industrial temperature rating, it handles IEC 60068-2 industrial environments without additional thermal management, while the 64-VQFN exposed pad provides heat dissipation for continuous full-speed operation.
Recommended
USB-OTG Embedded Host/Device
The PIC32MX675F256H-80V/MR integrates a USB 2.0 On-The-Go controller with PHY and a dedicated DMA channel, eliminating the external PHY and reducing CPU load. The 4 DMA channels offload endpoint data transfer while the 80MHz core handles USB stacks (HID, CDC, MSD) and application logic. The 64KB SRAM buffers USB descriptors and double-buffered endpoint data, supporting both host mode (for connecting peripherals) and device mode. Its industrial temperature range suits factory and field deployments.
Recommended
Building Automation Controller
The PIC32MX675F256H-80V/MR combines Ethernet, USB, 5x UART, 2x CAN, and 53 GPIO in one chip - perfect for building automation controllers that bridge KNX/CAN fieldbus to IP networks. The 80MHz core and 256KB Flash run protocols like BACnet or Modbus TCP, while the 64KB SRAM buffers multiple concurrent TCP sockets. Industrial -40C to +105C operation handles unconditioned equipment rooms. The 64-VQFN 9x9 mm footprint keeps PCB density high for DIN-rail mounted controllers.
Recommended
Point-of-Sale Terminal
The PIC32MX675F256H-80V/MR's USB-OTG, Ethernet, and 16-channel 10-bit ADC support point-of-sale terminals with barcode scanners, receipt printers, magnetic-stripe readers, and Ethernet backhaul. The 80MHz MIPS M4K core processes payment protocols, while 256KB Flash holds application code, fonts, and TLS libraries. The 5 UARTs interface with peripherals, and the ADC reads battery voltage and thermal sensors. Compact 64-VQFN 9x9 mm allows thin POS enclosure designs.
Recommended
Connected Medical Device
The PIC32MX675F256H-80V/MR powers connected medical devices requiring reliable Ethernet/USB connectivity for patient data transfer. Its 80MHz processing and 64KB SRAM run lightweight TLS stacks; its 16-channel ADC digitizes analog sensor inputs. The -40C to +105C industrial temperature rating supports clinical environment use. The integrated USB-OTG enables direct connection to PCs during service and configuration. The 64-VQFN package supports compact, sealed enclosure requirements typical of medical devices.
Recommended
Industrial CAN Bus Node
The PIC32MX675F256H-80V/MR's dual CAN interfaces and 80MHz core make it suitable for industrial CAN bus nodes and bridges. CAN bus traffic at 1 Mbit/s is handled by the dedicated CAN controllers while the core processes higher-layer protocols like CANopen or J1939. The 53 GPIO pins connect to digital sensors, LEDs, and operator panels. The -40C to +105C temperature range and 2.3V-3.6V single supply simplify industrial power designs. The 64-VQFN exposed pad ensures reliable thermal performance in enclosed cabinets.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX675F256H-80V/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX675F256H-80I/MR | PIC32MX675F256LT-80V/MR | PIC32MX675F512H-80V/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Core Speed | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 512 KB (+100%) |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB |
| Temperature Grade | -40C to +105C (V) | -40C to +85C (I) | -40C to +105C (V) | -40C to +105C (V) |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) |
| USB OTG | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) |
Key Differentiators
- Industrial +105C temperature grade with Ethernet+USB (vs PIC32MX675F256H-80I/MR)
- Upgradable to 512KB Flash on same footprint (vs PIC32MX675F512H-80V/MR)
- Full USB-OTG with on-chip PHY (vs PIC32MX575F256H-80V/MR)
Design Notes
The 64-pin VQFN (9x9 mm) package has an exposed thermal pad that MUST be soldered to a PCB copper pour of at least 1 square inch for thermal relief. Without proper pad soldering, junction temperature can rise above the +105C industrial limit under full 80MHz operation. Recommended: 4-layer PCB with continuous ground plane under the device; thermal vias (0.3mm, 1.2mm pitch) between pad and inner ground plane reduce junction-to-ambient thermal resistance significantly.
Route the USB DP/DN signals as a 90 ohm differential pair per USB 2.0 specification, with matched trace lengths (within 150 mil), characteristic impedance of 90 ohms differential, and no stubs. Keep DP/DN away from clock traces and noisy switching signals. Place the 27 pF USB reference capacitor and ferrite bead as close to the VBUS pin as possible. Refer to Microchip Application Note AN612 for PCB layout checklists.
Place 100 nF decoupling capacitors within 3 mm of every VDD pin (pins 17, 41, 57) and a bulk 4.7-10 uF tantalum or ceramic capacitor near the IC. The PIC32MX675 has multiple VDD pins that must each be decoupled. Use a ferrite bead between analog AVDD and digital VDD if precision ADC readings are required. MPLAB X11 power configurations in Harmony help validate sequencing at startup.
Ensure the MCLR reset circuit includes a 1 kΩ pull-up to VDD5V and a 10 nF capacitor to ground for proper POR. Do not connect JTAG pins TMS/TCK/TDO/TDI to GPIO without configuring them as alternate-function in PPS. The 'L' vs 'L' suffix in PIC32MX570 parts does not mean Ethernet-less - only the '5' suffix (PIC32MX575) removes Ethernet MAC. Always cross-check the full datasheet ordering nomenclature before design-in.
Compliance Information
RoHS and REACH compliant per DigiKey product listing; lead-free and halogen-free per Microchip product page. Not AEC-Q100 qualified - this part targets industrial/consumer, not automotive. For automotive PIC32 options, see PIC32MX variants with V automotive suffix.
