PIC32MZ1064DAL169-V/HF - 200MHz MCU, 1MB Flash, Graphics, 169-LFBGA | Microchip
Référence : PIC32MZ1064DAL169-V/HF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $17.1 | $171,00 |
| 100 | $15.05 | $1 505,00 |
| 500 | $13.4 | $6 700,00 |
| 1 000 | $12.2 | $12 200,00 |
PIC32MZ1064DAL169-V/HF Présentation
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program and data memory, and a rich set of peripherals on one die. The PIC32MZ DAL extends the MCU hierarchy into the graphics-tiled segment: 32-bit MCU -> embedded microcontroller -> system-on-chip for HMI -> PIC32MZ DAL sub-family. The microAptiv core adds DSP-like SIMD instructions and a prefetch/cache pipeline that help sustain throughput at 200 MHz while keeping deterministic interrupt latency for real-time control alongside the user-interface stack.
Key features of the PIC32MZ1064DAL169-V/HF include an integrated Graphics Controller and Graphics Processor for accelerated GUI rendering, a 12-bit 18 MSPS ADC module with up to 45 analog inputs, on-chip support for an externally addressable DDR2 DRAM footprint of 32 MB or 128 MB, plus connectivity peripherals such as CAN and High-Speed USB. The 169-LFBGA (11x11 mm) package supports dense, high-pin-count PCB designs required by simultaneous display, touch, and communication interfaces. The V-temp grade extends operating temperature into industrial thermal envelopes.
Architecturally, the part combines a high-speed 32-bit core with a 32 KB I-cache and 32 KB D-cache, dedicated graphics peripherals, and an enhanced ADC subsystem. The DDR2 controller offloads frame-buffer memory, enabling the integrated GPU to manage 2D primitives, alpha blending, and color-space conversion without burdening the core. Total internal SRAM reaches up to 640 KB across the family, allowing comfortable tile and framebuffer caching for typical WQVGA/WVGA HMI panels.
Typical applications span industrial human-machine interface (HMI) panels, medical patient monitors, point-of-sale terminals, smart-home control hubs, and automotive infotainment/cluster pre-development. Designers choose this part when a deterministic 32-bit control plane must coexist with rich on-screen graphics, large framebuffers, and standard automotive/industrial connectivity buses.
A key design consideration is PCB layout for the LFBGA package: matched-length DDR2 traces, controlled-impedance USB routing, and ample thermal copper under the exposed die region are essential to achieve the rated 200 MHz performance. Designers should use Microchip's MPLAB Harmony framework and the MPLAB ICE 4 in-circuit emulator to validate cache behavior, DMA, and graphics pipeline throughput before committing to production.
This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the PIC32MZ DAL family, and practical design notes that complement the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1064DAL169-V/HF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1064DAL169-V/HF (même facteur de forme et même empreinte) — différant par Graphics Controller, USB, Core Architecture, Mounting Type, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1064DAL169-I/HF
✅ Remplacement direct✓ En stock
$5.05 / unité
Voir la fiche technique →PIC32MZ1064DAB169-I/HF
✅ Remplacement direct✓ En stock
$12.4 / unité
Voir la fiche technique →PIC32MZ1064DAB169T-I/HF
✅ Remplacement direct✓ En stock
$4.52 / unité
Voir la fiche technique →PIC32MZ1064DAA169-I/HF
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →PIC32MZ1025DAL169T-I/HF
✅ Remplacement direct✓ En stock
$8.3 / unité
Voir la fiche technique →PIC32MZ1025DAK169-I/HF
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →PIC32MZ1064DAL169-V/HF Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| Largeur du bus de données | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Internal SRAM | 640 KB (family maximum, part-specific share varies) |
| External Memory Interface | DDR2 DRAM controller, 32 MB or 128 MB addressable |
| Graphics Controller | Integrated 2D graphics controller + GPU |
| ADC | 12-bit, up to 18 MSPS, up to 45 analog inputs |
| Connectivity | CAN, High-Speed USB |
| Boîtier | 169-LFBGA (11x11 mm) |
| Type de montage | Surface Mount |
| Temperature Grade | V-temp (-40C to +105C) |
| ICSP Programming | Multiple PGECx/PGEDx pairs supported |
Guide de configuration des broches du PIC32MZ1064DAL169-V/HF 169-lfbga (11x11 mm)
Configuration des broches du PIC32MZ1064DAL169-V/HF (boîtier 169-lfbga (11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1064DAL169-V/HF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1064DAL169-V/HF convient pour 6 applications: Industrial HMI Control Panels, Medical Patient Monitoring Displays, Point-of-Sale Terminals, Smart Home Control Hubs, Automotive Infotainment Pre-Development, Industrial Test & Measurement Front Panels.
Industrial HMI Control Panels
The PIC32MZ1064DAL169-V/HF is a strong match for industrial HMI panels that must combine deterministic real-time control with rich on-screen graphics. The integrated Graphics Controller plus DDR2 framebuffer support (up to 128 MB external) sustains full-WVGA displays at 60 fps without burdening the microAptiv core. The 45-channel 12-bit 18 MSPS ADC samples multi-zone touch overlays and analog sensor inputs simultaneously, while the 200 MHz core runs communication stacks (CAN, HS USB) alongside the GUI. V-temp operation to +105C supports sealed factory-floor enclosures without active cooling.
Recommandé
Medical Patient Monitoring Displays
Patient monitors require long-term reliability, multi-parameter waveform rendering, and isolated communication buses. The PIC32MZ1064DAL169-V/HF's microAptiv core with DSP extensions accelerates ECG/SpO2 DSP filtering, while the integrated 2D Graphics Processor renders multi-trace waveforms without off-chip GPU cost. The 12-bit 18 MSPS ADC digitizes analog front-end signals at clinical sampling rates across up to 45 channels, sufficient for full-lead ECG plus auxiliary vitals. HS USB and CAN enable tethered or networked connectivity to hospital information systems, and the 169-LFBGA package supports compact, fan-less medical-grade enclosures.
Recommandé
Point-of-Sale Terminals
POS terminals demand a responsive touchscreen UI, encrypted payment flow, and reliable printer/PIN-pad peripherals. The PIC32MZ1064DAL169-V/HF accelerates graphical checkout flows via the on-chip GPU while leaving CPU headroom for TLS, EMV, and barcode parsing. The DDR2 controller holds large product imagery and multilingual UI assets, reducing external flash cost. HS USB hosts printer and PIN-pad peripherals, CAN is available for legacy cash-drawer interfaces, and the 1 MB Flash accommodates feature-rich firmware with OTA update staging. The 169-LFBGA package keeps the BOM compact for slim countertop form factors.
Recommandé
Smart Home Control Hubs
Smart-home hubs juggle a touchscreen UI plus Zigbee/Thread/Wi-Fi/BLE coexistence stacks, demanding both graphics throughput and abundant code space. The PIC32MZ1064DAL169-V/HF's 1 MB Flash fits feature-rich gateway firmware, while the 640 KB SRAM plus optional DDR2 framebuffer allows rich on-device dashboards. The 12-bit ADC handles analog sensor inputs (light, temperature, gas preamp), and HS USB plus CAN simplify connectivity to bridge radios. The -40C to +105C V-temp envelope supports indoor enclosures near HVAC vents or outdoor weatherproof cabinets.
Recommandé
Automotive Infotainment Pre-Development
Pre-production automotive infotainment and cluster development uses the PIC32MZ1064DAL169-V/HF as a fast graphics-and-control platform before committing to automotive-grade silicon. The integrated 2D Graphics Controller accelerates cluster renderings, the DDR2 controller supports multi-layer framebuffers, and the CAN interface is fundamental to in-vehicle networking. V-temp operation is acceptable for cabin environments, but production deployments targeting under-hood or AEC-Q100 contexts should move to a qualified variant. The 169-LFBGA package maps cleanly to development boards that emulate production cluster PCBs.
Recommandé
Industrial Test & Measurement Front Panels
Bench instruments and factory test fixtures need both a crisp local UI and real-time signal-processing. The PIC32MZ1064DAL169-V/HF's microAptiv core handles DSP-style FIR/FFT post-processing while the GPU drives waveform/spectrum displays, all in one chip. The 12-bit 18 MSPS ADC with up to 45 channels is ideal for multi-channel data acquisition front-ends, and HS USB streams measurements to a host PC. The 169-LFBGA package enables dense board layouts inside 1U rack instruments, and V-temp operation supports lightly climate-controlled labs and factory cells.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1064DAL169-V/HF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1064DAL169-I/HF | PIC32MZ1064DAB169-I/HF | PIC32MZ1064DAB169T-I/HF | PIC32MZ1064DAA169-I/HF | PIC32MZ1025DAL169T-I/HF | PIC32MZ1025DAK169-I/HF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core / Speed | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz |
| Flash Density | 1 MB (1064 tier) | 1 MB (1064 tier) | 1 MB+ (DAB tier, larger) | 1 MB+ (DAB tier, larger) | DAA tier (smaller than 1 MB) | 1025 tier (smaller than 1 MB) | 1025 tier (smaller than 1 MB) |
| Temperature Grade | V-temp (-40C to +105C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) |
| Graphics Controller | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU |
| External Memory Interface | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB |
| Packaging Format | Tray | Tray | Tray | Tape & Reel | Tray | Tape & Reel | Tray |
Principaux différenciateurs
- V-temp grade in identical 169-LFBGA footprint (vs PIC32MZ1064DAL169-I/HF)
- 1 MB Flash tier (1064) gives 25-100% more code space than lower tiers (vs PIC32MZ1064DAA169-I/HF)
- Highest-density 169-LFBGA DAL Flash tier at this temperature grade (vs PIC32MZ1025DAL169T-I/HF)
Notes de conception
The 169-LFBGA (11x11 mm) footprint requires microvia PCB technology with 0.8 mm or finer pitch fan-out. Matched-length DDR2 traces are mandatory for the external memory interface; route DQS to clock within 25 mil and match data bytes to within 50 mil per Microchip hardware design checklist. Maintain a continuous ground reference plane under the BGA to control impedance for HS USB and parallel display buses. Decoupling: 100 nF X7R per power pin plus 4.7 uF bulk caps within 5 mm of the package.
Estimated: at 200 MHz with the GPU and DDR2 controller active, the die dissipates approximately 0.8-1.2 W depending on workload. The LFBGA-169 has a typical theta_JA in the 25-35 C/W range on a 4-layer JEDEC test board, yielding a 20-40 C junction rise above ambient at full load. For sealed enclosures without airflow, derive copper pour area from the Microchip thermal land pattern notes and avoid placing heat-generating components within 10 mm of the BGA. Add a thermal via array under the center balls if the datasheet indicates an exposed thermal die pad.
Do not assume any PGECx/PGEDx pair is interchangeable for ICSP - according to northernsoftware.com PIC32MZ reference, the ICSP clock and data pins MUST be used as a matched pair (e.g. PGEC2 with PGED2). Mixing pairs prevents the MPLAB ICE 4 or PICkit from acquiring the device. Also confirm boot configuration straps before power-up; incorrect DEVCFGx fuses can permanently lock the part. Finally, validate DDR2 timing parameters against the chosen DRAM datasheet, not against generic JEDEC defaults.
Informations de conformité
RoHS and lead-free confirmed via Microchip product page; halogen-free status not explicitly stated in verified data. The V-temp grade is industrial, not AEC-Q100 automotive qualified - choose a Q-grade variant for under-hood automotive designs.