S25FL128P0XMFI001 - 128Mb Serial NOR Flash, 3V, 104MHz SPI | Infineon
MPN: S25FL128P0XMFI001 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.19 | $2.19 |
| 10 | $1.97 | $19.70 |
| 100 | $1.75 | $175.00 |
| 500 | $1.55 | $775.00 |
| 1,000 | $1.38 | $1,380.00 |
S25FL128P0XMFI001 Overview
A serial NOR Flash is a non-volatile memory that uses a low-pin-count synchronous serial protocol (SPI) to read, program, and erase data. NOR Flash sits at the bottom of the memory hierarchy (memory IC -> non-volatile memory -> flash memory -> NOR flash) and is preferred over NAND for random-access read workloads such as boot code, firmware images, and execute-in-place (XIP) execution, because every byte is randomly addressable with consistent, low read latency.
Key specifications include a maximum SPI clock of 104 MHz in single-IO mode, page program time of approximately 1.5 ms (256 bytes), sector erase time of about 0.5 to 3.5 s for a 256 KB sector, and 100,000 program/erase cycles per sector endurance with 20-year data retention. The device supports JEDEC-standard SPI commands in addition to manufacturer-specific dual- and quad-I/O modes, and offers a hardware RESET#/WP#/HOLD# pin set for legacy compatibility. The 16-pin SOIC package is industry-standard 300-mil wide, surface-mountable, and RoHS-compliant.
Architecturally, the S25FL128P uses MirrorBit technology - a NOR-compatible cell that stores two bits per cell using charge trapping rather than floating gates. This delivers higher density at lower cost than traditional NOR while preserving the byte-random read access that distinguishes NOR from NAND. The integrated 256-byte page buffer and automatic program/erase algorithms simplify firmware development.
Typical applications include embedded firmware boot storage, IoT edge-node firmware update banks, automotive instrument-cluster graphics, point-of-sale terminals, industrial PLCs, set-top boxes, and consumer electronics requiring fast, deterministic code execution at power-up. The wide 2.7V-3.6V supply range also supports battery-backed designs.
When designing in this part, verify that the host MCU's SPI controller can either support dual/quad mode or fall back gracefully to single-IO mode. The RESET# pin should be tied to VCC through a pull-up for robust operation; if unused, it may be left open but is recommended to be tied high to avoid spurious resets during power-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select and qualify the S25FL128P0XMFI001 with confidence.
Drop-in alternatives for S25FL128P0XMFI001 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
S25FL128P0XMFI000
✅ Drop-In📋 Reference alternative (not in catalog)
S25FL128SAGMFI001
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S25FL128SAGMFI000
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S25FL128P0XMFV010
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MX25L12855EMI-10G
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IS25LP128F-RMLE-TR
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N25Q128A13ESFA0G
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S25FL128P0XMFI001 Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash (non-volatile) |
| Memory Density | 128 Mbit (16 MB) |
| Memory Organization | 16M x 8 bit |
| Interface | SPI (Serial Peripheral Interface) |
| SPI Clock Frequency (max) | 104 MHz |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Sector Configuration | 64 sectors x 256 KB (or 256 sectors x 64 KB) |
| Page Size | 256 bytes |
| Page Program Time (typ.) | 1.5 ms |
| Sector Erase Time (typ.) | 0.5 s to 3.5 s (256 KB sector) |
| Program/Erase Endurance | 100,000 cycles per sector |
| Data Retention | 20 years |
| Cell Technology | MirrorBit (2 bits/cell, charge-trap NOR) |
| Package | 16-pin SOIC (300-mil) |
| Operating Temperature | -40 C to +85 C (industrial) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
S25FL128P0XMFI001 Pin Configuration
| Pin 1 | /CS — Chip Select, active low |
| Pin 2 | SO — Serial Data Output (MISO) |
| Pin 3 | /WP — Write Protect, active low |
| Pin 4 | GND — Ground |
| Pin 5 | SI — Serial Data Input (MOSI) |
| Pin 6 | SCK — Serial Clock |
| Pin 7 | /HOLD — Hold, active low (pauses serial transfer) |
| Pin 8 | VCC — Power supply (2.7 V to 3.6 V) |
| Pin 9 | NC — Not connected (per datasheet) |
| Pin 10 | NC — Not connected (per datasheet) |
| Pin 11 | NC — Not connected (per datasheet) |
| Pin 12 | NC — Not connected (per datasheet) |
| Pin 13 | NC — Not connected (per datasheet) |
| Pin 14 | NC — Not connected (per datasheet) |
| Pin 15 | NC — Not connected (per datasheet) |
| Pin 16 | /RESET — Hardware Reset, active low |
Typical Applications
S25FL128P0XMFI001 is suitable for 7 applications: Embedded MCU Boot Loader Storage, IoT Edge Node Firmware Bank, Automotive Instrument Cluster Graphics, Industrial PLC Program Storage, Set-Top Box Firmware and Channel Database, Point-of-Sale Terminal Application Storage, Consumer Electronics Firmware Storage.
Embedded MCU Boot Loader Storage
The S25FL128P0XMFI001 stores primary boot loaders and application firmware in 32-bit MCU designs where deterministic read latency at power-up is critical. Its 104 MHz single-IO SPI bus supports execute-in-place (XIP), letting the MCU fetch instructions directly from the flash array without first copying to RAM, which reduces boot time and total RAM footprint. The 64-sector x 256 KB architecture enables per-application firmware updates without erasing the entire array, supporting A/B partitioning for fail-safe OTA upgrades in industrial gateways.
Recommended
IoT Edge Node Firmware Bank
In IoT edge nodes (Wi-Fi/BLE sensor endpoints, smart-home bridges), the S25FL128P0XMFI001 holds the main application image and an OTA staging bank. Its 2.7-3.6 V supply matches the 3.3 V rails common in battery-powered designs, and the 256-byte page program (~1.5 ms) keeps OTA-write energy budget low. The 100,000 P/E cycle endurance supports daily OTA updates over a typical 5-7 year product lifetime. The SPI bus easily hangs off an MCU's peripheral SPI master with no additional logic.
Recommended
Automotive Instrument Cluster Graphics
The S25FL128P0XMFI001 stores gauge graphics, warning icons, and boot logos in instrument clusters, infotainment controllers, and HVAC displays. Its 104 MHz SPI allows fast screen redraws, while the 16 MB density holds multiple language sets and animation frames. The MirrorBit cell technology provides the reliability required for in-vehicle operation, though for new automotive designs the AEC-Q100-qualified S25FL128S-Q1 family is recommended per Infineon's migration guidance. The 16-pin SOIC is hand-solderable for prototype and small-batch production.
Recommended
Industrial PLC Program Storage
In industrial PLCs and HMIs, the S25FL128P0XMFI001 retains ladder-logic programs, configuration data, and event logs across power cycles. Its 64-sector uniform architecture simplifies IEC 61131-3 run-time updates, and the SPI interface is electrically isolated easily via digital isolators for factory-floor noise immunity. The 20-year data retention meets the typical 10-15 year industrial product lifecycle, while 100,000 P/E cycles support frequent recipe and firmware revisions in process-control environments.
Recommended
Set-Top Box Firmware and Channel Database
The S25FL128P0XMFI001 holds main firmware, channel lineups, and EPG databases in set-top boxes and streaming media devices. Its 16 MB density accommodates large firmware images plus runtime data, while the 104 MHz SPI keeps boot times short. The 2.7-3.6 V range supports designs powered directly from a 3.3 V LDO on the main board. The 16-pin SOIC footprint is the de facto industry standard, simplifying supply-chain decisions.
Recommended
Point-of-Sale Terminal Application Storage
In POS terminals, the S25FL128P0XMFI001 stores the payment-application image, transaction-log buffer, and tamper-evidence records. Its deterministic byte-random read access is essential for cryptographic verification of firmware at every boot, supporting PCI-PTS security requirements. The 256-byte page-program granularity matches typical transaction-record sizes. Its 16-pin SOIC package is widely supported by security-certified POS reference designs, easing compliance documentation.
Recommended
Consumer Electronics Firmware Storage
The S25FL128P0XMFI001 is used in consumer products such as smart appliances, home audio, and wearables to store application firmware and user settings. Its 16 MB capacity suits mid-range appliances that need bilingual UI fonts, calibration tables, and DSP code. The 104 MHz SPI accelerates the factory-flash programming step, reducing per-unit production time. Its 16-pin SOIC is compatible with hand-rework and field-replacement scenarios common in consumer service channels.
Recommended
Recommended Products Summary
Engineering reference data for S25FL128P0XMFI001 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S25FL128P0XMFI000 | S25FL128SAGMFI001 | MX25L12855EMI-10G | IS25LP128F-RMLE-TR |
|---|---|---|---|---|---|
| Package | 16-pin SOIC (300-mil) | 16-pin SOIC (300-mil) - same | 16-pin SOIC (300-mil) - same | 16-pin SOIC (300-mil) - same | 16-pin SOIC (208-mil) - narrower body |
| Brand | Infineon | Infineon | Infineon | Macronix | ISSI |
| Density | 128 Mbit (16 MB) | 128 Mbit | 128 Mbit | 128 Mbit | 128 Mbit |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.3 V to 3.6 V (wider low side) |
| Cell Technology | MirrorBit (2 bits/cell, charge-trap NOR) | MirrorBit | MirrorBit (refined) | Standard floating-gate NOR | Standard floating-gate NOR |
| P/E Endurance | 100,000 cycles/sector | 100,000 cycles/sector | 100,000 cycles/sector | 100,000 cycles/sector | 100,000 cycles/sector |
| Data Retention | 20 years | 20 years | 20 years | 20 years | 20 years |
| Sector Configuration | 64 x 256 KB (uniform) | 64 x 256 KB | 256 x 64 KB | 256 x 64 KB | 256 x 64 KB |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Active | Active | Active |
Key Differentiators
- MirrorBit 2-bit/cell NOR technology for higher density at lower die cost (vs MX25L12855EMI-10G)
- Footprint-compatible upgrade path to S25FL128S family (vs MX25L12855EMI-10G)
- Industry-standard 300-mil SOIC-16 footprint, no migration required (vs IS25LP128F-RMLE-TR)
- Wide 2.7-3.6 V supply supports legacy 3.3 V rails (vs IS25LP128F-RMLE-TR)
Design Notes
Place a 0.1 uF decoupling capacitor as close as possible to the VCC pin (pin 8) of the S25FL128P0XMFI001, with a 10 uF bulk capacitor on the same 3.3 V rail within 25 mm. The SPI bus traces (SCK, SI, SO, /CS) should be length-matched within 25 mm to avoid timing skew at 104 MHz; route /CS separately so its return-path current does not disturb data lines. Keep SCK at least 3x trace-width away from switching converter nodes to prevent injection of supply noise into the read-data stream.
At 104 MHz SPI clock, the S25FL128P0XMFI001's output impedance on SO rises into the tens of ohms. Use a 33 ohm series resistor near the flash SO pin to dampen transmission-line ringing; the MCU's SPI peripheral should be configured to sample SCK on the rising edge to align with the flash's data-valid timing window. If your design supports dual or quad IO modes, route the additional data lanes (IO2/WP#, IO3/HOLD#) with matched impedance and avoid stubs.
Do not leave /RESET (pin 16) floating. Although the datasheet permits /RESET to be left open, in noisy industrial environments a transient on /RESET will halt SPI traffic and corrupt ongoing program/erase operations, potentially bricking the device. Tie /RESET to VCC through a 10 kohm pull-up resistor, or drive it from the host MCU GPIO for a clean power-sequenced reset. Similarly, ensure /WP and /HOLD are tied to VCC if not actively driven. Verify the host SPI controller does not enable its internal pull-ups on the SPI lines - those pull-ups can fight the flash's high-impedance output during read operations.
Active read current of the S25FL128P0XMFI001 peaks around 25 mA at 104 MHz SPI clock; program/erase current can spike to 30 mA. The local 3.3 V LDO must source at least 50 mA per flash with adequate transient response - a TPS7A4701-class LDO is overkill, but a basic 100 mA LDO such as NJW4181U3-15B is appropriate. Estimate: at VIN=5V, VOUT=3.3V, ILOAD=50 mA, power dissipation is approximately 0.085 W, well within a SOT-23 LDO's thermal envelope.
Compliance Information
RoHS compliant per Infineon (formerly Spansion/Cypress) product page. Halogen-free compliant per GlobalSpec cross-reference data. Not AEC-Q100 qualified; for automotive applications, migrate to S25FL128S-Q1 family.
