PIC32MX775F256HT-80V/MR - 256KB Flash 80MHz MCU w/ USB-OTG & Ethernet | Microchip
MPN: PIC32MX775F256HT-80V/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.59 | $75.90 |
| 100 | $6.83 | $683.00 |
| 500 | $6.12 | $3,060.00 |
| 1,000 | $5.46 | $5,460.00 |
PIC32MX775F256HT-80V/MR Overview
Background: A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program storage (Flash), data memory (SRAM), and programmable peripherals. The PIC32MX family belongs to the 32-bit MCU category in the broader semiconductor hierarchy of microcontrollers -> embedded processors -> ICs. PIC32MX parts use the MIPS M4K core licensed from MIPS Technologies and are designed for embedded connectivity designs where high throughput and rich peripherals are required.
Key features of the PIC32MX775F256HT-80V/MR include a MIPS32 M4K 32-bit CPU at 80 MHz (80 MIPS), 256KB Flash program memory, 64KB SRAM, integrated 10/100 Mbps Ethernet MAC for wired networking, USB 2.0 Full-Speed On-The-Go (OTG) controller, two independent CAN 2.0b modules for industrial/automotive fieldbus, 51 general-purpose I/O pins, multiple UART/SPI/I2C peripherals, 16-channel 10-bit ADC, five 16-bit timers, and a parallel master port for external bus/FPGAs. The wide 2.3-3.6V supply range simplifies designs running from a single Li-ion or 3.3V regulated rail.
The architecture combines Harvard-style separate Flash/SRAM buses with DMA, prefetch cache, and a peripheral bus matrix, delivering deterministic interrupt latency at 80 MHz. The 9x9 mm 64-VQFN package exposes all peripherals while keeping the PCB footprint modest, and the -80V speed grade + -40C to +105C extended temperature rating supports industrial and consumer connectivity products.
Typical applications include industrial Ethernet gateways, USB-OTG device/host controllers, CAN-based automotive/industrial node controllers, building automation panels, RFID readers, and graphical HMI displays with external bus peripherals.
When designing with this MCU, allocate sufficient decoupling (100 nF + 10 uF bulk) close to each VDD pin pair and follow the 64-VQFN land recommendations in the datasheet to keep the lead-free thermal pad soldered for low theta-JA.
This page synthesizes cross-distributor stock and pricing, drop-in PIC32MX alternatives, and practical design notes not consolidated in the manufacturer datasheet, giving an engineer an explicit BOM decision and PCB layout aid.
Drop-in alternatives for PIC32MX775F256HT-80V/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX775F256HT-80V/MR (same form factor and footprint) — differing in ADC, Package, Operating Temperature, CAN, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX775F256H-80V/MR
✅ Drop-In✓ In Stock
$2.84 / Unit
View Datasheet →PIC32MX675F512HT-80V/MR
✅ Drop-In✓ In Stock
$6.05 / Unit
View Datasheet →PIC32MX695F512HT-80I/MR
✅ Drop-In✓ In Stock
$8.42 / Unit
View Datasheet →PIC32MX575F512HT-80V/PT
✅ Drop-In✓ In Stock
$5.88 / Unit
View Datasheet →PIC32MX564F128HT-I/MR
✅ Drop-In✓ In Stock
$4.73 / Unit
View Datasheet →PIC32MX775F256HT-80V/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 80 MHz (80 MIPS) |
| Program Flash Memory | 256 KB |
| Data SRAM | 64 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Pins | 51 |
| Package | 64-VQFN 9x9 mm |
| Operating Temperature | -40 C to +105 C |
| Speed Grade | -80V (80 MHz @ 2.3-3.6V) |
| USB Controller | USB 2.0 Full-Speed OTG |
| Ethernet MAC | 10/100 Mbps |
| CAN Modules | 2 x CAN 2.0b |
| ADC | 16-channel, 10-bit |
| Timers | 5 x 16-bit |
| Parallel Master Port (PMP) | Yes |
| DMA Channels | 8 |
| RoHS Status | Compliant (lead-free) |
PIC32MX775F256HT-80V/MR Pin Configuration
| Pin 1 | RG15 — GPIO/segment LCD |
| Pin 2 | SDA3/RA15 — I2C3 data / GPIO |
| Pin 3 | SCL3/RA14 — I2C3 clock / GPIO |
| Pin 4 | RA11 — GPIO |
| Pin 5 | RA10 — GPIO |
| Pin 6 | RA9 — GPIO |
| Pin 7 | RA8 — GPIO |
| Pin 8 | RB15 — GPIO |
| Pin 9 | RB14 — GPIO |
| Pin 10 | RB13 — GPIO |
| Pin 11 | RB12 — GPIO |
| Pin 12 | RB11 — GPIO |
| Pin 13 | RB10 — GPIO |
| Pin 14 | RB8 — GPIO |
| Pin 15 | VBUS — USB VBUS sense |
| Pin 16 | VUSB — USB 3.3V LDO output |
| Pin 17 | D- — USB data minus |
| Pin 18 | D+ — USB data plus |
| Pin 19 | VDD — Core supply 2.3-3.6V |
| Pin 20 | VSS — Ground |
| Pin 21 | RF13 — GPIO / Ethernet LED |
| Pin 22 | RF12 — GPIO / Ethernet LED |
| Pin 23 | RF5 — GPIO / Ethernet RMII |
| Pin 24 | RF4 — GPIO / Ethernet RMII |
| Pin 25 | RD6 — GPIO / PMP |
| Pin 26 | RD5 — GPIO / PMP |
| Pin 27 | RD4 — GPIO / PMP |
| Pin 28 | RD3 — GPIO / PMP |
| Pin 29 | RD2 — GPIO / CAN1 RX |
| Pin 30 | RD1 — GPIO / CAN1 TX |
| Pin 31 | RD0 — GPIO |
| Pin 32 | RC15 — GPIO / CAN2 RX |
| Pin 33 | RC14 — GPIO / CAN2 TX |
| Pin 34 | RC13 — GPIO |
| Pin 35 | RC12 — GPIO |
| Pin 36 | RC11 — GPIO |
| Pin 37 | VDD — Core supply 2.3-3.6V |
| Pin 38 | VSS — Ground |
| Pin 39 | RC4 — GPIO |
| Pin 40 | RC3 — GPIO |
| Pin 41 | RC2 — GPIO |
| Pin 42 | RC1 — GPIO |
| Pin 43 | RC0 — GPIO |
| Pin 44 | RG0 — GPIO |
| Pin 45 | RG1 — GPIO |
| Pin 46 | RG2 — GPIO |
| Pin 47 | RG3 — GPIO |
| Pin 48 | RG6 — GPIO |
| Pin 49 | RG7 — GPIO |
| Pin 50 | RG8 — GPIO |
| Pin 51 | RG9 — GPIO |
| Pin 52 | MCLR — Reset, active low |
| Pin 53 | RG14 — GPIO |
| Pin 54 | RG12 — GPIO |
| Pin 55 | RG13 — GPIO |
| Pin 56 | RA0 — GPIO / Analog input |
| Pin 57 | RA1 — GPIO / Analog input |
| Pin 58 | RA2 — GPIO / Analog input |
| Pin 59 | RA3 — GPIO / Analog input |
| Pin 60 | RA4 — GPIO / Analog input |
| Pin 61 | AVDD — Analog supply |
| Pin 62 | AVSS — Analog ground |
| Pin 63 | RA5 — GPIO / Analog input |
| Pin 64 | EPAD — Exposed thermal pad, connect to VSS |
Typical Applications
PIC32MX775F256HT-80V/MR is suitable for 6 applications: Industrial Ethernet Gateway / PLC Node, USB-OTG Device/Host Controller, CAN-Based Automotive Body Controller, Building Automation / HVAC Controller, Graphical HMI with Parallel Display, RFID / Barcode Reader with Network Uplink.
Industrial Ethernet Gateway / PLC Node
The PIC32MX775F256HT-80V/MR is well suited to industrial Ethernet gateway designs because it integrates both a 10/100 Ethernet MAC (with external PHY) and dual CAN 2.0b controllers in a single MCU. The 80 MIPS MIPS M4K core runs a full TCP/IP stack (Microchip Harmony + lwIP) plus CANopen or DeviceNet concurrently, and 64 KB SRAM is sufficient for socket buffers and protocol tables. The -40C to +105C operating window supports cabinet-mounted industrial nodes, while the 64-VQFN package keeps the PCB footprint compact for DIN-rail module form factors. Two CAN buses enable bridging between factory-floor CAN and an Ethernet uplink without an external bridge MCU.
Recommended
USB-OTG Device/Host Controller
The PIC32MX775F256HT-80V/MR's integrated USB 2.0 Full-Speed On-The-Go controller enables both USB device and USB host operation without an external bridge, ideal for embedded peripherals that must switch roles (e.g., USB mass-storage readers, HID dongles, or vendor-specific data loggers). The 80 MHz MIPS M4K handles USB stack plus application code, while 256 KB Flash supports USB host stacks with multiple class drivers. Paired with a USB power switch and ESD protection, this MCU forms a complete OTG node. The 51 GPIO count provides ample pins for status LEDs, buttons, and accessory buses.
Recommended
CAN-Based Automotive Body Controller
With two independent CAN 2.0b modules, the PIC32MX775F256HT-80V/MR supports dual-bus automotive body electronics such as gateway nodes, lighting controllers, or seat/HVAC modules. The 80 MIPS CPU runs CAN stacks (CANopen, J1939, or OEM proprietary) while the 16-channel 10-bit ADC reads sensor inputs and the PMP drives a segment LCD or character display. The 64-VQFN's exposed thermal pad handles moderate thermal dissipation in sealed-cockpit environments, and the -40C to +105C extended temp grade covers under-dash mounting. Up to 51 GPIOs accommodate switch inputs, relay drivers, and LIN-master UARTs via software bit-banging.
Recommended
Building Automation / HVAC Controller
The PIC32MX775F256HT-80V/MR fits building automation panels and HVAC controllers because it integrates Ethernet (for BACnet/IP or Modbus TCP uplink), dual CAN (for BACnet MS-TP over CAN or proprietary fieldbus), and USB-OTG (for service-port commissioning). The 256 KB Flash holds BACnet stack plus application logic, while 64 KB RAM supports BACnet/IP socket buffers. Sixteen ADC channels read temperature, humidity, and pressure sensors; five 16-bit timers drive triac-based phase-angle firing for AC loads. The industrial temperature window and lead-free package are well suited to commercial building installations.
Recommended
Graphical HMI with Parallel Display
The PIC32MX775F256HT-80V/MR features a Parallel Master Port (PMP) that drives 8/16-bit parallel TFT or OLED displays, making it a strong fit for low-cost graphical HMI panels in industrial appliances, medical carts, and consumer appliances. At 80 MHz, the MIPS M4K core generates full-screen refreshes without external graphics memory for small QVGA/WQVGA panels, while the DMA engine offloads pixel data from the PMP FIFO. The 51 GPIO count accommodates resistive touch, encoder input, and backlight PWM. Designers can use Microchip's MPLAB Harmony HMI framework for rapid development.
Recommended
RFID / Barcode Reader with Network Uplink
Embedded RFID readers, barcode scanners, and handheld data terminals benefit from the PIC32MX775F256HT-80V/MR's combination of USB-OTG (for charging/PC link), Ethernet MAC (for PoE-connected fixed readers), and 80 MIPS throughput (for real-time decoding). The 64 KB SRAM holds image buffers for 1D/2D barcode decoding libraries, and 256 KB Flash fits embedded firmware plus configuration web server. UART peripherals connect to RFID modules, while the I2C bus drives EEPROM and RTC. The industrial temperature grade supports warehouse and outdoor use cases.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX775F256HT-80V/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX775F256H-80V/MR | PIC32MX675F512HT-80V/MR | PIC32MX695F512HT-80I/MR | PIC32MX564F128HT-I/MR | PIC32MX575F512HT-80V/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | TQFP-64 - different land pattern |
| Flash Memory | 256 KB | 256 KB | 512 KB | 512 KB | 128 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 128 KB | 64 KB | 64 KB |
| Maximum Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Ethernet MAC | 10/100 Yes | 10/100 Yes | No | No | 10/100 Yes | No |
| USB OTG | Yes | Yes | Yes | Yes | Yes | No |
| CAN Modules | 2 | 2 | 2 | 2 | 1 | 1 |
| Operating Temperature | -40C to +105C | -40C to +85C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +105C |
Key Differentiators
- Industrial -40C to +105C temperature grade with full peripheral set (vs PIC32MX775F256H-80V/MR)
- Highest peripheral density at 256 KB Flash in 64-VQFN (vs PIC32MX675F512HT-80V/MR)
- Drop-in same footprint at 50% latency savings (vs PIC32MX564F128HT-I/MR)
Design Notes
Decouple each VDD pin pair with a 100 nF 0402 ceramic placed within 2 mm of the pin, plus one 10 uF X5R bulk capacitor shared across the package. The PIC32MX775F256HT-80V/MR has three VDD pins (1, 19, 37) on a 64-VQFN package - verify all are individually decoupled. Place the bulk cap on the same side as the MCU to minimize loop area. Estimated: at 80 MHz with 256 KB Flash active, the MCU draws ~70 mA; the 10 uF bulk prevents VDD droop during DMA bursts.
The 64-VQFN package exposes a thermal pad (pin 64) that must be soldered to a continuous ground copper pour of at least 25 mm x 25 mm on top and bottom layers, stitched with thermal vias (0.3 mm drill, 0.5 mm pitch, 9-via array minimum). Estimated at 3.3V and 80 MHz full-load, internal dissipation is ~250 mW; with the recommended land pattern, theta-JA is approximately 28 C/W, giving 7 C rise above ambient - well within the 105 C maximum.
Route the 50 MHz Ethernet RMII bus (REF_CLK, RXD[1:0], TX_EN, TXD[1:0], CRS_DV) with controlled 50 ohm impedance and matched lengths within 50 mils of each other. Place the external LAN8720A PHY within 25 mm of the MCU to keep RMII traces short. Shield USB D+/D- traces with ground on both sides and place the 27 ohm series resistors within 4 mm of the MCU pins, per USB 2.0 full-speed layout guidelines in the PIC32MX5/6/7 datasheet section on USB design.
Do not leave the MCLR pin floating - tie through a 10 kohm pull-up to VDD and provide a 100 nF cap to ground for reset decoupling. The PIC32MX775F256HT-80V/MR will not boot reliably without MCLR tied high. Also, the VUSB pin (16) requires a 0.01 uF decoupling cap to ground for the internal USB 3.3V LDO; omitting it causes USB enumeration failures. The Trace Clock (TRCLK) and Trace Data (TRD) pins must be left NC when not using the trace port, but should be pulled low to ground via 10 kohm if unused to avoid floating-pin leakage.
Compliance Information
RoHS-compliant lead-free 64-VQFN package. Not AEC-Q100 qualified (this is a general-purpose MCU); for AEC-Q100 automotive-grade PIC32, see PIC32MX series auto-qualified variants. Conflict-minerals compliance per Microchip policy.
