TLIN1029A-Q1 - LIN Transceiver w/ Dominant Timeout | TI
MPN: TLIN1029A-Q1 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.45 | $1.45 |
| 10 | $1.28 | $12.80 |
| 100 | $1.05 | $105.00 |
| 500 | $0.89 | $445.00 |
| 1,000 | $0.74 | $740.00 |
TLIN1029A-Q1 Overview
A LIN physical-layer transceiver is a single-wire, bidirectional bus interface IC that converts logic-level UART data into a current-shaped LIN bus waveform (dominant/recessive) and back, providing the physical medium for low-cost in-vehicle sub-networks such as body control modules, mirror switches, seat controllers, and sensor clusters. TLIN1029A-Q1 sits within the broader LIN transceiver category, which itself is a sub-family of automotive interface ICs standardized by ISO 17987 and the LIN Consortium.
Key features include an integrated wake-up pattern detector compliant with LIN 2.x and ISO 17987-4, ±42 V fault protection on the LIN bus pin, ±15 kV HBM ESD on LIN and ±8 kV on the battery pin (per HBM model), dominant-state timeout to prevent bus lock-up, undervoltage detection on VSUP, thermal shutdown, and back-feed prevention that blocks current flow from LIN to VSUP during ground-shift events. The 8-pin SOIC and 3 mm × 3 mm SON options give designers a layout choice for both through-hole-style reflow and space-constrained modules.
Architecturally the device combines a high-side driver with active current limiting, a recessive-side pull-up, a comparator-based receiver, and a state machine for wake-up pulse recognition; this integration removes the need for an external LIN pull-up resistor and a TVS diode in moderate-environment designs.
Typical applications include body control modules, HVAC control panels, steering-wheel switch interfaces, door/window lift switches, seat-position memory modules, and LED lighting controllers. The wide VSUP range and integrated fault protection suit 12-V automotive battery systems including cold-crank and load-dump conditions.
When designing with TLIN1029A-Q1, place a 100 nF decoupling capacitor close to VSUP and follow LIN bus layout guidelines (single-node stub, controlled impedance, ground return path) to meet EMC requirements per IEC 61967 and SAE J2962.
This page synthesizes distributor pricing, AEC-Q100 compliance context, and drop-in alternatives not consolidated in the manufacturer datasheet.
Drop-in alternatives for TLIN1029A-Q1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TLIN1029ADRQ1
✅ Drop-In📋 Reference alternative (not in catalog)
TLIN1029ADRBRQ1
✅ Drop-In📋 Reference alternative (not in catalog)
TLIN1029-Q1
✅ Drop-In📋 Reference alternative (not in catalog)
TLIN1027-Q1
✅ Drop-In📋 Reference alternative (not in catalog)
TJA1029T
✅ Drop-In📋 Reference alternative (not in catalog)
TJA1027T
✅ Drop-In📋 Reference alternative (not in catalog)
TLIN1029A-Q1 Specifications
| Function | LIN physical-layer transceiver |
| LIN Standard Compliance | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, ISO/DIS 17987-4 |
| Maximum Data Rate | 20 kbps (LIN 2.x); up to 100 kbps fast programming mode per TI product page |
| Number of Drivers/Receivers | 1/1 |
| Supply Voltage (VSUP) | 4.5 V to 40 V (load-dump tolerant up to 42 V per TI datasheet) |
| LIN Bus Fault Voltage | -42 V to +42 V |
| Dominant State Timeout | Yes (integrated, prevents bus lock-up) |
| Wake-Up Feature | Integrated LIN wake-up pattern recognition |
| ESD Protection (LIN pin, HBM) | ±15 kV HBM |
| ESD Protection (VSUP pin, HBM) | ±8 kV HBM |
| Internal LIN Pull-up Resistor | Yes (for responder-node applications) |
| Undervoltage Detection | Yes (on VSUP) |
| Thermal Shutdown | Yes |
| Back-feed Current Blocking | Yes (LIN to VSUP during ground shift) |
| Operating Temperature Range | -40 °C to +125 °C |
| Package Options | 8-pin SOIC (DRQ1); 8-pin SON 3 mm × 3 mm (DRBRQ1) |
| Automotive Qualification | AEC-Q100 qualified |
TLIN1029A-Q1 Pin Configuration
| Pin 1 | TXD — Transmit data input from MCU (logic-level UART TX) |
| Pin 2 | GND — Ground reference |
| Pin 3 | VSUP — Battery supply voltage input (4.5 V to 40 V) |
| Pin 4 | RXD — Receive data output to MCU (open-drain, requires pull-up) |
| Pin 5 | WAKE/EN — Wake-up input or enable (variant-dependent) |
| Pin 6 | LIN — LIN bus pin (single-wire bidirectional, ±42 V tolerant) |
| Pin 7 | NC — Not connected (per datasheet, package-dependent) |
| Pin 8 | EP/Thermal — Exposed pad / thermal pad (SON package); connect to GND |
Typical Applications
TLIN1029A-Q1 is suitable for 7 applications: Automotive Body Control Module (BCM), HVAC Control Panel Interface, Door Module / Window Lift Switch, Steering Wheel Switch Interface, Seat Control Memory Module, Automotive LED Lighting Controller, Automotive Sensor Cluster (Rear-Window, Rain/Light).
Automotive Body Control Module (BCM)
The TLIN1029A-Q1 provides the LIN physical interface for body control modules that coordinate lighting, wipers, and accessory relays. Its ±42 V fault tolerance on the LIN bus handles 12-V battery load-dump transients without external TVS diodes, reducing BOM and PCB area. Dominant-state timeout prevents bus lock-up if a microcontroller hangs, an essential safety feature in BCM designs. The 8-pin SOIC footprint fits easily behind connector pin fields, and AEC-Q100 qualification supports under-hood and cabin module placements.
Recommended
HVAC Control Panel Interface
HVAC control panels use LIN as a single-wire bus between the climate control head and the blower/actuator module. The TLIN1029A-Q1's integrated LIN responder pull-up removes the need for an external pull-up resistor, simplifying the panel PCB and reducing cost. Its 20 kbps LIN 2.x compliance is more than sufficient for temperature setpoint, fan speed, and mode commands. ±15 kV HBM ESD on the LIN pin protects against handling and connector mating transients during assembly and service.
Recommended
Door Module / Window Lift Switch
Door modules controlling window lift, mirror adjust, and lock actuators are classic LIN responder-node applications. The TLIN1029A-Q1's integrated wake-up pattern detector allows the module to sleep at microamp current and wake on a valid LIN wake-up frame from the BCM, supporting automotive quiescent-current budgets. Back-feed current blocking prevents ground-shift faults in door harnesses from injecting current into the VSUP rail. The 3×3 mm SON-8 option fits the tight mechanical envelope of integrated door handles and switch packs.
Recommended
Steering Wheel Switch Interface
Steering wheel switch interfaces use LIN to communicate button presses, scroll-wheel inputs, and paddle-shifter signals back to the BCM over a single twisted pair. The TLIN1029A-Q1's small SON-8 package fits the rotating-clock-spring harness coupler, where PCB area is constrained by the rotating mechanical assembly. AEC-Q100 Grade 1 (-40 °C to +125 °C) operation supports under-dash environments with wide thermal swings. Dominant-state timeout protects against switch-matrix shorts that could otherwise lock the bus dominant.
Recommended
Seat Control Memory Module
Seat control memory modules with position, heating, and massage functions use LIN to communicate with switches and the cabin body controller. The TLIN1029A-Q1's fault protection suite handles the noisy inductive loads of seat motors without latch-up. AEC-Q100 qualification and -40 °C to +125 °C operation cover cabin environments including cold-soak and high-temperature sun-load conditions. The integrated wake-up feature allows the seat module to remain quiescent until the BCM initiates a LIN frame, supporting deep sleep for parked vehicles.
Recommended
Automotive LED Lighting Controller
Exterior and interior LED lighting controllers increasingly use LIN for dimming and diagnostic communication. The TLIN1029A-Q1 supports LIN-based LED driver modules with diagnostic feedback, fault reporting, and dimming commands over a single bus wire. Its ±42 V bus tolerance survives load-dump events common in headlamp and tail-lamp wiring harnesses. The 8-pin SOIC package drops into small lighting driver PCBs where space is at a premium and thermal performance is dominated by the LED driver FETs.
Recommended
Automotive Sensor Cluster (Rear-Window, Rain/Light)
Sensor clusters such as rain-light sensors, parking assist sensors, and rear-window humidity sensors use LIN as a low-cost sub-network interface. The TLIN1029A-Q1's integrated pull-up and fault protection simplify the sensor module PCB, and the small SON-8 footprint supports the compact sensor housing. AEC-Q100 qualification and wide operating temperature ensure reliability in windshield-mounted and bumper-mounted locations subject to direct sun and road-spray thermal cycling.
Recommended
Recommended Products Summary
Engineering reference data for TLIN1029A-Q1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TLIN1029ADRQ1 | TLIN1029ADRBRQ1 | TLIN1029-Q1 | TLIN1027-Q1 | TJA1029T |
|---|---|---|---|---|---|---|
| Package | SOIC-8 (DRQ1) / SON-8 (DRBRQ1) | SOIC-8 (DRQ1) - same | SON-8 (DRBRQ1) - same | SOIC-8 / SON-8 - same | SOIC-8 - same | SOIC-8 - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | NXP Semiconductors |
| LIN Standard Compliance | LIN 2.0/2.1/2.2/2.2A + ISO 17987-4 | LIN 2.0/2.1/2.2/2.2A + ISO 17987-4 | LIN 2.0/2.1/2.2 + ISO 17987-4 | LIN 2.0/2.1/2.2 + ISO 17987 | ||
| Maximum Data Rate | 20 kbps (100 kbps fast programming) | 20 kbps (100 kbps fast programming) | 20 kbps | 20 kbps | ||
| LIN Bus Fault Voltage | ±42 V | ±42 V (similar) | ±27 V to ±40 V (variant-dependent) | ±40 V | ||
| Dominant State Timeout | Yes (integrated) | Yes (integrated) | Variant-dependent | Yes | ||
| Integrated LIN Pull-up | Yes (responder-node) | Yes | Yes (variant-dependent) | Variant-dependent (master vs slave) | ||
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes |
Key Differentiators
- Integrated ±42 V load-dump fault protection with dominant-state timeout (vs TLIN1027-Q1)
- Both SOIC-8 and 3×3 mm SON-8 package options in same silicon (vs TLIN1029ADRQ1 / TLIN1029ADRBRQ1)
- Cross-brand pin-compatibility with NXP TJA1029 family for second-source flexibility (vs TJA1029T (NXP))
Design Notes
Place a 100 nF X7R ceramic decoupling capacitor as close as possible to the VSUP pin (pin 3 in SOIC-8) to suppress battery-line transients. For 12-V automotive systems with high-injection noise (IEC 62132-4), add a bulk 10 µF + 100 nF combination on VSUP. The LIN bus trace should be kept short, routed over a continuous ground reference, and ideally guarded to avoid coupling to noisy lines. The exposed pad (SON-8 variant) MUST be soldered to a grounded copper pour of at least 10 mm² for thermal dissipation.
Do NOT omit the external pull-up on the RXD pin - RXD is an open-drain output and requires an external pull-up to VSUP (typically 5 V or MCU VCC) to function. Also verify the WAKE/EN pin behavior for your specific variant: in some variants, the pin is a wake-up input; in others, it is a logic-level enable. Driving it incorrectly can leave the device in an unexpected state. For LIN master nodes, an external master pull-up resistor (typically 1 kΩ) and reverse-blocking diode network is needed - the TLIN1029A-Q1 internal pull-up is intended for responder-node use.
Route the LIN bus as a single-ended signal with characteristic impedance of approximately 30 Ω to 50 Ω, using a ground-referenced microstrip or stripline. Keep stub lengths below 1/10 of the signal rise time (~10 ns) to avoid reflections. For harness applications, use twisted-pair with LIN on one conductor and ground on the other; avoid routing LIN near high-dV/dt signals (switching power, motor phases). Place TVS diodes (e.g., SMAJ33CA) on the LIN connector side if the harness extends outside the module enclosure.
Estimated thermal analysis: at VSUP = 14 V, VLIN recessive ~12 V, the TLIN1029A-Q1 dissipates approximately (14 V - 12 V) × 30 mA (recessive current) = 60 mW during recessive state. During a load-dump transient of 42 V on VSUP for 400 ms, dissipation can peak at (42 V × 30 mA) = 1.26 W, so the SOIC-8 thermal pad connection must be adequate. The SON-8 variant's exposed pad improves thermal performance by ~30% versus SOIC-8.
Compliance Information
AEC-Q100 qualified per Q1 suffix in MPN and TI product page. RoHS/REACH compliant per TI material declaration. Halogen-free per TI packaging spec.
