STM32MP157DAC3 - Dual Cortex-A7 650MHz MPU | STMicroelectronics
MPN: STM32MP157DAC3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.23 | $1.23 |
| 10 | $1.15 | $11.50 |
| 100 | $1.05 | $105.00 |
| 500 | $0.98 | $490.00 |
| 1,000 | $0.92 | $920.00 |
STM32MP157DAC3 Overview
An MPU (microprocessor unit) sits above a microcontroller in the embedded hierarchy: unlike an MCU that runs bare-metal or RTOS firmware from internal flash, an MPU boots a full operating system such as Linux from external DDR memory and storage, while this device uniquely also embeds an STM32-class Cortex-M4 core for hard real-time tasks, bridging the gap between application processors and microcontrollers.
Key features include the dual Arm Cortex-A7 cores at 650 MHz for Linux application processing, the Cortex-M4 at 209 MHz for deterministic real-time control, and a rich peripheral set with CAN FD for industrial networking. The STM32MP157 family is documented with up to 37 communication interfaces and 29 timers on higher variants, providing extensive connectivity for industrial designs.
Architecturally, the device combines the Arm Cortex-A application domain with an STM32MCU-style peripheral domain, sharing a common ecosystem: developers use the STM32Cube ecosystem, OpenSTLinux distribution, and STM32CubeMX configuration tools. This heterogenous multi-core architecture allows Linux on the A7 cores and bare-metal or RTOS firmware on the M4 core, communicating via OpenAMP/RPMsg inter-processor communication.
Typical applications include industrial HMI and touch panels, building automation controllers, gateways with CAN FD and industrial Ethernet, and medical or test instruments needing both a graphical Linux interface and real-time motor or sensor control loops.
A key design consideration is memory: the MPU has no internal flash for code execution, so the BOM must include external DDR3/DDR3L SDRAM and a boot device (eMMC, NAND, SD, or QSPI), and power-tree design must respect the multiple supply rails required by the TFBGA package.
This page synthesizes distributor sourcing data, drop-in alternative analysis within the STM32MP157 family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for STM32MP157DAC3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with STM32MP157DAC3 (same form factor and footprint) — differing in Core Processor.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
STM32MP157CAC3
✅ Drop-In✓ In Stock
$24.2 / Unit
View Datasheet →STM32MP157CAD3
✅ Drop-In📋 Reference alternative (not in catalog)
STM32MP157AAC3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5 / Unit
View Datasheet →STM32MP151AAD3
✅ Drop-In✓ In Stock
$7.42 / Unit
View Datasheet →STM32MP133CAG3
✅ Drop-In📋 Reference alternative (not in catalog)
STM32MP157DAC3 Maximum Ratings & Electrical Characteristics
| Core Processor | Arm dual Cortex-A7 + Cortex-M4 |
| Cortex-A7 Core Frequency | 650 MHz |
| Cortex-M4 Core Frequency | 209 MHz |
| Core Architecture | 2 Core, 32-Bit |
| Series | STM32MP1 |
| Number of Terminals | 361 |
| Package Code | TFBGA |
| Package Shape | Square |
| Terminal Form | BALL |
| Temperature Grade | Industrial |
| Mounting Type | Surface Mount |
| CAN FD Interface | Yes |
| Display Interface | TFT/MIPI-DSI (per family datasheet) |
| Product Type | Microprocessor, RISC |
| Communication Interfaces (family max) | Up to 37 (STM32MP157C/F variants) |
| Timers (family max) | Up to 29 (STM32MP157C/F variants) |
STM32MP157DAC3 square Pin Configuration Guide
Pin configuration for STM32MP157DAC3 (square package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.
No detailed pinout data available for STM32MP157DAC3.
Refer to the datasheet for full pin configuration.
Typical Applications
STM32MP157DAC3 is suitable for 6 applications: Industrial HMI and Touch Panels, Industrial Gateways and Edge Controllers, Building Automation Controllers, Test and Measurement Instruments, Medical Monitoring Devices, Robotics and Motor Control Nodes.
Industrial HMI and Touch Panels
The STM32MP157DAC3 fits industrial HMI designs because the STM32MP157 family integrates a TFT display controller with MIPI-DSI interface and a 3D GPU, enabling rich Qt or HTML5-based interfaces under OpenSTLinux on the dual 650 MHz Cortex-A7 cores. The 209 MHz Cortex-M4 independently scans touch, drives buzzers and handles safety interlocks with deterministic latency that Linux cannot guarantee. With 37-class communication interfaces on the family and CAN FD support, the MPU connects directly to PLCs and drives. Design consideration: the HMI framebuffer runs from external DDR3, so memory bandwidth and display resolution should be budgeted together to avoid tearing under peak Ethernet load.
Recommended
Industrial Gateways and Edge Controllers
For protocol-conversion gateways, the STM32MP157DAC3 offers CAN FD plus the STM32MP1 family's extensive serial/ Ethernet interfaces, letting one 361-ball TFBGA device terminate industrial fieldbus on the Cortex-M4 while Linux on the Cortex-A7 cores runs MQTT/OPC UA stacks toward the cloud. The dual-core split keeps fieldbus timing immune to Linux scheduling jitter, and the industrial temperature grade suits cabinet installation. Design consideration: galvanic isolation and ESD protection must be added externally on CAN and Ethernet PHY lines; the MPU itself does not integrate them. OpenSTLinux Yocto recipes accelerate integration of secure OTA update frameworks for long-life deployments.
Recommended
Building Automation Controllers
Building automation controllers benefit from the STM32MP157DAC3 combination of Linux-class application processing and real-time I/O: the Cortex-A7 cores at 650 MHz run BACnet/KNX protocol stacks and local web dashboards, while the Cortex-M4 at 209 MHz handles deterministic sensor polling, DALI dimming, and HVAC control loops. CAN FD and multiple UART/SPI interfaces integrate meters, access control readers, and gateways. Because the design runs from external DDR and eMMC, long product lifetimes should pair the controller with industrial-grade storage. The single-package solution replaces an SoC-plus-MCU two-chip architecture, cutting BOM count and simplifying certification.
Recommended
Test and Measurement Instruments
Benchtop and portable instruments use the STM32MP157DAC3 to combine a Linux UI with hard real-time acquisition: the 209 MHz Cortex-M4 services ADC triggers and precision timing while the dual 650 MHz Cortex-A7 cores run graphical analysis, data logging, and network export. The STM32MP157 family's advanced analog peripherals and 29-timer capability (family max) support PWM stimulus and capture functions. The industrial temperature grade suits field instruments. Design consideration: analog front-end noise must be managed with careful power-plane separation, since the MPU digital switching shares the PCB with sensitive measurement paths; the ST evaluation boards document reference grounding strategies.
Recommended
Medical Monitoring Devices
Connected medical monitors leverage the STM32MP157DAC3 to run patient-facing GUIs under Linux on the Cortex-A7 cores while the Cortex-M4 performs deterministic sample timing and alarm watchdog functions, a split that simplifies safety argumentation versus single-core Linux designs. The MIPI-DSI display path drives touch screens; industrial temperature grade covers demanding clinical environments. The 3D GPU accelerates waveform rendering. Design consideration: medical designs must validate the boot chain and enable readout protection/secure boot options available in the STM32MP157 security roadmap, and external memory selection should prioritize components with long-term availability commitments for regulated product lifecycles.
Recommended
Robotics and Motor Control Nodes
Robot joints and mobile-robot controllers pair the STM32MP157DAC3's Cortex-M4 core at 209 MHz with hardware timers for multi-axis FOC motor control at deterministic loop rates, while the dual Cortex-A7 cores at 650 MHz run ROS 2 or trajectory planning under Linux. CAN FD provides the intra-robot bus to other joints and sensors. The heterogenous architecture avoids latency spikes from Linux in current loops, which is critical for torque control stability. Design consideration: gate-driver and current-sense circuitry remain external; the ST motor-control ecosystem provides reference firmware for the M4 core to shorten integration time.
Recommended
Recommended Products Summary
Engineering reference data for STM32MP157DAC3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32MP157CAC3 | STM32MP157CAD3 | STM32MP157AAC3 | STM32MP151AAD3 |
|---|---|---|---|---|---|
| Package | 361-ball TFBGA (12x12 class) | 361-ball TFBGA - same | 361-ball TFBGA - same | 361-ball TFBGA - same | 361-ball TFBGA - same family |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Cortex-A7 Cores / Frequency | 2 x 650 MHz | 2 x 650 MHz | 2 x 650 MHz | 2 x 650 MHz | dual A7 (per family) |
Key Differentiators
- Heterogenous dual A7 + M4 architecture (vs STM32MP151AAD3)
- Feature/security line selection flexibility (vs STM32MP157CAC3)
- 650 MHz speed grade with industrial temperature (vs STM32MP157AAC3)
Design Notes
The STM32MP1 series requires a multi-rail power tree (core VCORE, VDD, VDDA, DDR rails and others) sequenced per the ST power supply guidelines. ST reference designs use the STPMIC1 power PMIC companion, which integrates the required buck/buck-boost/LDO rails plus DDR termination and I2C control - strongly recommended over discrete regulators for first-pass success. Verify power-up ordering in the ST reference manual before layout freeze; incorrect sequencing can prevent boot or stress internal ESD structures.
The 361-ball TFBGA fine-pitch ballout demands an HDI stackup. Use microvia-in-pad or blind vias to escape inner ball rows, and plan DDR3/DDR3L routing with length matching within the groups specified in the ST hardware development application note. Provide solid, unbroken reference planes under the DDR bus and place termination per the ST memory design guide. Estimate: a 4-layer board is generally insufficient; plan 6-10 layers for a production MPU design.
Two frequent mistakes: (1) forgetting that code executes from external DDR - boot media (eMMC/SD/NAND/QSPI) and its boot-pin strap configuration must be designed in from day one; (2) underestimating the Cortex-M4 core - it shares some peripherals and package pins with the A7 domain, so pin muxing must be co-planned across Linux device tree and M4 firmware to avoid resource conflicts. Use STM32CubeMX pinout conflict checking early.
Compliance Information
Compliance data was not present in the sourced web data for this specific MPN. ST standard MPU production is generally RoHS/lead-free, but per data authenticity rules this must be confirmed on the ST product page compliance documents before reliance.
