STM32MP157CAC3 - Dual Cortex-A7 + M4 MPU | STMicroelectronics
MPN: STM32MP157CAC3 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.9 | $6,450.00 |
| 1,000 | $11.5 | $11,500.00 |
Drop-in alternatives for STM32MP157CAC3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
STM32MP157DAC3
β Drop-Inπ Reference alternative (not in catalog)
STM32MP157CAC3
β Drop-Inβ 99,999 In Stock
$11.5 / Unit
View Datasheet βSTM32MP157CAC3
β Drop-Inβ 99,999 In Stock
$11.5 / Unit
View Datasheet βSTM32MP157CAC3
β Drop-Inβ 99,999 In Stock
$11.5 / Unit
View Datasheet βSTM32MP157CAC3 Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-A7 (dual) + Cortex-M4 |
| Core Frequency | 650 MHz (A7) / 209 MHz (M4) |
| Number of Cores | 3 (2x A7 + 1x M4) |
| RAM Size | 708 KB SRAM |
| Program Memory Type | External (no internal flash) |
| Program Memory Size | 0 B (external memory required) |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG |
| Number of I/O | 118 |
| Peripherals | DMA, POR, PWM, WDT |
| Number of ADC Channels | 16 |
| Resolution of ADC | 12-bit |
| Operating Temperature | -40Β°C to +125Β°C |
| Package | 361-TFBGA (18x18 mm) |
| Mounting Type | Surface Mount |
| Supply Voltage | 1.8V to 3.3V (I/O), 1.2V (core) |
| Graphics | 3D GPU (OpenGL ES 2.0), MIPI DSI |
| Security | AES, DES, 3DES, SHA-1, SHA-256, MD5 |
| RoHS Status | Compliant |
STM32MP157CAC3 Pin Configuration
| Pin A1 | VDD β Power supply (1.8V-3.3V) |
| Pin A2 | VSS β Ground |
| Pin B1 | PA0 β GPIO / ADC input |
| Pin B2 | PA1 β GPIO / ADC input |
| Pin C1 | PB0 β GPIO / Timer |
| Pin C2 | PB1 β GPIO / Timer |
| Pin D1 | PC0 β GPIO / ADC input |
| Pin D2 | PC1 β GPIO / ADC input |
| Pin E1 | PD0 β GPIO / Ethernet |
| Pin E2 | PD1 β GPIO / Ethernet |
| Pin F1 | PE0 β GPIO / UART |
| Pin F2 | PE1 β GPIO / UART |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
STM32MP157CAC3 is suitable for 6 applications: Industrial HMI, Smart Home Gateway, Medical Monitoring Device, IoT Edge Node, Automotive Infotainment, Robotics Controller.
Industrial HMI
The STM32MP157CAC3 is ideal for industrial human-machine interfaces (HMI) due to its dual Cortex-A7 cores running Linux with a graphical user interface, integrated 3D GPU, and MIPI DSI display controller. It supports high-resolution displays and touchscreens, while the Cortex-M4 core handles real-time I/O and communication with PLCs and sensors. The device's Ethernet and CAN FD interfaces enable seamless integration into industrial networks. Its wide temperature range (-40Β°C to +125Β°C) ensures reliable operation in harsh factory environments. The rich peripheral set (UART, SPI, I2C) allows connection to various industrial sensors and actuators. The secure boot feature protects against unauthorized firmware modifications, critical for industrial security.
Recommended
Smart Home Gateway
The STM32MP157CAC3 serves as a powerful smart home gateway, running Linux to manage multiple communication protocols (Wi-Fi, Zigbee, Bluetooth) via USB or UART-connected modules. The dual Cortex-A7 cores handle protocol stacks and cloud connectivity, while the Cortex-M4 core manages real-time sensor data acquisition and device control. The integrated Ethernet and USB OTG interfaces provide wired and wireless connectivity options. The device's low-power modes (Stop, Standby) enable energy-efficient operation for always-on gateways. The security features (cryptographic accelerator) ensure secure communication with cloud services. The 3D GPU can render user interfaces for local display or remote access.
Recommended
Medical Monitoring Device
The STM32MP157CAC3 is suitable for medical monitoring devices such as patient monitors and diagnostic equipment. The dual-core architecture allows Linux to run complex algorithms for signal processing and data logging, while the Cortex-M4 core handles real-time acquisition of vital signs (ECG, SpO2, blood pressure) from sensors. The device's high-resolution ADC (12-bit, 16 channels) ensures accurate sensor readings. The integrated display controller and GPU enable graphical waveforms and user interfaces. The wide operating temperature range and long-term availability make it suitable for medical devices. Security features protect patient data, complying with healthcare regulations. The device supports various communication interfaces (Ethernet, USB, UART) for connectivity to hospital networks.
Recommended
IoT Edge Node
The STM32MP157CAC3 acts as an IoT edge node, processing data locally before sending it to the cloud. The dual Cortex-A7 cores run Linux with edge computing frameworks (e.g., AWS Greengrass, Azure IoT Edge), while the Cortex-M4 core handles sensor data collection and real-time control. The device's connectivity options (Ethernet, USB, UART) allow connection to various sensors and actuators. The cryptographic accelerator enables secure communication with cloud services. The low-power modes extend battery life in remote deployments. The device's processing power enables local AI inference for anomaly detection, reducing latency and bandwidth usage. The wide temperature range and industrial-grade reliability make it suitable for outdoor and harsh environments.
Recommended
Automotive Infotainment
The STM32MP157CAC3 can be used in automotive infotainment systems, providing a rich graphical user interface for navigation, media playback, and vehicle diagnostics. The dual Cortex-A7 cores run Linux or Android, while the Cortex-M4 core handles real-time CAN communication with vehicle ECUs. The integrated GPU and display controller support high-resolution touchscreens. The device's CAN FD interfaces enable high-speed communication with modern vehicle networks. The wide temperature range (-40Β°C to +125Β°C) meets automotive requirements. The security features (secure boot, cryptographic acceleration) protect against unauthorized access. The device's low-power modes help reduce energy consumption when the vehicle is off.
Recommended
Robotics Controller
The STM32MP157CAC3 is well-suited for robotics controllers, where the Cortex-M4 core handles real-time motor control and sensor fusion, while the Cortex-A7 cores run high-level algorithms for path planning and computer vision. The device's PWM timers and ADC channels interface with motor drivers and encoders. The Ethernet interface enables communication with other robots or a central control system. The 3D GPU can render a visualization of the robot's environment. The device's processing power supports simultaneous localization and mapping (SLAM) algorithms. The wide temperature range and industrial reliability make it suitable for factory robots and drones.
Recommended
Recommended Products Summary
Engineering reference data for STM32MP157CAC3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32MP157CAB3 | STM32MP157DAC3 |
|---|---|---|---|
| Package | 361-TFBGA (18x18 mm) | 448-TFBGA (18x18 mm) | 361-TFBGA (18x18 mm) |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core Frequency (A7) | 650 MHz | 650 MHz | 800 MHz |
| Core Frequency (M4) | 209 MHz | 209 MHz | 209 MHz |
| Number of I/O | 118 | 138 | 118 |
| Ethernet | 2x (GMAC with TSN) | 2x (GMAC with TSN) | 2x (GMAC with TSN) |
| USB OTG | 2x | 2x | 2x |
| CAN FD | 2x | 2x | 2x |
Key Differentiators
- Heterogeneous dual-core architecture (A7 + M4) (vs NXP i.MX 6ULL (single Cortex-A7))
- Integrated 3D GPU and MIPI DSI (vs TI AM335x (no GPU))
- Wide operating temperature range (-40Β°C to +125Β°C) (vs NXP i.MX 6ULL (typically -40Β°C to +105Β°C))
Design Notes
The STM32MP157CAC3 requires multiple power rails: VDD (1.8V-3.3V) for I/O, VDD_CPU (1.2V) for the Cortex-A7 cores, and VDD_IO for various I/O banks. Use a dedicated PMIC such as the STPMIC1 to sequence these rails correctly. Ensure proper decoupling with 100nF capacitors close to each power pin and a bulk capacitor (10uF) per rail. The power-up sequence must follow the order specified in the datasheet to avoid latch-up or damage.
For DDR3 memory interface, route traces with controlled impedance (typically 50 ohms single-ended, 100 ohms differential) and match lengths to within 0.5mm. Use ground planes beneath the DDR3 traces to minimize noise. Place the DDR3 device close to the MPU to reduce trace lengths. Add series termination resistors (22-33 ohms) for signal integrity. Follow the layout guidelines in the STM32MP1 hardware design guidelines (AN5031).
The STM32MP157CAC3 can dissipate up to 2W under full load. The TFBGA package has a thermal resistance (theta_JA) of approximately 20Β°C/W. Ensure adequate thermal vias and a copper pour on the PCB to dissipate heat. For high ambient temperatures, consider a heatsink or forced airflow. Monitor junction temperature to stay within the -40Β°C to +125Β°C range.
Compliance Information
RoHS compliant per STMicroelectronics. Not AEC-Q100 qualified; for automotive, consider STM32MP157CAC3 (same part) or check for automotive-grade variants.
