TLE6266GXUMA1 - Automotive CAN System Basis Chip | Infineon
MPN: TLE6266GXUMA1 ✓ ActiveTLE6266GXUMA1 Overview
A System Basis Chip, or SBC, is an integrated circuit that combines several functions normally implemented as separate components around a microcontroller. In a CAN network, an SBC can provide the physical-layer transceiver, logic voltage regulation, power supervision, wake-up handling, and other system interfaces. This integration reduces board area and the number of external components while centralizing the electrical interface between a host microcontroller and the CAN bus.
The TLE6266GXUMA1 is specifically identified as a 1/1 CANbus transceiver in a P-DSO-28 package. Its rectangular surface-mount construction supports automotive electronics designs where compact PCB area and production automation are priorities. The available data also identifies the device as an automotive-grade part and describes the underlying TLE6266G family as a System Basis Chip rather than a standalone CAN transceiver.
The TLE6266G family is presented in verified search results with a 50-page manufacturer-family datasheet, but the provided material does not expose individual electrical limits such as supply voltage, transceiver data rate, regulator ratings, logic levels, or pin-level truth tables. Those ratings must therefore be confirmed in the official Infineon datasheet before schematic approval, EMC review, or production release. This distinction is important because a 28-pin SBC may expose more than one power domain and multiple interface functions beyond its CAN transceiver.
Typical implementation opportunities include automotive body-control modules, comfort systems, powertrain-adjacent controllers, sensor gateways, and compact CAN-based embedded nodes. In each case, the device can serve as the interface hub between a low-power microcontroller and a CAN network while reducing the number of discrete supporting components. Automotive qualification, transient immunity, bus termination behavior, and low-power wake behavior remain decisive system-level checks.
The primary design consideration is to validate the complete pin assignment, supply domains, decoupling requirements, and CAN transceiver characteristics against the exact TLE6266GXUMA1 ordering information. Engineers should not infer unlisted voltage, current, baud-rate, or protection ratings from the 28-pin package count. BOM selection should also confirm current availability, automotive qualification status, and lifecycle commitments with the manufacturer or an authorized distributor.
This page consolidates verified distributor and manufacturer-family data, separates confirmed characteristics from missing technical details, and provides practical selection and sourcing guidance. It is intended to accelerate component identification while preserving traceability and preventing unverified electrical assumptions from entering a production design.
Drop-in alternatives for TLE6266GXUMA1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
TLE6266G
✅ Drop-In📋 Reference alternative (not in catalog)
TLE6266GXUMA1 Specifications
| Device Type | System Basis Chip with CAN transceiver |
| CAN Transceiver Configuration | 1/1 CANbus |
| Number of Terminals | 28 terminals |
| Package | P-DSO-28 |
| Package Type | SOP |
| Package Shape | Rectangular |
| Mounting Type | Surface mount |
| Temperature Grade | Automotive |
TLE6266GXUMA1 rectangular Pin Configuration Guide
Pin configuration for TLE6266GXUMA1 (rectangular package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for TLE6266GXUMA1.
Refer to the datasheet for full pin configuration.
Typical Applications
TLE6266GXUMA1 is suitable for 6 applications: Automotive Body Control Module, CAN-Based Sensor Gateway, Vehicle Comfort System Controller, Industrial CAN Control Module, Automotive Communication Hub, Automotive Infotainment Interface.
Automotive Body Control Module
The TLE6266GXUMA1 fits an automotive body-control module where a microcontroller must connect to a CAN network while minimizing discrete interface circuitry. Its confirmed 1/1 CANbus transceiver configuration and 28-terminal P-DSO-28 package provide a concentrated interface solution, while its System Basis Chip classification indicates support functions beyond the physical CAN transceiver. This integration can simplify routing and reduce board area in distributed door, lighting, climate, or seat-control modules. The exact regulator outputs, wake-up behavior, and supply domains remain unavailable in the verified excerpts and must be checked in the official TLE6266G datasheet before schematic approval.
Recommended
CAN-Based Sensor Gateway
The TLE6266GXUMA1 can serve as the CAN-facing portion of a compact automotive sensor gateway that aggregates inputs from distributed sensors and forwards status to a vehicle controller. Its 1/1 CAN configuration is appropriate for a node requiring one physical CAN interface, while the 28-pin P-DSO-28 package supports dense surface-mount layouts. Because an SBC consolidates transceiver and system-support functions, it may reduce the number of separate interface components. Engineers should verify standby current, wake-up routing, bus fault handling, and isolation requirements; none of those electrical details appears in the supplied verified data.
Recommended
Vehicle Comfort System Controller
The TLE6266GXUMA1 is relevant to compact comfort-system controllers that exchange commands over CAN with a central body controller. The confirmed 28-terminal surface-mount package provides integration in space-constrained electronic control units, and the integrated 1/1 CANbus interface avoids requiring a separate physical-layer transceiver in the bill of materials. The device can therefore simplify board partitioning when its integrated support functions match the design. Before selecting it for seat, climate, mirror, or window control, engineers must confirm low-power wake behavior, supply tolerance, watchdog or supervision functions, and the complete ordering code from the manufacturer documentation.
Recommended
Industrial CAN Control Module
The TLE6266GXUMA1 can be evaluated for industrial CAN control equipment where one CAN port is needed beside a host microcontroller and supporting power circuitry. Although the verified source marks the exact MPN as automotive-temperature-grade, industrial use is technically plausible only after checking the published operating-temperature range and automotive qualification limits. Its 1/1 CANbus configuration and integrated System Basis Chip architecture can shorten the hardware design and reduce board area. A production selection still requires confirmation of supply range, CAN timing, ESD immunity, thermal limits, and whether the automotive-grade qualification exceeds the industrial requirement.
Recommended
Automotive Communication Hub
The TLE6266GXUMA1 is suitable for an automotive communication hub that connects a central controller to a single CAN segment. The System Basis Chip format consolidates the CAN physical interface and supporting functions in one 28-pin P-DSO-28 device, potentially reducing routing complexity and external component count. Its automotive temperature grade is a useful initial fit indicator for vehicle environments, but designers must confirm qualification details, bus-recognition behavior, standby current, and fault recovery from the manufacturer datasheet. The verified excerpts do not provide these values, so they cannot be used for final EMC or power-budget calculations.
Recommended
Automotive Infotainment Interface
The TLE6266GXUMA1 may fit an automotive infotainment or connectivity module that exposes a local CAN link to multimedia, climate, or telematics electronics. Its confirmed 1/1 CAN transceiver and 28-terminal package are useful for a compact auxiliary CAN node, while its integrated SBC architecture can simplify the interface between the host processor and vehicle network. The tradeoff is that one package may combine several supply and functional domains, making careful decoupling and pin assignment essential. Engineers must obtain the official pin table, regulator data, and CAN timing characteristics before using the device beside an infotainment processor.
Recommended
Recommended Products Summary
Engineering reference data for TLE6266GXUMA1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TLE6266G |
|---|---|---|
| Package | P-DSO-28 | P-DSO-28 family context |
| Brand | Infineon Technologies | Infineon Technologies |
| Device Classification | System Basis Chip with CAN transceiver | System Basis Chip |
| CAN Transceiver Configuration | 1/1 CANbus | 1/1 CANbus family context |
| Number of Terminals | 28 terminals | 28 terminals |
Key Differentiators
- Integrated System Basis Chip architecture (vs Standalone 1/1 CAN transceivers)
- Automotive-oriented ordering configuration (vs Generic commercial CAN transceivers)
- Compact 28-terminal surface-mount integration (vs Discrete CAN and power-interface implementations)
Design Notes
Do not treat the TLE6266G family label and the complete TLE6266GXUMA1 ordering code as automatically equivalent without checking the manufacturer ordering table. The verified records associate the family with a 28-terminal P-DSO-28 device, but they do not disclose the suffix meanings for grade, package, or reel configuration. Confirm the exact orderable MPN, terminal names, exposed-pad requirements, and delivery option before schematic release or PCB placement.
Place every bypass capacitor directly across the intended TLE6266GXUMA1 supply pins, following the values and layout specified in the official TLE6266G datasheet. Because this is a multi-function System Basis Chip, routing input, output, and logic-supply returns carefully to prevent regulator or transceiver noise from coupling between domains. Do not infer capacitor values or pin assignments from the 28-terminal package, and verify thermal-pad connections against the package drawing before copper allocation.
Review the CAN routing as a controlled impedance or physically consistent bus segment rather than treating the transceiver connection as an ordinary low-speed logic line. Keep the CAN traces short, route them away from switching nodes and sensitive analog inputs, and apply the datasheet's guidance for termination, common-mode choke selection, and external protection. Bus data rate and transient specifications are not available in the verified excerpts, so use the manufacturer interface guidelines for the final EMC design.
Validate thermal performance using the actual regulator dissipation, CAN transceiver loading, ambient temperature, and PCB copper area from the official datasheet. Estimated: power dissipation equals the sum of input-to-output regulator loss and internal transceiver loss; neither value is available in the supplied data, so no numerical junction-temperature estimate is made. Ensure the P-DSO-28 thermal path and exposed pad are implemented exactly as specified before automotive qualification testing.
Compliance Information
The verified data identifies the device as an automotive-temperature-grade System Basis Chip but does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals compliance. These fields remain unknown rather than being inferred from the application temperature grade.
