SN74LVC1G3157DCKR - SPDT Analog Switch, 15Ohm, SC-70-6 | TI
MPN: SN74LVC1G3157DCKR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.55 | $0.55 |
| 10 | $0.49 | $4.90 |
| 100 | $0.38 | $38.00 |
| 500 | $0.31 | $155.00 |
| 1,000 | $0.26 | $260.00 |
| 3,000 | $0.22 | $660.00 |
SN74LVC1G3157DCKR Overview
An analog switch (also called a bilateral switch or pass gate) is a semiconductor device that uses CMOS transmission gates to connect or isolate two signal paths under logic-level control. In the broader taxonomy, analog switches sit under signal switches -> multiplexers/switches -> interface ICs -> integrated circuits. They are widely used to route analog audio, video, sensor signals, or digital logic between multiple sources and a common destination, replacing mechanical relays with a solid-state, low-power alternative.
Key features of the SN74LVC1G3157 include rail-to-rail signal handling, specified break-before-make switching, low on-state resistance flatness across the signal range, 1.8V logic-compatible control input, and ESD protection per the JESD22 standard. The device supports 5V tolerant signal passing even when VCC is only 1.8V, increasing design flexibility in mixed-voltage systems such as mobile phones, tablets, and wearables that interface legacy 5V peripherals with newer 1.8V cores.
Architecturally, the SN74LVC1G3157 uses complementary CMOS N-channel and P-channel MOSFETs in a transmission-gate configuration. This topology delivers bidirectional current flow, near-zero DC offset (tens of microvolts), and high linearity. The device draws very low quiescent current (typically <1 uA), extending battery life in always-on monitoring paths. ESD protection on the signal and control pins exceeds 2 kV HBM, providing robustness in handling and field deployment.
Typical applications include audio signal routing (headset/handset multiplexing), SIM card multiplexing in mobile handsets, USB signal switching, analog/digital signal multiplexing in test equipment, signal fan-out for ADCs, and space-constrained IoT sensor nodes. The SC-70-6 footprint occupies only 2.0 mm x 1.25 mm of board area, ideal for compact consumer designs.
When designing with this device, place ceramic bypass capacitors (0.1 uF) adjacent to VCC and GND, and keep high-speed signal traces short and impedance-controlled. Verify break-before-make behavior at your specific load capacitance, as excessive capacitance can cause momentary shorts during transition.
This page synthesizes distributor pricing, drop-in SC-70-6 alternatives, and practical signal-integrity design notes not consolidated in any single manufacturer datasheet.
Drop-in alternatives for SN74LVC1G3157DCKR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SN74LVC1G3157DCKR (same form factor and footprint) — differing in Function, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SN74LVC1G3157DRLR
✅ Drop-In📋 Reference alternative (not in catalog)
SN74LVC1G3157DCKR Maximum Ratings & Electrical Characteristics
| Function | Single-Pole Double-Throw (SPDT) Analog Switch |
| Number of Channels | 1 |
| Configuration | 2:1 (1 of 2) |
| On-State Resistance (Ron) | 15 ohm (typical) |
| Supply Voltage (VCC) | 1.65 V to 5.5 V |
| Signal Path Voltage Range | 0 V to VCC (rail-to-rail) |
| Bandwidth | 340 MHz (typical) |
| Propagation Delay | 0.5 ns typical at 50 pF |
| On-State Resistance Flatness | Low (per datasheet curves) |
| Quiescent Current (ICC) | <1 uA typical |
| Control Input Logic Levels | 1.8V CMOS compatible at VCC=2.7V-5.5V |
| Switching Behavior | Break-before-make |
| Operating Temperature Range | -40C to +85C |
| ESD Protection | 2 kV HBM (per JESD22) |
| Package | SC-70-6 (DCK) 2.0 mm x 1.25 mm |
| Mounting Type | Surface Mount |
| MSL (Moisture Sensitivity Level) | 1 (unlimited floor life) |
| RoHS / Lead-Free | Yes / Yes |
SN74LVC1G3157DCKR Pin Configuration
| Pin 1 | B2 — Switch terminal 2 (normally open channel) |
| Pin 2 | S — Common switch terminal / signal path |
| Pin 3 | NC — Not connected (per datasheet) |
| Pin 4 | B1 — Switch terminal 1 (normally closed channel) |
| Pin 5 | GND — Ground reference |
| Pin 6 | VCC — Supply voltage (1.65V to 5.5V) |
Typical Applications
SN74LVC1G3157DCKR is suitable for 7 applications: Mobile Handset Headset Audio Multiplexing, SIM Card Signal Multiplexing, USB 2.0 Differential Pair Routing, Test Equipment Signal Multiplexing, Battery-Powered Sensor Signal Switching, Audio DAC Input Source Selection, Portable Medical Patch Routing.
Mobile Handset Headset Audio Multiplexing
Routes left/right audio channels or switched between headphone/handset paths. The SN74LVC1G3157's 15 ohm Ron and 340 MHz bandwidth preserve audio transparency across the 20 Hz to 20 kHz band, while its <1 uA quiescent current extends standby time on mobile battery. Placed between the audio CODEC output and the headset jack with a 0.1 uF bypass on VCC; its rail-to-rail switching accepts line-level signals up to VCC without clipping.
Recommended
SIM Card Signal Multiplexing
Switches between two SIM card interfaces on a single host transceiver. The SN74LVC1G3157 supports 1.8V/3V SIM voltage levels through its 1.65V-5.5V VCC range and bidirectional signal path, with break-before-make switching preventing momentary short between active SIM data lines. Per TI datasheet SCES424H, the 2 kV HBM ESD on signal pins protects the SIM contacts against electrostatic discharge during card insertion events.
Recommended
USB 2.0 Differential Pair Routing
Routes USB D+/D- between USB connector and dual MCUs or between host/device modes. The SN74LVC1G3157's 0.5 ns propagation delay and 340 MHz bandwidth comfortably pass USB 2.0 full-speed (12 Mbps) and low-speed (1.5 Mbps) signals with <2 dB insertion loss. The 15 ohm Ron adds a small series resistance balanced by the host's output transceiver drive strength; place the switch within 5 mm of the connector for best signal integrity.
Recommended
Test Equipment Signal Multiplexing
Multiplexes analog signals from multiple test points to a single ADC input in bench instruments and ATE systems. The 15 ohm Ron and low on-resistance flatness maintain measurement accuracy over the input range, while 0.5 ns switching speed supports multiplexed sampling at >1 MSPS. Per TI datasheet SCES424H, the -80 dB crosstalk at 1 MHz keeps adjacent channel leakage well below the 12-bit ADC noise floor.
Recommended
Battery-Powered Sensor Signal Switching
Switches sensor excitation or signal paths in low-duty-cycle IoT sensor nodes. The SN74LVC1G3157 typically draws <1 uA quiescent current, allowing it to remain continuously biased without taxing the battery budget; the SC-70-6 footprint adds only 2.0 mm x 1.25 mm to the PCB. When paired with a low-power MCU's GPIO for control, the switch can dynamically connect thermistor bridges, photodiodes, or gas sensor elements only during measurement windows.
Recommended
Audio DAC Input Source Selection
Selects between digital audio inputs (S/PDIF coax vs optical, or HDMI vs analog) feeding a high-end DAC. The SN74LVC1G3157's 15 ohm Ron and 340 MHz -3 dB bandwidth negligibly degrade jitter-sensitive signals; its break-before-make action eliminates click artifacts during source transitions. Placed between the input connector and the DAC's I2S receiver with controlled-impedance traces, the switch preserves 100 dB SNR audio quality.
Recommended
Portable Medical Patch Routing
Routes ECG/EEG signals from lead sets to a low-power analog front end in wearable patient monitors. The SN74LVC1G3157's medical-friendly <1 uA quiescent draw preserves battery life across multi-day patches, while its 2 kV HBM ESD withstands handling during patient application. With 15 ohm Ron adding negligible series resistance to high-impedance electrode signals, the switch maintains signal integrity across the 0.5 Hz to 150 Hz ECG band.
Recommended
Recommended Products Summary
Engineering reference data for SN74LVC1G3157DCKR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TS5A3157DCKR | NC7SB3157P6X | SN74LVC1G3157DRLR |
|---|---|---|---|---|
| Package | SC-70-6 (DCK) 2.0x1.25 mm | SC-70-6 (DCK) | SC-70-6 (P6X) | SOT-563-6 (DRL) |
| Brand | Texas Instruments | Texas Instruments | onsemi | Texas Instruments |
| On-Resistance (Ron) | 15 ohm typical | ~10 ohm typical | 15 ohm typical | 15 ohm typical |
| Supply Voltage (VCC) | 1.65V to 5.5V | 1.65V to 5.5V | 1.65V to 5.5V | 1.65V to 5.5V |
| Automotive Grade (AEC-Q100) | No | No | No | No |
| Logic Compatibility at 1.8V VCC | 1.8V CMOS | 1.8V CMOS | 1.8V CMOS | 1.8V CMOS |
Key Differentiators
- Ultra-low quiescent current for battery-powered designs (vs TS5A3157DCKR)
- Industry's broadest second-source footprint (vs Single-source competitor parts)
- Wide 1.65V-5.5V supply for mixed-voltage systems (vs Older 2.7V-5.5V-only analog switches)
Design Notes
Place a 0.1 uF ceramic bypass capacitor within 1 mm of the VCC pin (pin 6) and a ground via within 0.5 mm of the GND pin (pin 5). For high-speed analog signals above 10 MHz, use controlled-impedance traces (typically 50 ohm single-ended) and avoid right-angle bends. The SC-70-6 package is small enough that the device can sit directly under a connector footprint, minimizing stub lengths on USB or audio lines.
Verify break-before-make behavior at your worst-case load capacitance (typically 50 pF for USB, 20 pF for audio). Per TI datasheet SCES424H, the switch guarantees non-overlap between B1 and B2 selections under nominal load, but capacitive loads above 100 pF may introduce transient cross-conduction. Add a small series resistor (10-33 ohm) at the common S pin if ringing exceeds 20% of signal swing during transitions.
Do not apply signals on the B1/B2/S pins greater than VCC + 0.5V; the absence of internal clamping on over-voltage can permanently damage the CMOS transmission gates. When using the device for audio, keep the signal amplitude below 0.95 x VCC to avoid distortion on the peak. Finally, ensure the SEL control input is driven with a clean logic level; a floating or high-impedance SEL pin allows leakage paths through the parasitic MOSFET gates and may select neither channel cleanly.
Compliance Information
The standard SN74LVC1G3157DCKR is not AEC-Q100 qualified; use the SN74LVC1G3157QDCKRQ1 suffix variant for automotive applications. RoHS and lead-free confirmed per TI product page and standard DCK packaging marking code.
