TJA1463ATK/0Z - CAN SIC Transceiver, 8Mbit/s, Sleep | NXP
MPN: TJA1463ATK/0Z ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.68 | $1.68 |
| 10 | $1.52 | $15.20 |
| 100 | $1.27 | $127.00 |
| 500 | $1.05 | $525.00 |
| 1,000 | $0.88 | $880.00 |
TJA1463ATK/0Z Overview
A CAN SIC (CAN Signal Improvement Capability) transceiver is a physical-layer device that sits between a CAN protocol controller and the differential CAN bus, translating the controller's TX/RX logic into the bus's dominant/recessive differential signaling. The "signal improvement" function actively damps the dominant-to-recessive edge ringing that traditionally limits CAN FD bus length and stub density, allowing larger topologies than classical HS-CAN. In the system hierarchy it belongs to: CAN transceiver -> network interface IC -> interface IC -> integrated circuit -> semiconductor.
Key features include up to 8 Mbit/s CAN FD data rate, tight bit-timing symmetry enabling communication at 5 Mbit/s with a higher node count, an integrated low-power Sleep mode with remote wake-up via bus activity, a separate VIO supply pin for flexible MCU interfacing from 1.8V to 5V, an STB (standby) mode pin, and an ERR output pin that flags local and global bus failures. The HVSON-14 package provides a small PCB footprint with a thermal pad for improved dissipation in ECU environments.
Architecturally the TJA1463ATK/0Z combines a high-speed differential bus driver/receiver pair, an internal slope-control/SIC current-shaping network, a low-drop VIO level shifter, a low-quiescent Sleep regulator with bus-wake comparator, and ESD protection rated to IEC 61000-4-2 on the bus pins. The SIC behavior is achieved without external components - just the standard CAN bus termination and a 5V or 3.3V VCC.
Typical applications include automotive body controllers, ADAS sensor nodes (radar, lidar, camera ECUs), chassis and powertrain ECUs, battery management systems (BMS) and battery energy storage system (BESS) communication links, industrial CAN FD backbones, and any classical-CAN network that is being migrated to CAN FD with longer cables or more nodes than the legacy bus can support.
When designing with this part, ensure VIO matches the host MCU supply, place the bus termination (typically 120 ohm at each bus end) within the recommended layout, and follow NXP's EMC and ESD layout guidance in the application notes. The Sleep pin and the VIO domain must be sequenced correctly to enter and exit Sleep cleanly.
This page synthesizes distributor pricing, AEC-Q100 compliance status, drop-in pin-compatible alternatives in the TJA146x family, and practical CAN SIC design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for TJA1463ATK/0Z — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TJA1463ATK/0Z (same form factor and footprint) — differing in Package, Product Type, AEC-Q100 Qualification, Operating Temperature, Protocol.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TJA1463ATK/S1Z
✅ Drop-In📋 Reference alternative (not in catalog)
TJA1441ATK/0Z
✅ Drop-In📋 Reference alternative (not in catalog)
TJA1448ATK/S1Z
✅ Drop-In📋 Reference alternative (not in catalog)
TJA1462ATK/0Z
✅ Drop-In✓ In Stock
$1.65 / Unit
View Datasheet →TJA1463ATK/0Z Specifications
| Product Type | CAN SIC Transceiver with Sleep Mode |
| CAN Data Rate (max) | 8 Mbit/s (CAN FD) |
| Protocol Compliance | ISO 11898-2:2024 (parameter set C); SAE J2284-1/-2/-3/-4/-5; CiA 601-4 SIC |
| Number of Pins | 14 |
| Package | HVSON-14 (SOT1086-1), 3.0 mm x 4.5 mm with thermal pad |
| VCC Supply Voltage | 4.5 V to 5.5 V |
| VIO Supply Voltage | 1.8 V to 5.5 V (logic-level adaptation) |
| Operating Modes | Normal, Standby (STB), Sleep (with remote bus wake-up) |
| Bus Wake-up | Yes (via CAN bus activity in Sleep mode) |
| STB Pin | Yes |
| ERR Pin | Yes (local + global failure indication) |
| ESD Protection (bus pins) | IEC 61000-4-2 compliant (per datasheet) |
| Operating Temperature | -40 C to +150 C (Tj max, AEC-Q100 Grade) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| Lead-Free / RoHS | Yes / Compliant (matte-tin, Pb-free) |
| MSL Level | MSL1 (per HVSON-14 standard) |
| Mounting Type | Surface Mount |
TJA1463ATK/0Z Pin Configuration
| Pin 1 | TXD — Transmit data input from CAN controller |
| Pin 2 | GND — Ground |
| Pin 3 | VCC — 5 V bus-side supply |
| Pin 4 | RXD — Receive data output to CAN controller |
| Pin 5 | VIO — Logic-level supply for digital interface (1.8 V to 5 V) |
| Pin 6 | STB — Standby mode control input |
| Pin 7 | ERR — Error / failure indicator output |
| Pin 8 | CANH — CAN high bus line |
| Pin 9 | CANL — CAN low bus line |
| Pin 10 | SPLIT — Stabilization output for common-mode bias |
| Pin 11 | VBAT — Battery supply input for wake-up |
| Pin 12 | WAKE — Local wake input |
| Pin 13 | INH — Inhibit output for external voltage regulator control |
| Pin 14 | EP — Exposed thermal pad (connect to GND) |
Typical Applications
TJA1463ATK/0Z is suitable for 6 applications: Automotive Body and Chassis ECUs, ADAS Radar / Camera Sensor Nodes, Battery Management System (BMS) Communication, Battery Energy Storage System (BESS) Communication Link, Industrial CAN FD Backbone Migration, Agricultural / Off-Highway Vehicle CAN Networks.
Automotive Body and Chassis ECUs
The TJA1463ATK/0Z fits body and chassis ECUs because its AEC-Q100 qualification, -40 C to +150 C operating range, and CAN SIC behavior match the harsh underhood and cabin environments of BCM, gateway, and chassis controllers. CAN SIC (per ISO 11898-2:2024 parameter set C) reduces dominant-to-recessive ringing, which lets the ECU sit on long daisy-chained harnesses with multiple stubs that would otherwise force a classical HS-CAN design. The 8 Mbit/s CAN FD capability leaves headroom for high-rate sensor data from parking radars or surround-view cameras. VIO from 1.8 V to 5.5 V lets the part talk directly to modern low-voltage automotive MCUs without external level shifters. Place 100 nF + 10 nF ceramics on VCC and VIO, and a 120 ohm termination at each bus end.
Recommended
ADAS Radar / Camera Sensor Nodes
The TJA1463ATK/0Z is well-suited to ADAS sensor nodes because its 8 Mbit/s CAN FD rate and SIC behavior support the high-rate object lists coming from front radar and surround-view camera ECUs, while the AEC-Q100 grade and small HVSON-14 package keep the BOM compact in sealed sensor enclosures. SIC tightens bit timing symmetry so the bus can carry 5 Mbit/s CAN FD across more nodes than classical CAN, which matters as a vehicle integrates 8+ radar and camera ECUs onto a shared CAN backbone. The Sleep mode with bus wake-up lets the sensor sleep when the vehicle is parked, saving quiescent current. VIO adapts to 3.3 V MCU rails common in modern sensor SoCs, eliminating a level shifter.
Recommended
Battery Management System (BMS) Communication
The TJA1463ATK/0Z fits BMS master-to-slave communication because CAN SIC suppresses ringing on the long battery-pack harness that connects many cell-monitoring slaves, where unterminated stubs would otherwise corrupt CAN FD frames. The 8 Mbit/s headroom allows cell balancing and SOC/SOH data to flow without compression. AEC-Q100 qualification and the -40 C to +150 C temperature range cover the underbody pack environment. The Sleep mode with bus wake-up is critical for parked electric vehicles - the BMS slaves wake only when the master polls the bus, preserving quiescent current. Use shielded twisted pair for the pack harness and place 100 nF X7R bypass on VCC/VIO within 2 mm of the pins.
Recommended
Battery Energy Storage System (BESS) Communication Link
Per the verified industry application notes, the TJA1463ATK/0Z helps control dominant-to-recessive ringing in BESS communication links between racks of battery modules and the plant controller. CAN SIC is essential here because rack-to-rack CAN cables run many meters with stubs at each battery cluster; classical HS-CAN would ring and force re-transmits that delay protection decisions. The HVSON-14 footprint and 5 V VCC let the part bolt onto BESS slave boards with the same MCU supply already in place. Engineers must still design the bus termination, isolation, and timing margins - SIC reduces ringing but does not eliminate the need for proper topology. Sleep mode supports idle-state quiescent targets common in grid-tied BESS cabinets.
Recommended
Industrial CAN FD Backbone Migration
The TJA1463ATK/0Z enables industrial CAN FD backbone migration because its SIC behavior and 8 Mbit/s ceiling let an existing classical-CAN plant network upgrade to CAN FD without rewiring the harness. The -40 C to +150 C operating range covers factory-floor cabinet temperatures. The separate VIO pin lets the part interface to 3.3 V industrial MCUs (STM32, i.MX RT) without glue logic. IEC 61000-4-2 ESD on the bus pins reduces external TVS component count. Industrial designers must still provide shielded cable, proper shielding ground bonding, and 120 ohm terminations at the two physical bus ends - SIC helps but cannot substitute for proper EMC layout.
Recommended
Agricultural / Off-Highway Vehicle CAN Networks
The TJA1463ATK/0Z is a strong fit for agricultural and off-highway vehicle CAN networks because SIC keeps CAN FD reliable on the long backbone that connects a tractor's cab to implements, planters, and towed equipment - topologies that have always challenged classical HS-CAN. AEC-Q100 qualification plus a -40 C cold-start rating supports outdoor machinery environments. The HVSON-14 footprint is small enough for sealed IP67 connector modules at implement joints. VIO adapts to 3.3 V or 5 V MCUs used in ISOBUS-class implements. Designers must still isolate the bus between tractor and implement per ISOBUS 11783, but the SIC feature substantially reduces bit-error rate on the long shielded twisted pair.
Recommended
Recommended Products Summary
Engineering reference data for TJA1463ATK/0Z — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TJA1463ATK/S1Z | TJA1441ATK/0Z | TJA1448ATK/S1Z | TJA1462ATK/0Z |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | HVSON-14 (3.0 x 4.5 mm) | HVSON-14 (3.0 x 4.5 mm) - same | HVSON-14 (3.0 x 4.5 mm) - same | HVSON-14 (3.0 x 4.5 mm) - same | HVSON-14 (3.0 x 4.5 mm) - same |
| CAN SIC | Yes (ISO 11898-2:2024 param set C / CiA 601-4) | Yes (same die) | No (classical CAN FD) | No (classical CAN FD) | No (high-speed CAN FD only) |
| Max CAN FD Data Rate | 8 Mbit/s | 8 Mbit/s | 5 Mbit/s | 5 Mbit/s | 5 Mbit/s |
| VIO Pin | Yes (1.8 V to 5 V) | Yes | Yes | Yes | Yes |
| Sleep Mode with Bus Wake-up | Yes | Yes | Yes | Yes | Yes |
| ERR Pin | Yes | Yes | Yes | Yes | Yes |
| AEC-Q100 Grade | Qualified | Qualified | Qualified | Qualified | Qualified |
| Operating Temperature Range | -40 C to +150 C (Tj) | -40 C to +150 C (Tj) | -40 C to +150 C (Tj) | -40 C to +150 C (Tj) | -40 C to +150 C (Tj) |
Key Differentiators
- Only NXP TJA146x family member with full 8 Mbit/s CAN SIC in this footprint (vs TJA1441ATK/0Z and TJA1448ATK/S1Z)
- Functionally identical die to TJA1463ATK/S1Z (vs TJA1463ATK/S1Z)
- Smaller HVSON-14 footprint with thermal pad for sealed ECU modules (vs Generic SOIC-8 CAN transceivers)
Design Notes
Decouple VCC with a 100 nF X7R ceramic placed within 2 mm of the VCC pin, and add a bulk 4.7 uF to 10 uF tantalum or ceramic at the supply rail. Decouple VIO independently with a 100 nF X7R ceramic - VIO carries the digital-interface logic level and switching noise from the host MCU can couple into the bus side if the VIO decoupling is weak. Keep VCC and VIO traces short and direct; do not share the VCC and VIO return paths with the bus termination return.
Route the CANH and CANL traces as a 100 ohm differential pair with constant 100 ohm impedance, length-matched within 5 mm, and kept as short as practical. Place the 120 ohm termination resistor (typically a split resistor with a 47 nF common-mode capacitor to ground) at each physical end of the bus - one termination, not one per node. Keep the bus traces away from switching DC-DC converter nodes and high-dV/dt signals. Use a shielded twisted-pair cable for any bus segment longer than 30 cm and bond the shield to chassis ground at one end to avoid ground loops.
Do not rely on CAN SIC alone to fix bus problems caused by missing termination, poor shielding, or excessive stub length. SIC reduces ringing, but cannot compensate for a single-node stub longer than the bit-time budget allows. Also avoid leaving the SPLIT pin floating - the datasheet recommends a SPLIT-to-ground resistor network; check the application schematic in the datasheet for the exact value. The /0Z suffix denotes 100% matte-tin lead-free - do not confuse it with /0Y (which may be different plating); verify the ordering code on the incoming reel label.
The HVSON-14 exposed thermal pad must be soldered to a ground plane with at least 4 thermal vias for heat dissipation, especially in sealed underhood enclosures. A floating thermal pad can raise junction temperature and degrade the bus driver's edge rate. Also confirm the controller-side TXD rise/fall time is faster than 50 ns - some MCUs with weak TXD drive strength cause the TJA1463 to delay the bus edge and increase effective loop delay. Add a 1 kohm pull-up on STB if the MCU does not actively drive it during boot, to keep the part out of Standby at start-up.
Compliance Information
Lead-free 100% matte-tin plating per /0Z ordering code. AEC-Q100 qualified for automotive use per NXP product page. Halogen-free and RoHS compliant. IEC 61000-4-2 ESD on bus pins per datasheet.
