TJA1462ATK-S1Z - CAN SIC Transceiver 8Mbit/s | NXP | Automotive
MPN: TJA1462ATK-S1Z ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.45 | $2.45 |
| 10 | $2.18 | $21.80 |
| 100 | $1.82 | $182.00 |
| 500 | $1.55 | $775.00 |
| 1,000 | $1.38 | $1,380.00 |
TJA1462ATK-S1Z Overview
A CAN SIC transceiver is a specialized CAN physical-layer device that conditions the bus signal to suppress the resonance and ringing artifacts that occur at higher CAN FD data rates. By smoothing the recessive-to-dominant and dominant-to-recessive edges, the TJA1462 allows networks to operate reliably at 5 Mbit/s and above, extending the usable bandwidth of CAN FD without requiring twisted-pair cable changes or extra bus nodes. The part family belongs to NXP's TJA146x automotive transceiver family, positioned between classical High-Speed CAN transceivers and emerging CAN XL physical-layer devices.
Key features include a separate VIO supply pin for logic-level translation to 1.8V, 3.3V, or 5V microcontrollers without level shifters, ultra-low quiescent current consumption in Standby mode for battery-powered ECUs, bus dominant time-out protection, and under-voltage detection on both VCC and VIO rails. The HVSON-8 (3.0 mm × 3.0 mm) package with an exposed thermal pad enables reflow-compatible SMT assembly and provides a low thermal resistance path for dissipating bus-fault energy. AEC-Q100 Grade 1 qualification and an extended -40 °C to +125 °C operating temperature range make the device suitable for under-hood and body-control automotive applications.
Typical applications include automotive body control modules, gateway ECUs bridging CAN FD powertrain domains, ADAS sensor nodes, and industrial CAN FD backbones. The Standby mode with wake-up via bus activity allows the part to be used in always-on networks where quiescent current budget is critical.
When designing with the TJA1462ATK-S1Z, place the VCC and VIO decoupling capacitors within 2 mm of their respective pins and connect the exposed pad to a continuous ground copper pour for thermal dissipation and EMC performance. The STB (Standby) pin should be driven by a GPIO capable of retaining state across MCU reset to avoid unintended bus state changes during boot.
Drop-in alternatives for TJA1462ATK-S1Z — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TJA1462ATK-S1Z (same form factor and footprint) — differing in Package, Product Type, AEC-Q100 Qualification, Operating Temperature, Protocol.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TJA1462ATK/0Z
✅ Drop-In✓ In Stock
$1.65 / Unit
View Datasheet →TJA1462ATK0Z
✅ Drop-In📋 Reference alternative (not in catalog)
TJA1463ATK/0Z
✅ Drop-In✓ In Stock
$0.88 / Unit
View Datasheet →TJA1463ATK-S1Z
✅ Drop-In📋 Reference alternative (not in catalog)
TJA1442ATK
✅ Drop-In📋 Reference alternative (not in catalog)
TCAN1463-Q1
✅ Drop-In📋 Reference alternative (not in catalog)
TJA1462ATK-S1Z Specifications
| Product Type | CAN SIC Transceiver with Standby |
| Data Rate (max) | 8 Mbit/s |
| Number of Drivers/Receivers | 1/1 |
| Protocol | CAN, CAN FD |
| Supply Voltage VIO | 1.8 V to 5 V (logic-level translation) |
| Operating Temperature | -40 °C to +125 °C |
| Package | HVSON-8 (3.0 mm × 3.0 mm) with exposed pad |
| Mounting Type | Surface Mount |
| AEC-Q100 Grade | Grade 1 (automotive qualified) |
| Standards Compliance | ISO 11898-2:2024 (3rd Ed.), SAE J2284-1 to J2284-5 |
| Standby Mode | Yes (STB pin, low quiescent current) |
| Bus Dominant Time-out | Yes |
| Under-voltage Detection | Yes (VCC and VIO) |
| RoHS Status | Compliant |
TJA1462ATK-S1Z Pin Configuration
| Pin 1 | TXD — Transmit Data input from MCU |
| Pin 2 | GND — Ground |
| Pin 3 | VCC — 5 V supply for bus drivers |
| Pin 4 | RXD — Receive Data output to MCU |
| Pin 5 | VIO — Logic-level supply (1.8 V to 5 V) |
| Pin 6 | CANH — CAN high bus line |
| Pin 7 | CANL — CAN low bus line |
| Pin 8 | STB — Standby mode control (active high) |
| Pin EP | EP — Exposed pad - connect to GND |
Typical Applications
TJA1462ATK-S1Z is suitable for 6 applications: Automotive Body Control Module (BCM), CAN FD Gateway ECU, ADAS Sensor Node, Industrial CAN FD Backbone, Electric Vehicle Battery Management System (BMS), Agricultural and Off-Highway Vehicle Network.
Automotive Body Control Module (BCM)
The TJA1462ATK-S1Z fits automotive Body Control Modules because it is AEC-Q100 Grade 1 qualified and supports CAN FD at 5 Mbit/s over standard automotive twisted-pair wiring harnesses. Its Standby mode with bus wake-up capability suits always-connected BCMs that must remain on the bus while the vehicle is parked without draining the 12 V battery, and the VIO pin lets the BCM's 3.3 V MCU interface directly. In a BCM the TJA1462 links window, door, mirror, and lighting ECUs at high speed while coexisting with legacy 500 kbit/s CAN nodes on the same bus.
Recommended
CAN FD Gateway ECU
The TJA1462ATK-S1Z is well-suited to central gateway ECUs that interconnect powertrain, chassis, and body CAN FD domains at 5 Mbit/s. Its CAN SIC capability reduces bus ringing across long harness runs between ECUs located in different vehicle zones, eliminating the need for special low-loss cable or star-stub topology. The 8 Mbit/s ceiling provides overhead as next-generation CAN FD data rates climb, and the small 3 mm × 3 mm HVSON-8 footprint fits densely populated gateway PCBs alongside Ethernet PHYs and switch ASICs.
Recommended
ADAS Sensor Node
The TJA1462ATK-S1Z's 8 Mbit/s CAN SIC performance and -40 °C to +125 °C automotive temperature range make it appropriate for ADAS sensor nodes such as radar, lidar, and surround-view camera ECUs that stream high-bandwidth sensor data over CAN FD. SIC suppresses the bus ringing that would otherwise corrupt high-speed sensor frames, and the device's AEC-Q100 Grade 1 qualification ensures reliability in the thermal and vibration environment behind the front bumper. VIO logic-level translation allows the sensor MCU to operate at 1.8 V for low power consumption while the CAN bus stays at 5 V.
Recommended
Industrial CAN FD Backbone
The TJA1462ATK-S1Z can be used in industrial CAN FD backbones such as factory-automation cells, robotics controllers, and building automation networks where 5 Mbit/s data rates reduce cycle times compared to classical 1 Mbit/s CAN. The VIO pin accepts 1.8 V to 5 V, simplifying integration with modern low-voltage industrial MCUs, and the wide operating temperature range suits outdoor and factory-floor thermal envelopes. SIC operation also improves signal integrity across long industrial cable runs where reflections degrade classical CAN FD.
Recommended
Electric Vehicle Battery Management System (BMS)
The TJA1462ATK-S1Z fits EV Battery Management Systems that communicate cell-voltage and temperature data to the Battery Junction Box over CAN FD. Its ultra-low Standby current preserves EV auxiliary battery capacity during parking, and the SIC capability enables 5 Mbit/s data rates so large cell arrays can stream telemetry within tight BMS reporting windows. The HVSON-8 footprint with exposed thermal pad dissipates bus-fault energy cleanly, important in the high-voltage environment adjacent to traction battery packs.
Recommended
Agricultural and Off-Highway Vehicle Network
The TJA1462ATK-S1Z's AEC-Q100 qualification and robust CAN SIC performance suit agricultural tractors, construction equipment, and off-highway vehicles that use long CAN FD backbones across exposed harnesses subject to moisture and EMI. SIC ringing suppression ensures reliable 5 Mbit/s communication across multi-meter cable runs, and the extended -40 °C to +125 °C range covers cab and engine-bay mounting. The VIO pin simplifies interfacing with the 3.3 V MCUs commonly used in modern agricultural controllers.
Recommended
Recommended Products Summary
Engineering reference data for TJA1462ATK-S1Z — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TJA1462ATK | TJA1462ATK0Z | TJA1463ATK | TJA1463ATK-S1Z | TJA1442ATK | TCAN1463-Q1 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Texas Instruments |
| Package | HVSON-8 | HVSON-8 - same | HVSON-8 - same | HVSON-8 - same | HVSON-8 - same | HVSON-8 - same | HVSON-8 - same |
| Data Rate (max) | 8 Mbit/s | 8 Mbit/s | 8 Mbit/s | 8 Mbit/s | 8 Mbit/s | 5 Mbit/s | 8 Mbit/s |
| CAN SIC Capability | Yes | Yes | Yes | Yes | Yes | No (Classical CAN FD only) | Yes |
| Low-Power Mode | Standby | Standby | Standby | Sleep | Sleep | Standby | Standby |
| VIO Logic-Level Translation | Yes (1.8 V to 5 V) | Yes (1.8 V to 5 V) | Yes (1.8 V to 5 V) | Yes (1.8 V to 5 V) | Yes (1.8 V to 5 V) | Yes (1.8 V to 5 V) | Yes (1.8 V to 5 V) |
| AEC-Q100 Grade | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
Key Differentiators
- CAN SIC compliance per ISO 11898-2:2024 3rd edition (vs TJA1442ATK)
- Cross-brand drop-in available from Texas Instruments (vs TCAN1463-Q1)
- Family upgrade path to Sleep mode without layout change (vs TJA1463ATK)
Design Notes
Place the VCC and VIO decoupling capacitors within 2 mm of their respective pins, using short, wide traces to minimize parasitic inductance. The exposed thermal pad (EP) on the HVSON-8 package must be soldered to a continuous ground copper pour of at least 25 mm² to meet the datasheet thermal resistance and to provide a low-impedance return path for bus common-mode currents during ESD events.
Route the CANH and CANL traces as a differential pair with 100 Ω differential impedance, keeping the pair length matched within 5 mm to avoid skew-induced ringing. Place a split-terminator network (two 60 Ω resistors in series with a 4.7 nF capacitor to ground at the midpoint) close to the bus pins for proper SIC edge shaping. Avoid routing the CAN pair near noisy switching traces; keep at least 3 mm clearance from clock lines and DC-DC switch nodes.
Do not leave the STB pin floating - tie it to GND through a 100 kΩ pull-down if the host MCU does not actively drive it, to avoid unintended Standby entry at power-up. Verify that VIO is powered before or simultaneously with VCC to prevent latch-up at the logic-level translation block. In designs migrating from a non-SIC CAN FD transceiver, ensure the bus topology still meets ISO 11898-2:2024 maximum stub length and node count limits for SIC operation.
The TJA1462ATK-S1Z's SIC function actively damps the bus resonance that causes signal ringing at CAN FD bit rates above 2 Mbit/s. For maximum benefit, use the recommended split termination with a common-mode choke on long cable runs (>3 m). At the highest 8 Mbit/s data rate, scope-probe the CANH-CANL differential signal and verify that the recessive-to-dominant edge settles within one bit time; if not, check for excessive stub length or missing termination.
Compliance Information
AEC-Q100 Grade 1 automotive qualified per NXP product page. RoHS compliant per penghe-ic listing. Halogen-free status not explicitly stated in the verified web data; consult the NXP material declaration.
