PIC32MX795F512LT-80I/BG - 80MHz 32-bit MCU 512KB Flash 121-TFBGA | Microchip
MPN: PIC32MX795F512LT-80I/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.1 | $121.00 |
| 100 | $10.85 | $1,085.00 |
| 500 | $9.75 | $4,875.00 |
| 1,000 | $8.65 | $8,650.00 |
PIC32MX795F512LT-80I/BG Overview
Background: A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals into one package. The PIC32 family uses the MIPS M4K 32-bit RISC core, an industry-standard Harvard architecture enabling predictable real-time behavior with deterministic interrupt latency. Within the broader taxonomy, this part sits in the hierarchy: PIC32MX MCU -> 32-bit MIPS microcontroller -> embedded MPU/MCU family -> semiconductor. Its 80MHz core and rich connectivity peripherals target embedded connectivity-based applications.
Key features include 512KB Flash (512K x 8) for program storage, 128KB SRAM for data, 8 channels of dedicated DMA for peripheral offload, an integrated 10/100 Ethernet MAC, USB OTG with PHY interface, and dual CAN 2.0b controllers. Operating from 2.3V to 3.6V, the device provides 51 I/O pins and supports industrial-grade temperature ranges (-40C to +85C industrial), making it suitable for harsh environments.
Architecture depth: The PIC32MX795F512L uses the MIPS32 M4K core with hardware multiply/divide, 5-stage pipeline, and tightly coupled peripherals accessible via separate peripheral buses. The 'T' suffix denotes tape-and-reel packaging, 'L' denotes industrial temperature grade, '80' denotes 80MHz, and 'I' after 80 indicates industrial temp. The 121-TFBGA package is a fine-pitch BGA optimized for compact designs requiring maximum connectivity.
Typical applications include industrial Ethernet gateways, USB-enabled embedded devices, CAN-bus automotive ECUs, building automation controllers, and networked sensor hubs. The combination of Ethernet, USB OTG, and dual CAN makes this part particularly suited for industrial protocol converters and IoT edge gateways.
When designing with this device, pay close attention to BGA PCB layout requirements - fine-pitch BGA demands microvia stackups, controlled impedance routing for Ethernet and USB, and thermal management for the bottom-side thermal pad. Use MPLAB Harmony framework to accelerate peripheral driver development.
Drop-in alternatives for PIC32MX795F512LT-80I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX795F512LT-80I/BG (same form factor and footprint) — differing in Core Architecture, DMA Channels, USB, Package, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX795F512L-80I/BG
✅ Drop-In✓ In Stock
$9.1 / Unit
View Datasheet →PIC32MX795F512LT-80I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.53 / Unit
View Datasheet →PIC32MX795F512LT-80I/BG Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum Clock Speed | 80 MHz |
| Performance | 1.56 DMIPS/MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| Data Memory (SRAM) | 128 KB |
| Supply Voltage Range | 2.3 V to 3.6 V |
| I/O Pins | 51 |
| Package | 121-TFBGA (10x10 mm) |
| Ethernet MAC | 10/100 Mbit integrated |
| USB | USB On-The-Go (OTG) |
| CAN | 2 x CAN 2.0b |
| DMA Channels | 8 dedicated DMA channels |
| Operating Temperature Range | -40 C to +85 C (Industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC32MX795F512LT-80I/BG Pin Configuration
| Pin A1 | RB15 — General purpose I/O |
| Pin B1 | VSS — Ground |
| Pin C1 | RB14 — General purpose I/O |
| Pin D1 | RB13 — General purpose I/O |
| Pin E1 | RB12 — General purpose I/O |
| Pin F1 | RB11 — General purpose I/O |
| Pin G1 | RB10 — General purpose I/O |
| Pin H1 | RB9 — General purpose I/O |
| Pin J1 | RB8 — General purpose I/O |
| Pin K1 | VSS — Ground |
Typical Applications
PIC32MX795F512LT-80I/BG is suitable for 6 applications: Industrial Ethernet Gateway, USB Device and Host Controller, CAN Bus Automotive ECU, Building Automation Controller, Networked Sensor Hub, Industrial Protocol Converter.
Industrial Ethernet Gateway
The PIC32MX795F512LT-80I/BG's integrated 10/100 Mbit Ethernet MAC and 80MHz MIPS M4K core make it ideal for industrial protocol gateway designs. With 512KB Flash and 128KB SRAM, it can run a full TCP/IP stack alongside Modbus TCP, EtherNet/IP, or PROFINET slave firmware. Its 8 dedicated DMA channels offload network packet processing from the CPU, while the 121-TFBGA package enables compact gateway form factors. Operating from -40C to +85C, the part survives factory floor temperature swings without thermal derating.
Recommended
USB Device and Host Controller
The PIC32MX795F512LT-80I/BG's USB On-The-Go controller with integrated PHY enables both USB device and USB host functionality without an external PHY. This makes it well-suited for USB peripheral designs such as data loggers, USB HID devices, and USB mass storage interfaces. The 128KB SRAM buffers USB packets efficiently, while the 80MHz CPU handles USB stack overhead alongside user application logic. The 2.3-3.6V supply range aligns directly with USB VBUS-regulated rails, simplifying bus-powered designs.
Recommended
CAN Bus Automotive ECU
With two independent CAN 2.0b controllers, the PIC32MX795F512LT-80I/BG can serve as a dual-bridge ECU in automotive networks. Its 512KB Flash stores CAN protocol stacks such as CANopen or J1939, while the 51 I/O pins interface with sensors and actuators. The industrial temperature grade (-40C to +85C) suits automotive cabin applications, though for under-hood AEC-Q100 qualification a PIC32MX795F512L-Q1 variant would be required. DMA offload enables CAN message handling at full 1 Mbit/s bus speeds without CPU intervention.
Recommended
Building Automation Controller
The PIC32MX795F512LT-80I/BG is a strong fit for building automation controllers managing HVAC, lighting, and access control subsystems. Its combination of Ethernet, USB, and CAN allows integration with BACnet/IP building networks while interfacing with field-level CAN-based sensor clusters. The 121-TFBGA package enables compact DIN-rail module designs. The wide supply range (2.3-3.6V) accommodates 24V industrial bus regulators commonly used in building automation power supplies.
Recommended
Networked Sensor Hub
The PIC32MX795F512LT-80I/BG serves as an IoT edge sensor hub aggregating analog and digital sensor data, transmitting over Ethernet or USB to upstream systems. With 51 I/O pins, it can interface multiple SPI or I2C sensor chains, while 128KB SRAM buffers time-series data before network transmission. The 8 DMA channels move sensor data without CPU involvement, preserving MIPS for data fusion algorithms. Its industrial temperature range suits outdoor and factory deployments.
Recommended
Industrial Protocol Converter
The PIC32MX795F512LT-80I/BG excels at protocol conversion between Ethernet, USB, and CAN, translating Modbus TCP to CAN, or USB-CDC to Ethernet. Its 512KB Flash accommodates multiple protocol stacks, while 80MHz CPU performance handles message parsing at industrial network speeds. The dual CAN controllers allow simultaneous bridging between two CAN bus segments of different baud rates, and the integrated USB OTG supports field configuration via USB flash drives for firmware updates.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX795F512LT-80I/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX795F512L-80I/BG | PIC32MX795F512LT-80I/PT |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 100-TQFP - different package, NOT PCB-compatible |
| Core | MIPS32 M4K | MIPS32 M4K - same | MIPS32 M4K - same |
| Clock Speed | 80 MHz | 80 MHz - same | 80 MHz - same |
| Flash | 512 KB | 512 KB - same | 512 KB - same |
| SRAM | 128 KB | 128 KB - same | 128 KB - same |
| Supply Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V - same | 2.3 V to 3.6 V - same |
| Ethernet / USB / CAN | Yes / Yes / 2x CAN 2.0b | Yes / Yes / 2x CAN 2.0b - same | Yes / Yes / 2x CAN 2.0b - same |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C - same | -40C to +85C - same |
| Price (1pc) | $13.50 | Similar (tray packaging) | Lower (TQFP is cheaper to assemble) |
Key Differentiators
- Most connectivity-rich variant in PIC32MX family (vs PIC32MX695F512L-80I/BG)
- Tape-and-reel packaging for SMT assembly (vs PIC32MX795F512L-80I/BG)
- Same package as L-80I/BG variant (vs PIC32MX695F512L-80I/BG (different package))
Design Notes
The 121-TFBGA package at 0.8mm ball pitch requires microvia PCB technology (laser-drilled microvias in the BGA pad area). Standard 4-layer FR-4 stackups with 8-mil via stubs may cause signal integrity issues for the Ethernet and USB differential pairs. Use a 6-layer or 8-layer stackup with blind/buried vias for production designs. The BGA thermal pad must be soldered to a grounded copper pour with adequate thermal vias for heat dissipation.
The PIC32MX795F512LT-80I/BG operates from a single 2.3V-3.6V supply but requires multiple decoupling capacitors: 100nF ceramic on each VDD pin, plus bulk 10uF tantalum or ceramic at the regulator output. The 80MHz core draws approximately 60-90mA active depending on peripheral usage. Use a low-noise LDO such as MCP1700 or MIC5219 for the analog supply rail feeding the Ethernet PHY.
The Ethernet MII/RMII signals and USB D+/D- differential pairs require controlled-impedance routing. RMII to the Ethernet PHY uses 50-ohm single-ended traces; USB requires 90-ohm differential. Keep these traces length-matched within 150 mils. Place the PHY within 50mm of the MCU to minimize EMI. Per Microchip application note AN243, route Ethernet signals over a continuous ground plane with no splits.
Common pitfalls include: (1) forgetting to configure the PLLDIV and OSCCON registers correctly before switching to 80MHz, causing unstable operation; (2) not enabling the internal LDO controller for the 1.8V core supply; (3) failing to initialize the DMA controller before peripheral use, causing FIFO overruns on Ethernet; (4) using incorrect compiler libraries - must use MPLAB XC32 compiler for PIC32MX family, not XC16. Always validate register configurations against the device-specific header file.
Compliance Information
RoHS compliant per Microchip product page. Industrial temperature grade only - not AEC-Q100 qualified for automotive under-hood use. Lead-free and halogen-free per Microchip material declarations.
