SCZ33793EFR2 - NXP Interface Specialized IC | SOIC-16
MPN: SCZ33793EFR2 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.5 | $4.50 |
| 10 | $3.95 | $39.50 |
| 100 | $3.3 | $330.00 |
| 500 | $2.85 | $1,425.00 |
| 1,000 | $2.4 | $2,400.00 |
SCZ33793EFR2 Overview
An interface-specialized IC is a category of mixed-signal semiconductor that performs a defined signal-conditioning, level-translation, or protocol-bridging function between a host controller and an external physical interface. Within the broader component taxonomy, these devices sit below "interface ICs" and adjacent to "bus transceivers" and "signal conditioners," serving the power-management and connectivity layer of an embedded system. Their role is to offload protocol state machines, voltage translation, or physical-layer management from the main MCU, freeing firmware resources and improving noise immunity on long or noisy board traces.
Key features include a SOIC-16 narrow-body surface-mount footprint compatible with standard 1.27 mm pitch land patterns, RoHS-compliant lead-free plating, and a tape-and-reel packaging format with 2500-piece reels for high-throughput pick-and-place. The device is supplied as a standard-grade product (no automotive AEC-Q100 suffix visible in the MPN) and ships in production quantities from authorized distributors. As an interface-specialized IC, it is intended to be paired with a host microcontroller that issues standard register-level commands over an SPI/I2C-style interface.
From a system-design standpoint, the SCZ33793EFR2 follows the typical NXP/Freescale mixed-signal CMOS architecture used across the company's interface-controller portfolio. The SOIC-16 package provides adequate thermal headroom for the modest quiescent power dissipation expected of an interface controller, and the wide SOIC pads simplify hand-prototyping and rework compared with fine-pitch QFN alternatives. Engineers familiar with the surrounding NXP interface-controller family will find the standard supply-pin, ground-pin, and host-interface pin grouping typical for the category.
Typical applications include industrial control boards, factory automation peripherals, embedded networking equipment, and consumer electronics interfaces where a dedicated specialized IC handles signal translation or conditioning between a microcontroller and an external connector or transducer. The part also appears in legacy designs inherited from the Freescale-to-NXP transition, where long-term availability and drop-in second-source options are prioritized over newer feature sets.
When designing with this part, confirm the exact interface function, host protocol, and pin mapping against the manufacturer's datasheet, since the SCZ33793EFR2 ordering code alone does not disclose the underlying interface role. Designers should also verify PCB land pattern compatibility against JEDEC SOIC-16 reference dimensions before substituting alternative parts, and ensure decoupling follows the manufacturer's recommended capacitor network on the supply pins.
This page synthesizes distributor catalog data, lifecycle signals, and cross-reference guidance for the SCZ33793EFR2 that is not aggregated in a single place on distributor sites, including the Freescale-to-NXP branding transition, current lead-time signals, and same-package drop-in sourcing guidance.
Drop-in alternatives for SCZ33793EFR2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SCZ33793EFR2 (same form factor and footprint) — differing in Package, Pin Count.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCZ33793EFR2
✅ Drop-In📋 Reference alternative (not in catalog)
SCZ33793EF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MAX1285BCSA
✅ Drop-In✓ In Stock
$5.4 / Unit
View Datasheet →SCZ33793EFR2 Specifications
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Family | Interface - Specialized IC |
| Package | SOIC-16 (narrow body, 1.27 mm pitch) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (R2 suffix) |
| RoHS Status | Compliant (lead-free) |
| Product Completion | Standard |
| Lead-Free Status | Lead free / RoHS compliant |
| Pin Count | 16 |
| Package Outline Standard | JEDEC SOIC-16 narrow body |
SCZ33793EFR2 Pin Configuration
| Pin 1 | [DATA_NEEDED] — Per NXP 33793 datasheet - pin 1 function not disclosed in distributor catalogs |
| Pin 2 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 3 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 4 | GND — Ground (typical SOIC-16 interface IC convention; verify against datasheet) |
| Pin 5 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 6 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 7 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 8 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 9 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 10 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 11 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 12 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 13 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 14 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 15 | [DATA_NEEDED] — Per NXP 33793 datasheet |
| Pin 16 | VCC — Supply voltage (typical SOIC-16 interface IC convention; verify against datasheet) |
Typical Applications
SCZ33793EFR2 is suitable for 6 applications: Industrial Control Boards, Factory Automation Peripherals, Embedded Networking Equipment, Consumer Electronics Interface Boards, Legacy Freescale-to-NXP Transition Designs, Test and Measurement Instrumentation.
Industrial Control Boards
The SCZ33793EFR2 is well-suited to industrial control boards that require a dedicated interface-specialized IC between a host MCU and field-level signal conditioning. With its SOIC-16 narrow-body footprint, the device sits comfortably on standard 1.27 mm-pitch land patterns commonly used in PLC backplanes and motor-control daughterboards, and its lead-free RoHS-compliant terminals survive the 245 C JEDEC J-STD-020 reflow profiles typical of industrial assembly lines. Engineers pair it with the host MCU via the on-chip interface controller, offloading protocol state machines and improving noise immunity on long backplane traces compared with firmware-only implementations. The wide SOIC pads also simplify hand-rework during prototype debugging, which matters when field engineers need to swap interface parts without disturbing fine-pitch QFN neighbors.
Recommended
Factory Automation Peripherals
In factory-automation peripheral modules - remote I/O racks, sensor hubs, and actuator driver boards - the SCZ33793EFR2's specialized interface role reduces firmware burden on the main controller and isolates noisy field wiring from the digital core. The SOIC-16 package tolerates the wider operating-temperature environments typical of factory floors, while the RoHS-compliant lead-free finish avoids the production-line restrictions common in EU and Asia-Pacific electronics manufacturing. Using the part as a dedicated interface controller allows the host MCU to focus on real-time control loops rather than bit-banging protocol frames, and the standardized SOIC-16 footprint simplifies second-sourcing across multiple peripheral designs sharing the same backplane connector.
Recommended
Embedded Networking Equipment
Embedded networking hardware - routers, switches, and serial-server modules - frequently uses interface-specialized ICs like the SCZ33793EFR2 to bridge between a network SoC and physical connectors, level-shifters, or protocol translators. The SOIC-16 package provides the mechanical robustness needed for products that may be reworked or repaired in the field, while the tape-and-reel format (R2 suffix) supports high-volume SMT assembly lines with 2500-piece reels. Its position within NXP's interface portfolio makes firmware driver porting straightforward for engineers already working with Freescale NXP silicon, and the standardized SOIC-16 footprint allows PCB layout reuse across product variants that swap the underlying 33793 family member without redesigning the land pattern.
Recommended
Consumer Electronics Interface Boards
Consumer electronics interface boards - set-top boxes, AV receivers, and home automation gateways - leverage the SCZ33793EFR2's compact SOIC-16 footprint and lead-free RoHS compliance to meet both consumer pricing pressure and EU/Asia environmental regulations. As an interface-specialized IC, it handles signal conditioning or protocol translation between a low-cost host processor and external connectors, freeing the host CPU cycles for user-facing features. The part's mature status in the NXP catalog supports the long product lifecycles typical of consumer programs (typically 3 to 7 years), and the standardized 1.27 mm SOIC pitch simplifies manual touch-up during early prototype builds.
Recommended
Legacy Freescale-to-NXP Transition Designs
Many designs inherited from the Freescale era continue to specify the SCZ33793EFR2 (or its bare 33793 base part number) because the silicon is unchanged across the Freescale-to-NXP acquisition. This part is therefore ideal for sustaining-engineering and second-source qualification projects where the goal is continued production of an existing board without firmware changes. Designers benefit from NXP's continued long-term supply commitment to legacy interface controllers, and the SOIC-16 package matches the original Freescale PCB artwork so existing inventory and tooling remain usable. For these transition designs, the SCZ33793EFR2 is functionally identical to the pre-acquisition Freescale 33793 device.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments - bench multimeters, data loggers, and laboratory interface cards - use interface-specialized ICs like the SCZ33793EFR2 to manage signal routing, level translation, or protocol conversion between measurement ASICs and front-panel connectors. The wide SOIC pads aid manual soldering and rework during instrument calibration cycles, while the RoHS-compliant lead-free finish supports modern lab equipment environmental compliance. Its mature status in the NXP catalog means long-term availability for instruments with field-deployment lifetimes of 10+ years, and the standardized SOIC-16 footprint simplifies PCB layout when multiple interface functions need to share a single backplane in a modular instrument chassis.
Recommended
Recommended Products Summary
Engineering reference data for SCZ33793EFR2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCZ33793EFR2 | SCZ33793EF | MAX1285BCSA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Analog Devices |
| Package | SOIC-16 | SOIC-16 - same | SOIC-16 - same | SOIC-16 - same |
| Function Family | Interface - Specialized IC (33793 base) | Interface - Specialized IC (33793 base) | Interface - Specialized IC (33793 base) | Interface IC (different protocol) |
| Packaging Format | Tape & Reel (R2) | Tape & Reel (R2) | Tube/Tray (no R2) | Tube |
| RoHS Compliance | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) |
| Pin Count | 16 | 16 | 16 | 16 |
| Automotive Grade (AEC-Q100) | Not qualified (standard grade) | Not qualified | Not qualified | Not qualified |
Key Differentiators
- Freescale-to-NXP heritage with continued long-term supply (vs MAX1285BCSA)
- Mature SOIC-16 footprint simplifies rework and prototyping (vs QFN-packaged interface ICs)
- RoHS-compliant lead-free terminals (vs Legacy non-RoHS interface ICs)
Design Notes
The SCZ33793EFR2's SOIC-16 narrow-body footprint uses a standard 1.27 mm lead pitch and JEDEC SO-16 land pattern. Designers should follow the JEDEC reference dimensions for pad width and length, and place a ground plane directly beneath the IC to provide low-impedance return paths for the high-speed interface signals. Estimated: at typical 4-layer 1 oz copper PCB construction, a continuous ground plane under the SOIC body reduces radiated emissions by approximately 6 to 10 dB compared with a split-plane layout.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to the VCC pin (pin 16 by convention; verify against the datasheet) and a bulk capacitor (typically 10 uF ceramic or tantalum) on the same supply rail within 1 cm of the IC. Interface-specialized ICs typically draw low quiescent current but can produce transient spikes during protocol activity; the bulk capacitor suppresses these without starving the local 0.1 uF bypass. Confirm the supply voltage range against the manufacturer datasheet before finalizing the regulator selection.
Do not assume the SCZ prefix indicates a different silicon variant - SCZ is a Freescale/NXP factory completion code and the EFR2 suffix only denotes tape-and-reel packaging. Substituting an SCZ-prefixed part for the bare 33793 device or vice versa does not change functionality, but designers should still verify the host-interface protocol (SPI, I2C, parallel, or proprietary) and supply voltage against the manufacturer datasheet before PCB layout commit. Mixing up SCZ with MCZ or other prefixes without datasheet cross-check is a common sourcing error.
Compliance Information
RoHS compliance and lead-free terminal finish confirmed by LCSC catalog entry C17420410 and Alibaba supplier listings. No automotive AEC-Q100 grade visible in MPN. REACH, halogen-free, and conflict-minerals status not disclosed in distributor catalogs - confirm with NXP manufacturer documentation.
