TPD4E001DCKR - 4-Ch 1.5pF 5.5V ESD Protection | TI
MPN: TPD4E001DCKR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.42 | $0.42 |
| 10 | $0.34 | $3.40 |
| 100 | $0.24 | $24.00 |
| 500 | $0.19 | $95.00 |
| 1,000 | $0.15 | $150.00 |
TPD4E001DCKR Overview
An ESD protection array is a type of TVS (transient voltage suppressor) device within the broader circuit-protection hierarchy. Its role is to divert electrostatic-discharge transients away from sensitive high-speed data lines before they reach downstream ICs such as USB transceivers, Ethernet PHYs, or microcontrollers. Low line capacitance is the defining parameter, because excessive capacitance distorts fast edge-rate signals like USB 2.0 (480 Mbps).
Key features include ultra-low 1.5 pF per-channel capacitance that preserves signal integrity on USB 2.0 and other high-speed interfaces, a maximum leakage current of only 1 nA to minimize battery drain in portable systems, a 5.5 V reverse working voltage suitable for 5 V and USB VBUS-adjacent rails, and ESD robustness at IEC 61000-4-2 Level 4 (±8 kV contact). The four-channel array format protects a full differential pair plus auxiliary lines in a single tiny package.
Architecturally, the TPD4E001 uses TVS-based steering and clamping diodes. On negative-going transients the clamp conducts within nanoseconds, clamping residual voltage at the protected IC far below the absolute-maximum levels of typical transceiver silicon. The device also provides a VCC pin that allows transients to be diverted into the supply rail with lower clamping on protected lines.
Typical applications are USB 2.0 ports, HDMI/DVI auxiliary and control lines, Ethernet MDI auxiliaries, keypads, and general-purpose high-speed GPIO on consumer, connectivity, and industrial boards.
When designing, route the TPD4E001DCKR as the first component after the connector with a short, low-inductance ground return; excessive trace inductance degrades clamping performance during an 8 kV strike.
This page synthesizes distributor data, drop-in alternatives, pinout, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for TPD4E001DCKR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TPD4E001DCKR (same form factor and footprint) — differing in Package, RoHS Status, MSL Level, Operating Temperature, Packaging.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TPD4E1U06DCKR
✅ Drop-In✓ In Stock
$0.16 / Unit
View Datasheet →TPD4E001DCKR-TP
✅ Drop-In📋 Reference alternative (not in catalog)
TPD4E001DBVR
✅ Drop-In✓ In Stock
$0.05 / Unit
View Datasheet →TPD4E001DCKR Specifications
| Channels | 4 |
| IO Capacitance Per Channel | 1.5 pF |
| Working Reverse Voltage (VRWM) | 5.5 V |
| ESD Rating (IEC 61000-4-2 Contact) | ±8 kV (Level 4) |
| ESD Rating (IEC 61000-4-2 Air) | ±15 kV |
| Maximum Leakage Current | 1 nA |
| Peak Pulse Power (tp = 8/20 us) | 100 W |
| Polarity | Bidirectional |
| Clamping Configuration | TVS diode array with VCC pin |
| Package | SC-70-6 (DCK / SOT-363 / SC-88) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C |
| MSL Level | 1 (260C unlimited) |
| RoHS Status | Compliant (RoHS & Green) |
| Packaging | Tape & Reel (TR) |
| Typical Applications | USB 2.0, high-speed data interfaces |
TPD4E001DCKR Pin Configuration
| Pin 1 | IO1 — Protected channel 1 (ESD clamp to GND/VCC rails) |
| Pin 2 | GND — Ground reference for ESD current diversion |
| Pin 3 | IO2 — Protected channel 2 |
| Pin 4 | IO3 — Protected channel 3 |
| Pin 5 | VCC — Supply pin for transient diversion and lower clamping |
| Pin 6 | IO4 — Protected channel 4 |
Typical Applications
TPD4E001DCKR is suitable for 6 applications: USB 2.0 Port Protection, Consumer Electronics High-Speed Data Lines, Ethernet and Network Port Protection, Industrial Control GPIO and Field Wiring, Notebook and Tablet Dock Connectors, Test and Measurement Instrument Front Panels.
USB 2.0 Port Protection
The TPD4E001DCKR is explicitly positioned by TI as an ESD protection diode for USB 2.0, and the fit is direct: its 1.5 pF per-channel capacitance adds negligible loading to the 480 Mbps high-speed differential pair, preserving eye-mask margin, while the 5.5 V VRWM covers D+/D- and ID/OTG lines with headroom. In a typical design the array sits immediately behind the USB connector, with D+, D-, and two auxiliary or ID lines routed to the four IO channels, GND to the connector shell ground, and VCC tied to the 5 V rail. The VCC pin allows transients to be diverted with lower residual clamping on the data lines. Because a human-inserted connector is the primary ESD entry point, IEC 61000-4-2 Level 4 (±8 kV contact) capability at this node is essential to prevent field returns from transceiver damage.
Recommended
Consumer Electronics High-Speed Data Lines
Distributor data lists connectivity and consumer electronics as the primary application domains for the TPD4E001DCKR. In smartphones, tablets, set-top boxes, and portable media players, numerous external interfaces - accessory connectors, memory-card control lines, button/keypad lines, and HDMI auxiliary channels - are touched or coupled by users and require system-level ESD hardening. The four-channel array format lets one small SC-70-6 device protect a full connector bundle, cutting BOM count and board area versus discrete TVS diodes. The 1 nA maximum leakage is particularly valuable in battery-powered consumer products, where multiple protected lines would otherwise add measurable quiescent drain. The -40C to +85C range and MSL 1 classification (260C unlimited floor life) also simplify high-volume reflow assembly without dry-cabinet storage.
Recommended
Ethernet and Network Port Protection
In networking equipment such as routers, switches, and IP-connected industrial devices, management interfaces (MDIO/MDC, link LEDs, reset lines) and unused or auxiliary signal pairs at the connector are exposed to cable-discharge events. The TPD4E001DCKR's 1.5 pF capacitance is low enough to protect lines adjacent to high-speed signaling without disturbing differential impedance, while ±8 kV contact / ±15 kV air IEC 61000-4-2 Level 4 capability meets the surge exposure of user-handled cables. Placing the array at the RJ45 or auxiliary connector with a short ground return keeps the discharge loop inductance low, which is the dominant factor in residual clamping voltage during an 8 kV strike. The bidirectional configuration also accommodates line voltages that swing above and below ground.
Recommended
Industrial Control GPIO and Field Wiring
Industrial controllers route PLC I/O, encoder signals, and operator-panel wiring over cables that act as antennas for both ESD and cable-discharge events. The TPD4E001DCKR provides four bidirectional clamp channels in a 2.0 x 2.1 mm SC-70-6 footprint, letting designers harden multi-line field connectors with minimal board space. Its -40C to +85C operating range matches industrial ambient specifications, and the 5.5 V VRWM protects 5 V and 3.3 V logic rails. Because clamping during a transient depends on loop inductance, the array should be placed directly at the connector with a via-farm or dedicated ground plane connection. For boards already using TI MCU families, the device drops into the GPIO bank protection position without layout changes when migrating between controller revisions.
Recommended
Notebook and Tablet Dock Connectors
Docking connectors on notebooks, tablets, and cradles carry numerous high-speed and control lines that mate repeatedly and are handled by users, making them frequent ESD entry points. The four-channel TPD4E001DCKR array covers paired control and auxiliary lines in one SC-70-6 device, and multiple arrays can be placed along the connector bank. The 1.5 pF capacitance is acceptable on control and sideband lines, and TI's pin-to-pin compatible TPD4E1U06DCKR offers an upgrade path with even lower capacitance and clamping if newer revisions of the dock standard demand it - both share the identical footprint, enabling a no-relayout bump. The 1 nA leakage supports connected-standby battery budgets, and MSL 1 handling suits high-volume contract manufacturing.
Recommended
Test and Measurement Instrument Front Panels
Bench instruments and portable testers expose BNC-adjacent logic, trigger lines, USB device ports, and probe-compensation outputs to frequent operator contact and cable handling. Applying TPD4E001DCKR arrays at these front-panel nodes provides IEC 61000-4-2 Level 4 (±8 kV contact) hardening before transients reach precision front-end or controller silicon. The bidirectional clamping tolerates signals biased above and below ground, and the 1.5 pF capacitance has negligible effect on trigger timing lines and slower digital sidebands. In portable instruments the 1 nA leakage keeps idle battery drain unmeasurable. The device is also useful during EMC pre-compliance, since protecting front-panel electronics reduces system-level IEC 61000-4-2 test iterations at the qualification lab.
Recommended
Recommended Products Summary
Engineering reference data for TPD4E001DCKR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TPD4E1U06DCKR | TPD4E001DCKR-TP | TPD4E001DBVR |
|---|---|---|---|---|
| Package | SC-70-6 (SOT-363) | SC-70-6 (same footprint, p2p per TI) | SC-70-6 (SOT-363) - same | SOT-23-6 (different footprint) |
| Brand | Texas Instruments | Texas Instruments | Leiditech | Texas Instruments |
| Channels | 4 | 4 | 4 | 4 |
| IO Capacitance | 1.5 pF | Lower than 1.5 pF (TI: reduced capacitance) | 1.5 pF | 1.5 pF |
Key Differentiators
- Ultra-low 1.5 pF capacitance in a 4-channel array (vs TPD4E001DBVR)
- 1 nA maximum leakage current (vs TPD4E001DCKR-TP)
- Pin-to-pin upgrade path exists (vs TPD4E1U06DCKR)
Design Notes
Place the TPD4E001DCKR as the first component after the connector, before any series resistors or common-mode chokes. The ESD discharge loop (pad -> clamp -> GND via) dominates residual clamping voltage: keep the trace from connector to the IO pin under 5 mm and use at least two GND vias adjacent to the GND pad, or a via-in-pad if stackup allows. During an 8 kV IEC 61000-4-2 strike, discharge currents reach tens of amps for nanoseconds, so every nanohenry of loop inductance adds several volts of overshoot at the protected IC.
The 1.5 pF per-channel capacitance appears as a shunt load on the protected line. On USB 2.0 high-speed (480 MHz fundamental content) this is acceptable but should be included in the channel simulation: with 45-ohm single-ended impedance, 1.5 pF introduces roughly a 68 ps time constant and a small reflection. Keep stubs to the protection pads as short as possible - a 3 mm stub adds approximately 0.3 pF of effective loading. If the design margin is tight, TI states the pin-compatible TPD4E1U06DCKR offers lower capacitance on the identical footprint.
Do not confuse the TPD4E001 package options: DCK (SC-70-6), DBV (SOT-23-6), DRL (SOT-5X3), DRS (QFN), and DPK (PUSON) all carry the same die but have different footprints and different pin function maps - a DBV part will not fit a DCK land pattern. TI also notes the TPD4E001 requires an input capacitor that the TPD4E1U06 eliminates; verify your BOM when doing a p2p upgrade. Finally, the 5.5 V VRWM is a working limit, not an absolute maximum - sustained overvoltage above VRWM will conduct leakage and heat the array.
Compliance Information
Listed as RoHS & Green with MSL Level 1 (260C unlimited) per PartGenie/distributor compliance data. Not an automotive AEC-Q100 part. REACH status not stated in provided data.
