TPS25942ARVCT - 5A eFuse Power MUX 20-WQFN | Texas Instruments
MPN: TPS25942ARVCT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.72 | $3.72 |
| 10 | $3.35 | $33.50 |
| 100 | $2.98 | $298.00 |
| 500 | $2.65 | $1,325.00 |
| 1,000 | $2.32 | $2,320.00 |
TPS25942ARVCT Overview
An eFuse (electronic fuse) is a solid-state power management IC that replaces traditional fuses and discrete hot-swap circuits. The TPS25942A integrates back-to-back MOSFETs that block reverse current when two power sources are present, making it ideal for power muxing between primary and backup supplies, USB Type-C PD source selection, and battery-backed systems. Within the broader IC taxonomy, an eFuse belongs to the power management IC family alongside hot-swap controllers, load switches, and supervisors.
Key features include ±5% current limit accuracy at 4 A, fast overcurrent response (sub-microsecond), 0.6 A to 5.2 A adjustable threshold via ILIM resistor, built-in thermal shutdown with auto-retry, fault output (FLT), power-good indicator, and IMON current sense output that outputs a current proportional to load current. The TPS25942A supports operating junction temperatures from -40 °C to +125 °C and is available in a thermally enhanced 3 mm × 4 mm WQFN package.
The TPS25942A uses TI's back-to-back N-FET architecture with analog control loops for current regulation and reverse current blocking. The two integrated FETs share a common drain between the two source pins, allowing independent channel control for hot-swap and power muxing. Per TI product page, the device supports up to 5 A continuous current with internal charge pump providing gate drive, and fault timers configurable via CT pin capacitor.
Typical applications include USB Type-C PD port protection, hot-swap insertion in servers and storage, RAID/NAS redundant power muxing, battery-backed systems, point-of-load protection in industrial 12 V rails, and eMMC/UFS power rail protection. The wide 2.7 V to 18 V operating range makes it suitable for both 3.3 V and 12 V bus architectures commonly found in computing and embedded designs.
When designing with the TPS25942ARVCT, ensure the IMON resistor is sized per the load current range, and place input/output capacitors close to the IC to suppress transients during hot-plug events. The CT capacitor sets fault timer duration and must be chosen based on the expected inrush current of the load capacitance.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for TPS25942ARVCT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TPS25942ARVCR
✅ Drop-In📋 Reference alternative (not in catalog)
TPS25942LRVCT
✅ Drop-In📋 Reference alternative (not in catalog)
TPS25944ARVCT
✅ Drop-In📋 Reference alternative (not in catalog)
TPS25942ARVCR
✅ Drop-In📋 Reference alternative (not in catalog)
TPS25942ARVCT Specifications
| Product Type | eFuse Power MUX / Hot-Swap Controller |
| Input Voltage Range | 2.7 V to 18 V |
| Continuous Current | 5 A |
| Adjustable Current Limit Range | 0.6 A to 5.2 A |
| On-Resistance (Ron) | 42 mΩ (typical) |
| Reverse Current Blocking | Yes (integrated back-to-back FETs) |
| Current Monitor Output (IMON) | Yes (analog current-sense output) |
| Power Good (PG) Output | Yes |
| Fault Output (FLT) | Yes (open-drain) |
| Thermal Shutdown | Yes (with auto-retry) |
| Operating Junction Temperature | -40 °C to +125 °C |
| Package | 20-pin WQFN (RVC), 3 mm × 4 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per TI product page) |
TPS25942ARVCT Pin Configuration
| Pin 1 | OUT — Output voltage to load (protected rail) |
| Pin 2 | OUT — Output voltage to load |
| Pin 3 | PG — Power-good open-drain output |
| Pin 4 | FLT — Fault indicator open-drain output |
| Pin 5 | IMON — Current-monitor output (current proportional to load) |
| Pin 6 | ILIM — Current-limit programming resistor |
| Pin 7 | CT — Fault timer capacitor |
| Pin 8 | EN — Enable input (active-high) |
| Pin 9 | GND — Ground reference |
| Pin 10 | IN1 — Input source 1 (back-to-back FET input) |
| Pin 11 | IN1 — Input source 1 |
| Pin 12 | DRAIN — Common drain of back-to-back FETs |
| Pin 13 | IN2 — Input source 2 (back-to-back FET input) |
| Pin 14 | IN2 — Input source 2 |
| Pin 15 | NC — Not connected (per datasheet) |
| Pin 16 | NC — Not connected (per datasheet) |
| Pin 17 | NC — Not connected (per datasheet) |
| Pin 18 | NC — Not connected (per datasheet) |
| Pin 19 | NC — Not connected (per datasheet) |
| Pin 20 | NC — Not connected (per datasheet) |
Typical Applications
TPS25942ARVCT is suitable for 6 applications: USB Type-C PD Port Protection, Server and Storage Hot-Swap, Redundant Power MUX (RAID/NAS), Industrial 12 V Hot-Swap Protection, Battery-Backed System Power Path, Point-of-Load Protection for Embedded SoCs.
USB Type-C PD Port Protection
The TPS25942ARVCT protects USB Type-C Power Delivery ports from overcurrent, reverse-current, and hot-plug transients per the TI TPS25942A datasheet. Its 5 A continuous rating covers USB PD 3.0 SPR up to 100 W at 20 V, and the integrated back-to-back FETs prevent reverse current when multiple Type-C sources are present. The IMON pin outputs a current proportional to load, which can feed a system MCU for dynamic load-sharing telemetry and PD contract monitoring. The WQFN-20 (RVC) 3x4 mm footprint fits easily behind a Type-C receptacle, saving board space versus discrete hot-swap circuits.
Recommended
Server and Storage Hot-Swap
The TPS25942ARVCT enables hot-swap insertion of disk drives, SSDs, and PCIe cards in server and storage applications per the TI TPS25942A datasheet. Its 2.7-18 V operating range covers both 3.3 V auxiliary and 12 V main bus rails found in modern servers. The integrated 42 mΩ FETs limit inrush current during board insertion while the FLT open-drain output signals the system supervisor of fault events. The PG output indicates when the output voltage has stabilized, allowing downstream DC-DC converters to enable in the correct sequence.
Recommended
Redundant Power MUX (RAID/NAS)
The TPS25942ARVCT supports redundant power-supply architectures in RAID arrays and NAS devices per the TI TPS25942A datasheet. Its reverse-current-blocking back-to-back FETs prevent back-feeding between a primary supply and a backup battery or secondary rail. Combined with the TPS25944ARVCT dual-channel variant for OR-ing both rails, designers can build seamless failover paths. The IMON output provides per-rail load telemetry for predictive maintenance and load balancing across redundant power domains.
Recommended
Industrial 12 V Hot-Swap Protection
The TPS25942ARVCT provides plug-in protection for industrial PLC cards, distributed I/O modules, and motor-drive peripherals operating on 24 V or 12 V industrial buses per the TI TPS25942A datasheet. Its 18 V absolute maximum and 5 A continuous rating accommodate industrial card-edge current budgets. The adjustable current limit (0.6-5.2 A) is set by a single ILIM resistor, simplifying design across multiple SKUs. The thermal shutdown with auto-retry protects against sustained fault conditions such as a shorted downstream regulator.
Recommended
Battery-Backed System Power Path
The TPS25942ARVCT manages power-path switching between a main DC supply and a backup battery in portable and edge-IoT applications per the TI TPS25942A datasheet. Its reverse-current-blocking FETs prevent the battery from feeding back into the main rail when AC power returns, while the integrated soft-start limits inrush during battery-to-load transitions. The PG and FLT outputs can drive an external supervisor to orchestrate graceful system shutdown on battery depletion.
Recommended
Point-of-Load Protection for Embedded SoCs
The TPS25942ARVCT sits between a downstream DC-DC converter and a sensitive SoC, FPGA, or ASIC to provide fast short-circuit and overcurrent protection per the TI TPS25942A datasheet. Its sub-microsecond fault response disconnects the load faster than a downstream fuse or PTC, protecting expensive processors during PCB assembly shorts or load faults. The 42 mΩ on-resistance adds minimal voltage drop at 5 A, preserving efficiency in 3.3 V and 5 V rail designs.
Recommended
Recommended Products Summary
Engineering reference data for TPS25942ARVCT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TPS25942ARVCR | TPS25942LRVCT | TPS25944ARVCT |
|---|---|---|---|---|
| Package | WQFN-20 (RVC) 3x4 mm | WQFN-20 (RVC) 3x4 mm - same | WQFN-20 (RVC) 3x4 mm - same | WQFN-20 (RVC) 3x4 mm - same |
| Brand | Texas Instruments | Texas Instruments - same | Texas Instruments - same | Texas Instruments - same |
| Input Voltage Range | 2.7 V to 18 V | 2.7 V to 18 V | 2.7 V to 18 V | 2.7 V to 18 V |
| Continuous Current | 5 A | 5 A | 2 A (low-current variant) | 5 A (per channel) |
| On-Resistance (Ron) | 42 mΩ | 42 mΩ | 42 mΩ | 42 mΩ |
| Reverse-Current Blocking | Yes (back-to-back FETs) | Yes | Yes | Yes |
| Number of Channels | 1 | 1 | 1 | 2 (MUX) |
| IMON Current Monitor | Yes | Yes | Yes | Yes |
Key Differentiators
- Single-channel 5 A eFuse with IMON and PG in compact WQFN-20 (vs TPS25944ARVCT)
- Reverse-current-blocking back-to-back FETs integrated (vs TPS25942LRVCT)
- Adjustable current limit 0.6-5.2 A via single ILIM resistor (vs TPS25942ARVCR)
Design Notes
At maximum continuous current of 5 A and an on-resistance of 42 mΩ, the TPS25942ARVCT dissipates approximately 1.05 W (P = I² × R). With the WQFN-20 (RVC) package thermal pad soldered to at least 1 square inch of inner-layer copper, the junction-to-ambient thermal resistance (θJA) is approximately 35 °C/W, resulting in a 36 °C temperature rise above ambient. For sustained 5 A operation above 70 °C ambient, ensure adequate copper thermal mass or reduce load current to maintain junction temperature below the 125 °C maximum.
Place input bulk capacitors (≥22 µF ceramic or 47 µF polymer) directly at the IN1/IN2 pins and output capacitors (≥22 µF) at the OUT pin to suppress transients during hot-plug events. The exposed thermal pad (pin 21) MUST be soldered to a continuous ground plane with thermal vias (typically 9 × 0.3 mm vias) to a bottom-layer heat sink. Keep high-current traces wide (≥20 mil per ampere) and avoid narrow trace bottlenecks between the FET pins and the bulk capacitors.
Do not omit the CT capacitor at the CT pin (pin 7). The CT capacitor sets the fault blanking time, and leaving it open causes immediate fault latch on any inrush event, preventing normal startup. Choose CT per the formula in the datasheet (typically 100 nF for ~10 ms blanking). Also ensure the ILIM resistor (pin 6) is populated to ground; an open ILIM pin disables the current-limit feature. Use a 1% tolerance resistor to maintain accurate current-limit threshold across temperature.
The IMON output (pin 5) is a high-impedance current source that converts load current to a proportional voltage across an external RIMON resistor. To prevent noise coupling from adjacent switching nodes, keep the IMON trace short and route it away from the OUT switching node. Add a 100 nF ceramic bypass capacitor from IMON to GND to filter switching transients. The FLT and PG open-drain outputs require pull-up resistors (10 kΩ typical) to the system logic rail.
Compliance Information
RoHS and lead-free status per TI product page. Halogen-free status not stated in retrieved data. Not AEC-Q100 qualified - consider TPS25942A-Q1 variants for automotive applications if needed.
