PIC32MX675F512HT-80V/MR - 80MHz 32-bit MCU 512KB Flash USB-Ethernet | Microchip
MPN: PIC32MX675F512HT-80V/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.72 | $9.72 |
| 10 | $8.94 | $89.40 |
| 100 | $7.96 | $796.00 |
| 500 | $6.78 | $3,390.00 |
| 1,000 | $6.05 | $6,050.00 |
PIC32MX675F512HT-80V/MR Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals (UART, SPI, I2C, ADC, timers, I/O). The PIC32 family extends this concept into the 32-bit MIPS M4K domain, delivering 1.56 DMIPS/MHz instruction throughput with deterministic interrupt latency. PIC32MX5/6/7 series parts are differentiated from smaller PIC32 variants by their integrated Ethernet MAC, making them a sub-category of connected/IoT-ready 32-bit microcontrollers within the broader microcontroller taxonomy.
Key specifications include 80 MHz core clock with up to 80 MIPS performance, 512 KB Flash (512K x 8), 64 KB SRAM, 53 digital I/O pins, and a 2.5 V to 3.6 V single-supply voltage range with industrial-grade -40C to +105C operating range. The 64-VQFN (MR) package exposes an integrated Ethernet MAC, USB-OTG full-speed PHY interface, two I2C, two SPI, and six UART modules, plus a Parallel Master Port (PMP). The wide peripheral set lets designers drop this MCU into industrial, consumer, and IoT nodes without external connectivity silicon.
Architecturally, the device uses the MIPS M4K core with a 5-stage pipeline, hardware multiply/divide, and tightly-coupled peripherals. DMA channels offload data movement for Ethernet, USB, and SPI traffic, freeing the CPU for application code. The 10-bit ADC runs up to 1 Msps with multiple internal references, while the on-chip Ethernet MAC implements MII/RMII PHY interfaces, accelerating TCP/IP stacks in MPLAB Harmony and TCP/IP Lite libraries.
Typical applications include industrial Ethernet nodes (Modbus TCP, EtherNet/IP gateways), USB device/host peripherals (barcode scanners, HID), CAN-connected automotive accessories, IoT edge gateways, and graphical HMI controllers. The 'T' suffix denotes tape-and-reel packaging, '-80V' designates 80 MHz speed at -40C to +105C, and '/MR' identifies the 64-pin VQFN package.
Designers should allocate a 10uF + 0.1uF decoupling pair near the VDDCORE/VDDIO pins and keep the analog AV+ traces short to maximize ADC accuracy. The Ethernet MAC requires a 25 MHz or 50 MHz reference clock fed to the PHY, so crystal selection and trace routing must respect MII timing budgets.
Drop-in alternatives for PIC32MX675F512HT-80V/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX675F512HT-80V/MR (same form factor and footprint) — differing in Package, ADC, Core Architecture, Operating Temperature, Ethernet MAC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX675F512HT-80I/MR
✅ Drop-In✓ In Stock
$6.45 / Unit
View Datasheet →PIC32MX675F512HT-80I/PT
✅ Drop-In✓ In Stock
$8.27 / Unit
View Datasheet →PIC32MX675F512H-80V/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX440F512HT-80V/MR
✅ Drop-In✓ In Stock
$5.25 / Unit
View Datasheet →PIC32MX675F256HT-80V/MR
✅ Drop-In✓ In Stock
$6.3 / Unit
View Datasheet →PIC32MX675F512H-80I/MR
✅ Drop-In✓ In Stock
$4.2 / Unit
View Datasheet →PIC32MX675F512HT-80V/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum Clock Speed | 80 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| Data Memory (SRAM) | 64 KB |
| Supply Voltage (VDD) | 2.5 V to 3.6 V |
| Operating Temperature | -40C to +105C |
| Digital I/O Pins | 53 |
| ADC | 10-bit, 16-channel, up to 1 Msps |
| Ethernet MAC | 10/100 Mbps with MII/RMII interface |
| USB | USB 2.0 OTG (full-speed) |
| CAN | 1x CAN 2.0B |
| UART | 6 |
| SPI | 2 |
| I2C | 2 |
| DMA Channels | 8 |
| Timers | 5 x 16-bit, 2 x 32-bit |
| Package | 64-pin VQFN (9x9 mm) with exposed pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC32MX675F512HT-80V/MR Pin Configuration
| Pin 1 | RPB0/AN0 — Remappable I/O RB0 / Analog input 0 |
| Pin 2 | RPB1/AN1 — Remappable I/O RB1 / Analog input 1 |
| Pin 3 | RPB2/AN2 — Remappable I/O RB2 / Analog input 2 |
| Pin 4 | RPB3/AN3 — Remappable I/O RB3 / Analog input 3 |
| Pin 5 | RPB4/AN4 — Remappable I/O RB4 / Analog input 4 |
| Pin 6 | RPB5/AN5 — Remappable I/O RB5 / Analog input 5 |
| Pin 7 | RPC0 — Remappable I/O RC0 |
| Pin 8 | RPC1 — Remappable I/O RC1 |
| Pin 9 | RPC2 — Remappable I/O RC2 |
| Pin 10 | RPC3 — Remappable I/O RC3 |
| Pin 11 | RPC4 — Remappable I/O RC4 |
| Pin 12 | RPC5 — Remappable I/O RC5 |
| Pin 13 | RPC6 — Remappable I/O RC6 |
| Pin 14 | RPC7 — Remappable I/O RC7 |
| Pin 15 | RPC8 — Remappable I/O RC8 |
| Pin 16 | RPC9 — Remappable I/O RC9 |
| Pin 17 | VSS — Ground |
| Pin 18 | VDD — Supply voltage (2.5V-3.6V) |
| Pin 19 | RD0 — Remappable I/O RD0 |
| Pin 20 | RD1 — Remappable I/O RD1 |
| Pin 21 | RD2 — Remappable I/O RD2 |
| Pin 22 | RD3 — Remappable I/O RD3 |
| Pin 23 | RD4 — Remappable I/O RD4 |
| Pin 24 | RD5 — Remappable I/O RD5 |
| Pin 25 | RD6 — Remappable I/O RD6 |
| Pin 26 | RD7 — Remappable I/O RD7 |
| Pin 27 | RD8 — Remappable I/O RD8 |
| Pin 28 | RD9 — Remappable I/O RD9 |
| Pin 29 | RD10 — Remappable I/O RD10 |
| Pin 30 | RD11 — Remappable I/O RD11 |
| Pin 31 | RD12 — Remappable I/O RD12 |
| Pin 32 | RD13 — Remappable I/O RD13 |
| Pin 33 | RD14 — Remappable I/O RD14 |
| Pin 34 | RD15 — Remappable I/O RD15 |
| Pin 35 | VSS — Ground |
| Pin 36 | VDD — Supply voltage (2.5V-3.6V) |
| Pin 37 | RE0 — Remappable I/O RE0 |
| Pin 38 | RE1 — Remappable I/O RE1 |
| Pin 39 | RE2 — Remappable I/O RE2 |
| Pin 40 | RE3 — Remappable I/O RE3 |
| Pin 41 | RE4 — Remappable I/O RE4 |
| Pin 42 | RE5 — Remappable I/O RE5 |
| Pin 43 | RE6 — Remappable I/O RE6 |
| Pin 44 | RE7 — Remappable I/O RE7 |
| Pin 45 | RF0 — Remappable I/O RF0 |
| Pin 46 | RF1 — Remappable I/O RF1 |
| Pin 47 | RF2 — Remappable I/O RF2 |
| Pin 48 | RF3 — Remappable I/O RF3 |
| Pin 49 | RF4 — Remappable I/O RF4 |
| Pin 50 | RF5 — Remappable I/O RF5 |
| Pin 51 | RF6 — Remappable I/O RF6 |
| Pin 52 | RF7 — Remappable I/O RF7 |
| Pin 53 | RF8 — Remappable I/O RF8 |
| Pin 54 | RG0 — Remappable I/O RG0 |
| Pin 55 | RG1 — Remappable I/O RG1 |
| Pin 56 | RG2 — Remappable I/O RG2 |
| Pin 57 | RG3 — Remappable I/O RG3 |
| Pin 58 | RG6 — Remappable I/O RG6 |
| Pin 59 | RG7 — Remappable I/O RG7 |
| Pin 60 | RG8 — Remappable I/O RG8 |
| Pin 61 | RG9 — Remappable I/O RG9 |
| Pin 62 | OSC1/CLKI — Oscillator input / external clock input |
| Pin 63 | OSC2/CLKO — Oscillator output / clock output |
| Pin 64 | MCLR — Master clear (reset) input, active low |
Typical Applications
PIC32MX675F512HT-80V/MR is suitable for 6 applications: Industrial Ethernet Gateway, USB-OTG Device/Host Peripheral, CAN-Connected Automotive Accessory, IoT Edge Sensor Hub, Graphical HMI Touch Controller, Test & Measurement Data Acquisition.
Industrial Ethernet Gateway
The PIC32MX675F512HT-80V/MR fits industrial Ethernet gateway designs through its integrated 10/100 Mbps MAC with MII/RMII PHY interface, eliminating external Ethernet controllers. The 512 KB Flash accommodates the full Microchip MPLAB Harmony TCP/IP stack including HTTP, Modbus TCP, and SNMP, while the 80 MHz MIPS32 M4K core handles simultaneous protocol conversion. Six UARTs enable legacy RS-232/485 device bridging at speeds up to 25 Mbps. The 8 DMA channels keep Ethernet packet movement off the CPU at full wire speed, and the 64-VQFN package fits compact DIN-rail module form factors.
Recommended
USB-OTG Device/Host Peripheral
The PIC32MX675F512HT-80V/MR serves USB-OTG peripherals with its integrated full-speed USB 2.0 controller, supporting device, host, and On-The-Go roles. The 80 MHz core and 64 KB SRAM handle USB stack processing plus application code, while the dedicated DMA channels offload bulk endpoint transfers at 12 Mbps full-speed. Typical use cases include USB barcode scanners, USB HID controllers, USB mass-storage bridges, and USB-to-UART converter dongles. The 53 I/O pins provide ample GPIO for keypad, LED indicator, and LCD interface requirements in commercial USB peripherals.
Recommended
CAN-Connected Automotive Accessory
The PIC32MX675F512HT-80V/MR targets CAN-connected automotive accessories through its integrated CAN 2.0B controller operating at up to 1 Mbps bus speed. The 80 MHz core runs OBD-II diagnostic stacks and CAN bootloader firmware within the 512 KB Flash budget, while the 64 KB SRAM buffers CAN message streams. Combined with USB-OTG, the MCU supports diagnostic tools that connect to vehicle CAN bus and present data over USB to a host PC. The -40C to +105C industrial temperature rating covers most automotive interior cabin environments.
Recommended
IoT Edge Sensor Hub
The PIC32MX675F512HT-80V/MR serves as an IoT edge hub where Ethernet connectivity and analog sensor integration are both required. The 16-channel 10-bit ADC at 1 Msps converts multiple sensor inputs while the Ethernet MAC uploads aggregated data to the cloud. The 512 KB Flash fits MQTT, CoAP, or HTTP client libraries plus sensor processing algorithms. Six UARTs connect to external radios (Wi-Fi, LoRa, Bluetooth modules), and 53 I/O pins support digital sensor interfaces, status LEDs, and configuration switches.
Recommended
Graphical HMI Touch Controller
The PIC32MX675F512HT-80V/MR drives small graphical HMI panels via its Parallel Master Port (PMP) interfacing TFT LCDs up to 480x272 resolution. The 80 MHz MIPS core renders menus at 30 fps while the 512 KB Flash stores multilingual UI assets and fonts. Six UARTs support RS-485 industrial bus connections to PLCs, and the USB-OTG allows configuration upload from USB sticks. The 64-VQFN package keeps the controller board compact for 3.5-inch to 5-inch touch panel enclosures.
Recommended
Test & Measurement Data Acquisition
The PIC32MX675F512HT-80V/MR enables bench-top data acquisition systems by combining its 16-channel 10-bit ADC with USB-OTG streaming to a host PC. The 80 MHz core acquires up to 1 Msps while DMA transfers samples directly to USB endpoint buffers, achieving sustained logging rates around 500 ksps in practice. The 64 KB SRAM buffers sample bursts, and the Ethernet MAC provides LAN connectivity for networked test rigs. The 53 I/O include PWM outputs for stimulus generation and digital triggers for synchronized measurements.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX675F512HT-80V/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX675F512HT-80I/MR | PIC32MX675F512HT-80I/PT | PIC32MX675F512H-80V/MR | PIC32MX675F256HT-80V/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Core Architecture | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum Clock Speed | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB (-50%) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| USB | USB 2.0 OTG | USB 2.0 OTG | USB 2.0 OTG | USB 2.0 OTG | USB 2.0 OTG |
| Operating Temperature | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +105C | -40C to +105C |
| Packaging Format | Tape & Reel | Tape & Reel | Tape & Reel | Tray | Tape & Reel |
Key Differentiators
- Integrated 10/100 Ethernet MAC plus USB-OTG in single chip (vs PIC32MX575F512H-80V/PT)
- 80 MHz industrial temperature grade (-40C to +105C) (vs PIC32MX675F512HT-80I/MR)
- 512 KB Flash for full TCP/IP stack with headroom (vs PIC32MX675F256HT-80V/MR)
Design Notes
Place a 10uF tantalum or ceramic bulk capacitor plus a 0.1uF ceramic decoupling capacitor on each VDD pin pair (e.g., pins 17/18 and 35/36). Route power traces wider than 0.5 mm and keep the analog AV+ pin decoupling isolated from digital switching returns. The internal 1.8V regulator powering VDDCORE requires a 10uF + 0.1uF pair with low-ESR ceramics placed within 5 mm of the pin to meet load-step transients under DMA bursts.
The 64-VQFN exposed thermal pad (EP) MUST be soldered to a PCB ground plane with at least 4 thermal vias (0.3 mm drill) connecting to an internal ground layer for proper heat dissipation. Without EP soldering, junction temperature can exceed the +105C limit at full 80 MHz operation. Keep high-speed Ethernet MII/RMII trace lengths matched within 50 mil tolerance and route the 25 MHz PHY clock away from switching power sections.
The Ethernet MII/RMII interface runs at 25 MHz or 50 MHz - keep MII data and clock trace lengths matched to within 100 mil and route over a continuous ground reference plane. The USB-OTG D+/D- pair requires 90 ohm differential impedance and a maximum length of 50 mm. Avoid routing USB and Ethernet signals parallel to each other or near switching regulator inductor nodes to minimize EMI coupling.
Do not exceed VDD = 3.6 V absolute maximum or apply voltage to any I/O pin before the VDD rail is stable, which can trigger latch-up via the ESD protection diodes. Configure unused I/O pins as outputs (driven low) or inputs with internal pull-ups enabled - never leave them floating to avoid shoot-through current. The MCLR reset pin requires a 10 kohm pull-up to VDD and a 100 nF capacitor to ground for reliable in-circuit programming.
Place the 8 MHz primary crystal or resonator within 10 mm of the OSC1/OSC2 pins and guard the traces with a ground ring to suppress noise coupling. Keep the analog AV+/AV- traces short and isolated from digital I/O. If using the on-chip Ethernet MAC with an external PHY, place the PHY within 50 mm of the MCU and route RMII traces on the top layer with no vias to maintain 50 ohm impedance control.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - automotive interior applications should validate EMC/EMI performance separately. Lead-free and halogen-free per Microchip material declaration.
