NXP Semiconductors

TEA2376BT - Digital Interleaved PFC Controller SO14 | NXP

MPN: TEA2376BT βœ“ Active
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22 V Vdss SOIC-14 (SO14, 0.154 in / 3.90 mm width) Package 40 kHz to 130 kHz Speed
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MOQ: 1 |
Price updated: 2026-09-13
Volume Pricing
Qty Unit Price Extended
1 $2.15 $2.15
10 $1.95 $19.50
100 $1.78 $178.00
500 $1.62 $810.00
1,000 $1.48 $1,480.00
ℹ️ All prices are in USD

TEA2376BT Overview

The NXP TEA2376BT is a digital configurable two-phase interleaved PFC (power factor correction) controller operating in discontinuous conduction mode (DCM) or quasi-resonant (QR) mode with valley switching, housed in a 14-pin SO14 (SOIC-14, 3.90 mm width) surface-mount package, supporting switching frequencies from 40 kHz to 130 kHz and power levels up to typically 1000 W.

A PFC controller is a power management IC that shapes the input current waveform of an AC-DC power supply so it follows the input voltage, maximizing real power and meeting harmonic-current regulations such as those applied to TV, computing, server, and industrial equipment. The TEA2376 belongs to the interleaved PFC controller class, in which two boost phases are operated out of phase to halve input ripple current and reduce the required EMI filtering relative to a single-phase PFC.

Key features of the TEA2376BT include programmable phase shedding and burst mode operation for high efficiency at light load, dual output overvoltage protection, inrush current handling, and independently configurable, programmable protection parameters. All configuration is performed digitally over an I2C/system interface, eliminating numerous external resistors and enabling one firmware platform to cover multiple power levels.

Technically, the digital architecture lets designers tune valley switching, phase management, and protection thresholds precisely, producing an easy-to-design, highly efficient, and reliable interleaved PFC. NXP notes that for high switching frequency and high power applications, IC package thermal limitations require attention during design.

Typical applications include TV power supplies, computing and server SMPS, and industrial power supplies where PFC front ends up to 1000 W are required. Interleaving plus light-load phase shedding keeps efficiency high across the load range, from standby through full power.

A key design consideration is thermal budgeting: at high power with elevated switching frequency, verify SO14 package dissipation and provide adequate PCB copper under the pins. Also confirm the correct orderable suffix (/0, /1) since programming capabilities differ within the TEA2376 family.

This page synthesizes distributor pricing, family drop-in alternatives, and practical design guidance not found in a single manufacturer datasheet, optimizing selection for engineers and buyers.

Drop-in alternatives for TEA2376BT β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with TEA2376BT (same form factor and footprint) β€” differing in Package, Switching Frequency Range.

NXP Semiconductors
Package: SO-14 (SOIC-14), surface mount
Switching Frequency Range: 25 kHz to 300 kHz
Compare with TEA2376BT β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

TEA2376BT/1Y

βœ… Drop-In
πŸ“¦ SOIC-14
same die and SO14 package, /1 suffix denotes programming version 1 with updated I2C/system-interface capability; identical pinout

πŸ“‹ Reference alternative (not in catalog)

TEA2376BT/1

βœ… Drop-In
πŸ“¦ SOIC-14
same SO14 footprint and pinout; /1 programming revision vs base orderable, differing only in firmware/programming support

πŸ“‹ Reference alternative (not in catalog)

TEA2376DT

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
NXP Semiconductors
πŸ“¦ SOIC-14
Digital configurable two-phase interleaved PFC controller Β· Boost PFC, interleaved two-phase Β· Discontinuous conduction mode (DCM) / quasi-resonant (transition) mode with valley switching Β· 25 kHz to 300 kHz Β· Up to 1000 W Β· Phase shedding and burst mode at light load Β· Digital configurable Β· SO-14 (SOIC-14), surface mount

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TEA2376BT Maximum Ratings & Electrical Characteristics

Product Type Digital configurable two-phase interleaved PFC controller
Topology Interleaved boost PFC (2 phases)
Control Mode Discontinuous Conduction Mode (DCM) / Quasi-Resonant with valley switching
Switching Frequency Range 40 kHz to 130 kHz
Typical Power Range Up to 1000 W (typical)
Supply Voltage 22 V
Operating Temperature -25C to +125C (TJ)
Package SOIC-14 (SO14, 0.154 in / 3.90 mm width)
Mounting Type Surface Mount
Phase Shedding Yes, programmable
Burst Mode Operation Yes, programmable
Configuration Interface I2C / system interface (digital configuration)
Protections Dual output overvoltage protection, inrush current, programmable independent protections
X-capacitor Discharge Yes (TEA2376 family feature per NXP product page)
Packaging Option Tape & Reel (TR) and Cut Tape (CT)

TEA2376BT soic-14 (so14, 0.154 in / 3.90 mm width) Pin Configuration Guide

Pin configuration for TEA2376BT (soic-14 (so14, 0.154 in / 3.90 mm width) package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.

soic-14 (so14, 0.154 in / 3.90 mm width) package pinout diagram for TEA2376BT

No detailed pinout data available for TEA2376BT.

Refer to the datasheet for full pin configuration.

Typical Applications

TEA2376BT is suitable for 6 applications: TV Power Supplies, Server and Computing SMPS, Industrial AC-DC Power Supplies, High-Efficiency Boost PFC Front Ends (300 W to 1000 W), Light-Load Efficiency Optimized Designs, Platform Power Supply Families (Configurable Multi-Rating Designs).

πŸ“Ί

TV Power Supplies

Modern flat-panel TV power supplies must meet strict harmonic-current and standby-efficiency regulations while fitting a very low profile and low cost. The TEA2376BT fits this application because its two-phase interleaved boost PFC operating in DCM/QR with valley switching reduces input ripple current and switching loss across a 40 kHz to 130 kHz frequency range, while programmable phase shedding and burst mode keep light-load and standby efficiency high. In use, the controller drives two interleaved boost phases ahead of the LLC or flyback main converter, with dual output overvoltage protection safeguarding the downstream stage. The digital I2C configuration lets one TV platform reuse the same PFC design across screen sizes from about 300 W to 1000 W by changing programmed parameters rather than resistor values, cutting BOM variants and qualification effort.

πŸ–₯️

Server and Computing SMPS

Server and desktop computing power supplies run continuously and are judged on AC efficiency across the full load range, making the PFC front end a major efficiency lever. The TEA2376BT addresses this because its valley-switched quasi-resonant operation minimizes turn-on losses, and its independently programmable protection thresholds (including dual output overvoltage protection) satisfy the reliability expectations of computing platforms rated up to typically 1000 W. In a typical server SMPS, the TEA2376BT drives two interleaved boost legs from a 90-264 VAC input, halving per-MOSFET peak current and distributing thermal stress. Designers should note NXP's caution that at high switching frequency and high power, SO14 package thermal limits require attention, so gate-charge budget and PCB copper must be engineered carefully in 80 PLUS-class designs.

🏭

Industrial AC-DC Power Supplies

Industrial power supplies for automation, drives, and instrumentation demand robust protection, wide-mains tolerance, and long service life. The TEA2376BT suits these supplies because its programmable, independently configurable protections - inrush current handling and dual output overvoltage protection among them - can be tuned to the fault profile of industrial environments, and its digital configuration supports platform-level reuse from a few hundred watts up to the typical 1000 W capability. In a typical industrial front end, the TEA2376BT operates two interleaved boost phases from a rectified 230 VAC bus, with valley switching reducing MOSFET stress and EMI filter size. The -25C to +125C junction operating range covers harsh cabinets, and burst-mode phase shedding maintains efficiency during low-load idle periods common in standby industrial equipment.

⚑

High-Efficiency Boost PFC Front Ends (300 W to 1000 W)

Any AC-DC supply in the mid-power band benefits from interleaved PFC rather than a single phase, and this is the core application of the TEA2376BT. It fits because two out-of-phase boost phases cancel input ripple current, reducing EMI filter bulk and peak diode stress, while DCM/QR valley switching keeps efficiency high without the complexity of continuous-conduction control. The 40 kHz to 130 kHz operating window lets designers trade magnetics size against switching loss for their specific power level. Practically, the controller manages phase shedding automatically as load changes, engaging both phases at high load and one phase plus burst mode at light load, and its programmable parameters mean the same PCB can span multiple power ratings. NXP recommends thermal review at the upper end of the power range due to SO14 package limits.

🧩

Light-Load Efficiency Optimized Designs

Applications that spend most of their life at partial or light load - office equipment, connected appliances, always-on adapters - benefit specifically from the TEA2376BT's programmable phase shedding and burst mode operation. These features fit the application because phase shedding disables one interleaved phase below a programmed load threshold, eliminating that phase's switching and gate losses, while burst mode skips switching cycles entirely at very low load to hold standby input power low. In a typical implementation, the designer programs the phase-shedding boundary and burst entry/exit levels over the I2C/system interface during development, tailoring the efficiency curve to the measured load profile of the end product. Combined with valley switching, this keeps the PFC efficient from no-load standby through the typical 1000 W maximum, supporting energy-star style requirements without additional circuitry.

πŸ”§

Platform Power Supply Families (Configurable Multi-Rating Designs)

OEMs building a family of power supplies across multiple wattage ratings from one PCB save cost by using a digitally configurable PFC controller, and this is precisely the value proposition of the TEA2376BT. It fits because configuration - protection thresholds, phase-shedding points, burst levels - is performed digitally via the I2C/system interface rather than with fixed external resistors, so a single PCB layout can be reprogrammed per SKU during production. The interleaved topology scaled through the family covers roughly 300 W to the typical 1000 W capability, with 40 kHz to 130 kHz frequency flexibility accommodating different magnetics choices per rating. Practically, engineers validate one hardware platform and qualify firmware variants, reducing inventory SKUs and time to market. Thermal margins should be validated per rating since the SO14 package is shared across the platform.

Recommended Products Summary

TEA2376BT/1Y Same controller, /1 programming version Used in: TV Power Supplies, High-Efficiency Boost PFC Front Ends (300 W to 1000 W), Platform Power Supply Families (Configurable Multi-Rating Designs) TEA19161 NXP LLC combo controller for downstream stage Used in: TV Power Supplies TEA2376DT NXP Semiconductors Used in: Server and Computing SMPS, Light-Load Efficiency Optimized Designs TEA1833 NXP green-mode flyback controller for standby rail Used in: Server and Computing SMPS TEA2376BT/1 Same controller, programming revision 1 Used in: Industrial AC-DC Power Supplies TEA19051 NXP standby flyback controller for auxiliary rail Used in: Industrial AC-DC Power Supplies TEA18352 NXP green-mode flyback controller for secondary stage Used in: High-Efficiency Boost PFC Front Ends (300 W to 1000 W) TEA2376AT SO10 family member (non-drop-in, different package) Used in: Light-Load Efficiency Optimized Designs TEA2376BT NXP Semiconductors Used in: Platform Power Supply Families (Configurable Multi-Rating Designs)
What is the TEA2376BT and what does it do?
The TEA2376BT is an NXP digital configurable two-phase interleaved PFC controller for high-efficiency AC-DC power supplies. It operates in discontinuous conduction mode or quasi-resonant mode with valley switching across 40 kHz to 130 kHz, and per NXP documentation supports power levels up to typically 1000 W. It ships in an SO14 package and offers programmable phase shedding and burst mode for light-load efficiency.
What is the price of TEA2376BT?
The TEA2376BT/1Y variant is listed by LCSC at approximately $1.95 per unit in single-piece quantity, with volume discounts typically applying at 100+ pieces, as of 2026-09-13. XAIPART tier pricing starts at about $2.15 for qty 1 and drops to roughly $1.48 at 1000 pieces. Prices fluctuate with inventory cycles, so request a quote for exact current pricing on your volume.
Where can I buy TEA2376BT online?
The TEA2376BT/1Y can be purchased from authorized distributors including DigiKey (listed as NXP USA Inc., PFC IC category), Mouser, and LCSC (in stock, from $1.9518 as of September 2026). XAIPART also supplies the TEA2376BT with tape-and-reel and cut-tape packaging options. Always buy through authorized channels to guarantee original NXP parts and traceability.
Is TEA2376BT in stock and what is the lead time?
Yes, distributor listings show the TEA2376BT/1Y in stock at LCSC and DigiKey as of September 2026, with DigiKey noting ships-today availability for stocked quantities. Standard lead time when in stock is same-day to a few days for small quantities; larger tape-and-reel volumes may require 1-3 weeks. Check current stock at your preferred distributor before scheduling production.
What is the difference between TEA2376AT, TEA2376BT, and TEA2376DT?
Per the NXP Community FAQ, the main differences are package and I2C/system-interface capabilities. The TEA2376AT is offered in an SO10 package and uses the GATE1/GATE2 pins for I2C communication during programming, while the TEA2376BT comes in SO14. Because the packages differ, the TEA2376AT is NOT a drop-in replacement for the TEA2376BT; only SO14 family members with matching pinout qualify as drop-in alternatives.
Is TEA2376DT a drop-in replacement for TEA2376BT?
Within the TEA2376 family, parts sharing the SO14 package and identical pinout are pin-to-pin compatible on the PCB. The TEA2376DT shares the SO14 footprint and the same digital configurable interleaved PFC architecture, differing mainly in system-interface capability tier. Verify the interface capability and protection configuration your application needs, and confirm against the NXP datasheet before switching suffixes.
Can TEA2376BT be used in a 1000 W power supply?
Yes. According to NXP documentation, the TEA2376BT enables an easy-to-design, highly efficient, and reliable interleaved PFC for power levels up to typically 1000 W, with the caveat that for high switching frequency and high power applications, IC package thermal limitations require attention. Ensure adequate PCB copper area and verify gate-drive and IC dissipation at your operating point.
Where can I download the TEA2376BT datasheet PDF?
The official TEA2376BT datasheet PDF (43 pages, approximately 466 KB per alldatasheet listings) is available from the NXP product page at nxp.com/part/TEA2376BT. NXP also publishes the documentation online at docs.nxp.com under the TEA2376BT bundle, including the general description and programmable protection sections. Always prefer the NXP official source for the latest revision.
What are the key specifications of TEA2376BT that engineers should know?
Key TEA2376BT specifications: two-phase interleaved PFC controller; DCM or quasi-resonant control with valley switching; switching frequency 40 kHz to 130 kHz; typical power capability up to 1000 W; 22 V supply; -25C to +125C junction temperature; SOIC-14 package; programmable phase shedding and burst mode; dual output overvoltage protection and programmable independent protections; digital configuration via I2C/system interface. Source: NXP product page and datasheet.
What is the best alternative equivalent for TEA2376BT from another manufacturer?
No verified pin-to-pin cross-brand equivalent for the TEA2376BT in SO14 appears in current distributor cross-reference data. Competitors such as onsemi and TI offer interleaved PFC controllers with similar features (valley switching, phase shedding), but none are documented as drop-in pin-compatible with the SO14 TEA2376 pinout. Any cross-brand substitution requires PCB and firmware-level redesign; consult each vendor's cross-reference tool for functional candidates.
When should I choose the TEA2376BT over a single-phase PFC controller?
Choose the TEA2376BT when your supply is in the roughly 300 W to 1000 W range and you need reduced input ripple current, lower peak current stress per MOSFET, and high light-load efficiency. Interleaving halves the effective input ripple frequency, shrinking EMI filter size, while programmable phase shedding drops to a single phase at light load. Below about 200 W, a single-phase PFC controller is usually simpler and cheaper.
Why does the TEA2376BT use valley switching?
Valley switching turns the PFC power MOSFET on at the minimum point of the drain-voltage oscillation, which reduces turn-on switching loss and voltage stress, and lowers EMI. Per the NXP datasheet, the TEA2376 operates in discontinuous conduction mode or quasi-resonant mode with valley switching to optimize efficiency across the operating range, which is particularly beneficial in TV, computing, and server power supplies where efficiency regulations are strict.
Is TEA2376BT RoHS compliant and suitable for lead-free assembly?
The exact RoHS and REACH compliance status of the TEA2376BT was not found in the verified data retrieved for this page, so it is marked unknown here; NXP generally ships its power-management ICs as RoHS-compliant, lead-free parts. Before ordering for RoHS-restricted markets, confirm the compliance certificate on the official NXP product page at nxp.com/part/TEA2376BT or request the material declaration from NXP or your distributor.
Hey Google, what can replace the TEA2376BT chip?
The safest replacements for the TEA2376BT are its SO14 family siblings, the TEA2376BT/1 and TEA2376DT, which share the same package and pinout. The TEA2376AT is not a drop-in option because it uses the SO10 package with different pinout and programming via GATE1/GATE2 pins. No verified cross-brand pin-compatible equivalent exists; functional alternatives from other vendors require redesign of the PCB and configuration code.
What design considerations apply to the TEA2376BT SO14 package thermals?
NXP explicitly notes that for high switching frequency and high power applications, the IC package thermal limitations of the SO14 require attention. Estimate IC dissipation from gate-drive losses (Qg x fsw x Vgate x 2 phases) plus quiescent power, then verify junction temperature stays below 125C using the SO14 theta-JA with your PCB copper area. Reduce switching frequency or add copper pours if thermal margin is tight at 1000 W designs.

Engineering reference data for TEA2376BT β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the TEA2376BT when you need a digitally configurable two-phase interleaved PFC for supplies from roughly 300 W up to typically 1000 W - TV, computing, server, and industrial front ends - and you value programmable protection, phase shedding, and burst mode over fixed-function analog PFC controllers. Select the TEA2376BT/1 or /1Y orderable when production programming version 1 capability is required; they are footprint-identical drop-ins. Do not substitute the TEA2376AT without a PCB respin: it uses the SO10 package with different pinout and programming method. If your power level is below about 200 W, a single-phase PFC controller is simpler and cheaper since interleaving benefits shrink. Above 1000 W or at maximum switching frequency, validate SO14 thermal limits first, or consider a higher-power controller family. No verified cross-brand pin-compatible equivalent exists, so cross-brand changes require redesign.

Comparison with Alternatives

Parameter This Product TEA2376BT/1Y TEA2376BT/1 TEA2376DT
Package SOIC-14 (SO14) SOIC-14 - same SOIC-14 - same SOIC-14 - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Topology Two-phase interleaved PFC Two-phase interleaved PFC Two-phase interleaved PFC Two-phase interleaved PFC
Control Mode DCM / QR with valley switching DCM / QR with valley switching DCM / QR with valley switching DCM / QR with valley switching
Switching Frequency 40 kHz to 130 kHz 40 kHz to 130 kHz 40 kHz to 130 kHz 40 kHz to 130 kHz
Typical Power Capability Up to 1000 W (typical) Up to 1000 W (typical) Up to 1000 W (typical) Up to 1000 W (typical)

Key Differentiators

  • Digital configurability over I2C/system interface (vs TEA2376AT)
  • Programmable phase shedding and burst mode (vs TEA2376DT)
  • Interleaved two-phase topology in a compact SO14 (vs Single-phase PFC controllers)

Design Notes

NXP explicitly cautions that for high switching frequency and high power applications, the SO14 package thermal limitations of the TEA2376BT require attention. Estimated: IC dissipation is dominated by gate-drive losses - two phases times Qg x fsw x Vdrive - plus controller quiescent power. At fsw = 100 kHz with typical superjunction MOSFETs, gate-drive loss can approach several hundred milliwatts; verify junction temperature against the -25C to +125C (TJ) rating using your actual PCB copper area and theta-JA.

Lay out the two boost phases symmetrically so gate-drive path lengths and current loops match, preserving current sharing between phases. Keep the VCC decoupling capacitor close to the IC with a solid ground return, and route the GATE1/GATE2 outputs away from the current-sense and feedback traces to prevent switching-edge coupling into protection comparators. Follow the TEA2376 datasheet typical application schematic for sense-resistor and boost-inductor connections before freezing the layout.

Confirm the correct orderable suffix before design freeze: the TEA2376AT uses an SO10 package and programs via GATE1/GATE2 pins, so it is NOT pin-compatible with the SO14 TEA2376BT (per NXP Community FAQ). Also, the /0 and /1 programming versions differ in system-interface capability - code written for one suffix may not configure another. Verify protection settings (dual OVP thresholds, inrush handling) against your downstream converter specification, since the TEA2376 protections are independently programmable.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS/REACH status not present in the retrieved verified data; confirm on the official NXP product page at nxp.com/part/TEA2376BT before ordering for regulated markets. Industrial/commercial PFC controller; AEC-Q100 not applicable per category.

Data verified on: 2026-09-13 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors TEA2376BT TEA2376BT/1Y TEA2376DT TEA2376AT PFC controller power factor correction interleaved boost converter discontinuous conduction mode quasi-resonant mode valley switching phase shedding burst mode SOIC-14 SO14 package I2C RoHS TV power supply server power supply industrial power supply surface mount dual output overvoltage protection
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