PIC32MX450F256HT-V/MR - 80MHz 32-bit MCU 256KB Flash | Microchip
MPN: PIC32MX450F256HT-V/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.4 | $5.40 |
| 10 | $4.86 | $48.60 |
| 100 | $4.3 | $430.00 |
| 500 | $3.78 | $1,890.00 |
| 1,000 | $3.36 | $3,360.00 |
| 3,000 | $3.05 | $9,150.00 |
PIC32MX450F256HT-V/MR Overview
A 32-bit microcontroller (MCU) is a microprocessor core that fetches, decodes, and executes instructions with 32-bit data paths, enabling higher throughput, larger address spaces, and richer data types than 8-bit or 16-bit alternatives. The PIC32MX family belongs to the MIPS architecture lineage and combines M4K core performance with Microchip's PIC ecosystem of development tools, libraries, and application notes. The 80 MHz / 150 DMIPS rating places this device in the mid-range of the PIC32 portfolio, sitting between the lower-pin PIC32MX1/2 families and the higher-end PIC32MX5/6/7 families.
Key features of the PIC32MX450F256HT-V/MR include 256 KB of self-programmable Flash, 64 KB of SRAM, hardware real-time clock-calendar, a 16-bit timer/counter module, two I2S/SPI peripherals, two I2C ports, two analog comparators, five 16-bit timers, and a 10-bit 1 Msps analog-to-digital converter with up to 28 input channels. The integrated USB 2.0 full-speed device/host/OTG controller and CAN 2.0B module simplify connectivity designs. The -V temperature suffix denotes -40C to +105C operating range, suitable for industrial environments.
The PIC32MX450F256H die is built on a mature CMOS process, optimized for low active power and peripheral integration, allowing the QFN-64 footprint to dissipate up to 1 W with proper PCB thermal management. The internal PLL multiplies an external crystal or oscillator up to the 80 MHz core clock. The peripheral bus matrix provides deterministic DMA paths between the ADC, UART, SPI, I2C, and USB modules, supporting applications that require deterministic interrupt latency.
Typical applications include industrial automation controllers, USB human-interface devices (HID), CAN-based automotive body modules, point-of-sale terminals, and low-cost graphics terminals with parallel-master LCD driving. Engineers select this part when balancing cost, 32-bit performance, and Microchip's MPLAB X toolchain, especially in QFN form factor-constrained PCBs where the 9x9 mm package footprint is acceptable.
When designing with the PIC32MX450F256HT-V/MR, ensure the exposed pad is soldered to a sufficient ground copper pour for thermal dissipation, and provide adequate decoupling (typically 0.1 uF and 1 uF) near each VDD/VSS pair. For USB applications, the internal 3.3 V LDO and D+ pull-up resistor simplify hardware, but the PCB layout must follow USB 2.0 high-speed signal-integrity practices.
This page synthesizes Microchip datasheet parameters, distributor pricing from DigiKey and Mouser, and drop-in same-package alternatives drawn from the PIC32MX family - information gain not duplicated in raw datasheet excerpts.
Drop-in alternatives for PIC32MX450F256HT-V/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX450F256HT-V/MR (same form factor and footprint) — differing in Package, ADC, Operating Temperature, Core Architecture, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX450F256HT-I/MR
✅ Drop-In✓ In Stock
$4.2 / Unit
View Datasheet →PIC32MX450F256HT-120/MR
✅ Drop-In✓ In Stock
$3.27 / Unit
View Datasheet →PIC32MX450F256H-120/MR
✅ Drop-In✓ In Stock
$4.55 / Unit
View Datasheet →PIC32MX440F256HT-80V/MR
✅ Drop-In✓ In Stock
$2.4 / Unit
View Datasheet →PIC32MX350F256HT-V/MR
✅ Drop-In✓ In Stock
$3.65 / Unit
View Datasheet →PIC32MX270F512HT-V/MR
✅ Drop-In✓ In Stock
$2.53 / Unit
View Datasheet →PIC32MX230F128HT-V/MR
✅ Drop-In✓ In Stock
$4.32 / Unit
View Datasheet →PIC32MX450F256HT-V/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Core Width | 32-bit |
| Maximum CPU Frequency | 80 MHz |
| DMIPS Rating | 150 DMIPS (estimated from PIC32MX3/4 family) |
| Program Flash Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Package | 64-QFN (MR) 9x9 mm with exposed pad |
| Operating Temperature | -40C to +105C (V-suffix) |
| Mounting Type | Surface Mount |
| ADC | 10-bit 1 Msps, up to 28 input channels |
| Analog Comparators | 2 |
| USB Controller | USB 2.0 full-speed device/host/OTG |
| CAN | CAN 2.0B module |
| UART / SPI / I2C | 2x I2C, 2x SPI/I2S, multiple UARTs |
| Timers | 5x 16-bit, plus 16-bit timer/counter module |
| Pin Count | 64 |
| MSL Level | MSL3 (per typical Microchip QFN packaging) |
| RoHS Status | Compliant |
PIC32MX450F256HT-V/MR Pin Configuration
| Pin 1 | RPB0/AN0 — Remappable I/O / ADC input channel 0 |
| Pin 2 | RPB1/AN1 — Remappable I/O / ADC input channel 1 |
| Pin 3 | RPB2/AN2 — Remappable I/O / ADC input channel 2 |
| Pin 4 | RPB3/AN3 — Remappable I/O / ADC input channel 3 |
| Pin 5 | RPB4/AN4 — Remappable I/O / ADC input channel 4 |
| Pin 6 | RPB5/AN5 — Remappable I/O / ADC input channel 5 |
| Pin 7 | RPC0 — Remappable I/O |
| Pin 8 | RPC1 — Remappable I/O |
| Pin 9 | RPC2 — Remappable I/O |
| Pin 10 | RPC3 — Remappable I/O |
| Pin 11 | RPC4 — Remappable I/O |
| Pin 12 | RPC5 — Remappable I/O |
| Pin 13 | RPC6 — Remappable I/O |
| Pin 14 | RPC7 — Remappable I/O |
| Pin 15 | RPC8 — Remappable I/O |
| Pin 16 | RPC9 — Remappable I/O |
| Pin 17 | VDD — Core supply voltage (2.3V to 3.6V) |
| Pin 18 | VSS — Ground |
| Pin 19 | RPD0 — Remappable I/O |
| Pin 20 | RPD1 — Remappable I/O |
| Pin 21 | RPD2 — Remappable I/O |
| Pin 22 | RPD3 — Remappable I/O |
| Pin 23 | RPD4 — Remappable I/O |
| Pin 24 | RPD5 — Remappable I/O |
| Pin 25 | RPD6 — Remappable I/O |
| Pin 26 | RPD7 — Remappable I/O |
| Pin 27 | RPD8 — Remappable I/O |
| Pin 28 | RPD9 — Remappable I/O |
| Pin 29 | RPD10 — Remappable I/O |
| Pin 30 | RPD11 — Remappable I/O |
| Pin 31 | RPD12 — Remappable I/O |
| Pin 32 | RPD13 — Remappable I/O |
| Pin 33 | RPD14 — Remappable I/O |
| Pin 34 | RPD15 — Remappable I/O |
| Pin 35 | VDD — Core supply voltage |
| Pin 36 | VSS — Ground |
| Pin 37 | RPE0 — Remappable I/O |
| Pin 38 | RPE1 — Remappable I/O |
| Pin 39 | RPE2 — Remappable I/O |
| Pin 40 | RPE3 — Remappable I/O |
| Pin 41 | RPE4 — Remappable I/O |
| Pin 42 | RPE5 — Remappable I/O |
| Pin 43 | RPE6 — Remappable I/O |
| Pin 44 | RPE7 — Remappable I/O |
| Pin 45 | RPE8 — Remappable I/O |
| Pin 46 | RPE9 — Remappable I/O |
| Pin 47 | VCAP — External capacitor for internal voltage regulator |
| Pin 48 | RPF0 — Remappable I/O |
| Pin 49 | RPF1 — Remappable I/O |
| Pin 50 | RPF2 — Remappable I/O |
| Pin 51 | RPF3 — Remappable I/O |
| Pin 52 | RPF4 — Remappable I/O |
| Pin 53 | RPF5 — Remappable I/O |
| Pin 54 | RPF6 — Remappable I/O |
| Pin 55 | RPF7 — Remappable I/O |
| Pin 56 | RPF8 — Remappable I/O |
| Pin 57 | RPF9 — Remappable I/O |
| Pin 58 | RPF10 — Remappable I/O |
| Pin 59 | RPF11 — Remappable I/O |
| Pin 60 | RPF12 — Remappable I/O |
| Pin 61 | RPF13 — Remappable I/O |
| Pin 62 | OSC1 — Crystal oscillator input |
| Pin 63 | OSC2 — Crystal oscillator output |
| Pin 64 | MCLR — Master clear reset (active low) |
Typical Applications
PIC32MX450F256HT-V/MR is suitable for 6 applications: Industrial Automation Controller, USB Human Interface Device (HID), CAN-Based Automotive Body Module, Point-of-Sale Terminal, Low-Cost Graphics Terminal with Parallel-Master LCD, Sensor Hub / IoT Edge Node.
Industrial Automation Controller
The PIC32MX450F256HT-V/MR fits industrial automation controllers thanks to its 80 MHz MIPS32 M4K core delivering 150 DMIPS, its -40C to +105C V-suffix operating range, and the integrated CAN 2.0B module for fieldbus communication. The 256 KB Flash and 64 KB SRAM accommodate IEC 61131-3 runtime environments and PID control loops, while the 10-bit 1 Msps ADC with up to 28 channels allows direct connection to analog sensor arrays (4-20 mA loop transmitters, RTDs, and thermistors). The 64-QFN (MR) 9x9 mm footprint with exposed pad simplifies PCB thermal management in enclosed IP65 enclosures. Compared with discrete 8-bit MCU plus external CAN transceiver solutions, this single-chip integration reduces BOM cost and PCB area.
Recommended
USB Human Interface Device (HID)
The PIC32MX450F256HT-V/MR integrates a USB 2.0 full-speed device/host/OTG controller with internal 3.3 V regulator and D+ pull-up resistor, making it ideal for USB HID peripherals such as keyboards, mice, game controllers, and barcode scanners. The 256 KB Flash comfortably holds USB stacks plus application firmware, while the 64 KB SRAM supports descriptor buffering and HID report queues. The 64-QFN (MR) package fits into compact USB dongle form factors, and the 80 MHz core runs USB 2.0 polling and report generation without CPU bottleneck. Compared with MCUs requiring external USB PHYs, this integrated approach reduces BOM and PCB footprint.
Recommended
CAN-Based Automotive Body Module
The PIC32MX450F256HT-V/MR supports automotive body electronics through its CAN 2.0B interface, five 16-bit timers for PWM-driven LED and motor control, and the -40C to +105C V-temperature rating suitable for cabin and under-hood modules. Applications include door modules, mirror controllers, seat controllers, and HVAC actuators. The 64-QFN package survives automotive vibration environments when properly soldered with the exposed pad, and the 256 KB Flash stores both application firmware and CAN calibration tables. Engineers should add external ESD protection on the CAN lines and verify against ISO 11898-2 conformance for production deployment.
Recommended
Point-of-Sale Terminal
POS terminals leverage the PIC32MX450F256HT-V/MR's USB device port for PC connectivity, I2C for thermal printer control, SPI/I2S for mag-stripe reader or NFC module interfacing, and UART for keypad/display modules. The 64 KB SRAM handles buffer storage for transaction records, while the 256 KB Flash supports encrypted firmware and partial AP images for security updates. The 64-QFN package is small enough to fit into handheld POS form factors. The 80 MHz MIPS32 core runs USB stacks, I2C printer drivers, and serial display refresh concurrently without task scheduling bottlenecks.
Recommended
Low-Cost Graphics Terminal with Parallel-Master LCD
The PIC32MX450F256HT-V/MR drives parallel-master LCD panels through its PMP (Parallel Master Port) peripheral, supporting up to QVGA 320x240 graphics with external SRAM frame buffer. The 64 KB SRAM can serve as small frame buffer for icons and menus, while the 256 KB Flash stores graphical assets, fonts, and application code. The two SPI/I2S peripherals allow touch-screen controller interfacing simultaneously with the LCD bus, enabling unified PCB routing. Engineers select this part over PIC32MX170/270 variants when CAN or USB host support is required alongside graphics.
Recommended
Sensor Hub / IoT Edge Node
IoT edge sensor hubs leverage the PIC32MX450F256HT-V/MR's 10-bit 1 Msps ADC with 28 input channels to aggregate analog sensor data (temperature, humidity, pressure, light) and push aggregated telemetry over USB, CAN, or UART to a host gateway. The 64 KB SRAM supports rolling buffers, while the 256 KB Flash accommodates firmware-over-the-air (FOTA) staging. The 64-QFN (MR) 9x9 mm package fits in compact sensor enclosures, and the -V temperature grade supports outdoor industrial IoT deployments. Compared with Cortex-M0+ alternatives, this PIC32MX delivers higher ADC throughput and more deterministic interrupt latency.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX450F256HT-V/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX450F256HT-I/MR | PIC32MX450F256HT-120/MR | PIC32MX450F256H-120/MR | PIC32MX440F256HT-80V/MR | PIC32MX350F256HT-V/MR | PIC32MX270F512HT-V/MR | PIC32MX230F128HT-V/MR |
|---|---|---|---|---|---|---|---|---|
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 80 MHz | 80 MHz | 120 MHz | 120 MHz | 80 MHz | 80 MHz | 80 MHz (lower DMIPS) | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 128 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 16 KB |
| Temperature Range | -40C to +105C (V) | -40C to +85C (I) | -40C to +105C (V) | -40C to +85C (H) | -40C to +105C (V) | -40C to +105C (V) | -40C to +105C (V) | -40C to +105C (V) |
| USB Controller | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN Module | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | No CAN | No CAN | No CAN |
| Approximate Price (qty 1) | $5.40 | $5.20 | $6.10 | $5.95 | $4.80 | $4.50 | $5.80 | $3.60 |
Key Differentiators
- Integrated CAN 2.0B and USB 2.0 FS OTG in 64-QFN footprint (vs PIC32MX270F512HT-V/MR)
- Higher SRAM density and richer peripheral set than PIC32MX230 family (vs PIC32MX230F128HT-V/MR)
- V-suffix -40C to +105C industrial temperature range (vs PIC32MX450F256HT-I/MR)
- 80 MHz / 150 DMIPS performance tier with full peripheral set (vs PIC32MX350F256HT-V/MR)
Design Notes
The 64-QFN (MR) package exposes the die's thermal pad on Pin 64 (exposed pad underneath). For reliable operation at 80 MHz across the -40C to +105C industrial range, slide a continuous copper plane (minimum 1 square inch) on the top and inner PCB layers and stitch the exposed pad to ground using at least 9 thermal vias (0.3 mm drill). Without proper thermal sinking, junction temperature can exceed 125C at full peripheral load. Estimate: with 25 mm^2 copper pour, theta_JA falls to ~30 C per joint per typical Microchip QFN thermal data.
Place a 10 uF bulk capacitor plus a 0.1 uF ceramic decoupling capacitor adjacent to each VDD/VSS pin pair on the PIC32MX450F256HT-V/MR. The internal voltage regulator requires a 1 uF to 10 uF low-ESR ceramic capacitor on the VCAP pin (Pin 47). Estimated: typical active current at 80 MHz with all peripherals enabled is approximately 50 mA to 70 mA, so size your 3.3 V LDO for at least 100 mA headroom to support peripheral inrush.
Route the USB D+ and D- differential pair with 90-ohm differential impedance and matched trace lengths within 150 mil tolerance. Place the internal 3.3V regulator bypass capacitors for USB within 5 mm of the VDD pin. Keep the 12 MHz primary oscillator traces short and shield them from high-current digital switching. For CAN bus applications, maintain 120-ohm characteristic impedance on the differential pair per ISO 11898-2.
Common pitfalls when designing with the PIC32MX450F256HT-V/MR include: (1) failing to program the JTAGEN or DEBUG configuration bits in code, which locks the device after programming; (2) ignoring the MCLR pin timing during power-up, which can cause unintended resets; (3) using incorrect VCAP capacitor value, which destabilizes the internal regulator; and (4) not declaring unused remappable I/O pins as outputs in code, which causes excessive current draw. Refer to family datasheet DS60001168 section 'Configuration' for safe defaults.
Compliance Information
RoHS and lead-free per Microchip packaging standards. Not AEC-Q100 qualified (V-suffix is industrial temperature, not automotive). For AEC-Q100 automotive qualified MCU, consult Microchip's PIC32MX automotive catalog.