VSC8479YYY - 11.3 Gbps 16-Bit Transceiver | Microchip
MPN: VSC8479YYY ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.5787 | $45.58 |
| 10 | $45.5787 | $455.79 |
| 100 | $45.5787 | $4,557.87 |
| 500 | $45.5787 | $22,789.35 |
| 1,000 | $45.5787 | $45,578.70 |
VSC8479YYY Overview
A high-speed transceiver is a semiconductor interface that converts wide parallel data into a high-speed serial stream and converts received serial data back into parallel form. The VSC8479 belongs to the broader transceiver and data-converter hierarchy while integrating timing-recovery functions needed to establish and recover a reliable high-speed data stream. Its 16-bit interface, continuous frequency coverage, and integrated CDR and CMU reduce the amount of external high-speed conversion circuitry required in communications equipment.
Key features include a 1:16 transmit fanout, a 16:1 receive aggregation, a 16-bit parallel data path, and a documented continuous operating span of 9.953 Gbps to 11.3 Gbps. The device is identified as a single Ethernet-class port transceiver by Mouser and as a telecom IC transceiver by DigiKey. Its single-chip, 17 mm by 17 mm implementation is specifically presented as a way to reduce board area and system cost in compact, price-sensitive modules.
The integrated clock and data recovery unit supports extraction or recovery of timing from the associated high-speed signal path, while the clock multiplier unit supplies the required derived clock functions. This integration can simplify synchronization architecture, but board implementation still requires careful high-speed layout, controlled impedance, short return paths, compliant clocking, power delivery, isolation, and signal-integrity verification. Exact power, voltage, pin, and environmental limits must be confirmed in the manufacturer datasheet before layout release.
Typical uses include 10GbE and 10GFC optical-module electronics, OC-192 transport interfaces, FEC equipment, telecommunications line cards, and compact high-speed network modules. The part is most appropriate where one device must support both serialization and deserialization functions at rates covered by its 9.953 Gbps-to-11.3 Gbps operating range. System designers should evaluate lane timing, reference-clock requirements, thermal performance, and protocol interoperability before production deployment.
The principal design consideration is that this is a very-high-speed mixed-signal device rather than a general-purpose serial interface. Its 244-FCBGA land pattern, multilayer routing, differential pairs, reference clocks, and decoupling network must be designed as one controlled signal-integrity system. Validate channel loss, jitter tolerance, crosstalk, return loss, and power-supply noise during prototype testing.
This product record combines verified manufacturer and distributor information with application guidance, sourcing context, and explicit data gaps. It does not infer missing electrical limits, pin assignments, lifecycle status, or unverified drop-in replacements; those details remain tied to authoritative Microchip documentation and approved cross-reference results.
Drop-in alternatives for VSC8479YYY — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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Request AlternativesVSC8479YYY Specifications
| Product Type | 1:16 and 16:1 high-speed serial transceiver |
| Continuous Operating Frequency Range | 9.953 Gbps to 11.3 Gbps |
| Maximum Documented Data Rate | 11.3 Gbps |
| Transmit Fanout | 1:16 |
| Receive Aggregation | 16:1 |
| Parallel Interface Width | 16 bit |
| Integrated Clock and Data Recovery | Integrated CDR |
| Clock Multiplication | Integrated CMU |
| Port Classification | 1 Ethernet-class port |
| Signal Classes | OC-192, FEC, 10GbE, and 10GFC |
| Package Type | 244-FCBGA |
| Package Dimensions | 17 mm x 17 mm |
| Core Technology | CMOS |
| Mounting Type | Surface mount |
VSC8479YYY 17 mm x 17 mm Pin Configuration Guide
Pin configuration for VSC8479YYY (17 mm x 17 mm package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for VSC8479YYY.
Refer to the datasheet for full pin configuration.
Typical Applications
VSC8479YYY is suitable for 6 applications: 10GbE Communications Modules, OC-192 Transport Equipment, 10GFC Interconnect Modules, FEC Processing Platforms, Telecom Line Cards, Dense Optical Network Modules.
10GbE Communications Modules
The VSC8479YYY fits compact Ethernet modules that need 16-bit parallel-side control and an 11.3 Gbps-capable serial interface. Its 1:16 transmit and 16:1 receive paths, integrated CDR, and integrated CMU reduce the number of separate high-speed conversion blocks around a 10GbE design. The 244-FCBGA footprint keeps the active silicon to 17 mm by 17 mm, although it requires multilayer routing, continuous reference planes, impedance-controlled lanes, and dense power decoupling. System designers should qualify the exact 10GbE PHY, optical or copper media interface, reference clock, and channel margin before production.
Recommended
OC-192 Transport Equipment
OC-192 transport equipment can use the VSC8479YYY where its continuous 9.953 Gbps-to-11.3 Gbps operating range and 16-bit interface align with the line-card architecture. The integrated CDR and CMU support timing functions within one high-speed transceiver, while the dual 1:16 and 16:1 organization supports transmit and receive paths. A carrier-grade implementation still needs exact voltage, temperature, protocol, and qualification data from the complete manufacturer documentation, along with compliance testing for the deployed transport standard.
Recommended
10GFC Interconnect Modules
The VSC8479YYY is applicable to compact 10GFC module electronics that benefit from consolidated serial and parallel conversion. Its 1:16 serializer path, 16:1 deserializer path, 16-bit data width, integrated clock recovery, and clock multiplication provide a focused high-speed interface block. The 244-FCBGA can reduce assembly area compared with multiple larger devices, but manufacturability depends on multilayer PCB capability, fine-pitch assembly, thermal validation, and accurate high-speed design rules.
Recommended
FEC Processing Platforms
Forward-error-correction platforms can benefit from the VSC8479YYY when they require parallel data exchange with a 9.953 Gbps-to-11.3 Gbps serial fabric. The integrated timing functions can organize transmit and receive lanes, while the 17 mm by 17 mm FCBGA supports compact line-card or module implementations. Actual interoperability depends on lane rate, reference-clock architecture, coding overhead, latency, and equalization requirements. Engineers must validate the complete link from processor interface through CDR, PCB channel, and external optics or copper PHY.
Recommended
Telecom Line Cards
The VSC8479YYY can serve as a central high-speed interface in a telecommunications line card requiring serialization, deserialization, clock recovery, and clock multiplication. Its continuous 9.953 Gbps-to-11.3 Gbps range makes it relevant to high-capacity transport equipment, while the integrated 244-FCBGA consolidates functions into a 17 mm by 17 mm area. Deployment still requires board-space planning for regulators, termination, optical drivers, protection, connectors, and thermal management, plus verification against the applicable carrier environmental requirements.
Recommended
Dense Optical Network Modules
A dense optical network module can use the VSC8479YYY when board area is constrained and a 16-bit parallel interface must connect to high-speed optical components. The combined 1:16 and 16:1 architecture, integrated CDR, integrated CMU, and 17 mm by 17 mm package support consolidation on a multilayer module substrate. Because this package has 244 contacts and supports rates up to 11.3 Gbps, assembly capability, reference-clock quality, lane skew, connector launches, and channel simulation are decisive engineering constraints.
Recommended
Recommended Products Summary
Engineering reference data for VSC8479YYY — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Manufacturer | Microchip Technology |
| Package | 244-FCBGA (17 mm x 17 mm) |
| Transmit Architecture | 1:16 |
| Receive Architecture | 16:1 |
| Parallel Data Width | 16 bit |
| Continuous Data-Rate Range | 9.953 Gbps to 11.3 Gbps |
| Maximum Documented Rate | 11.3 Gbps |
| Clock and Data Recovery | Integrated CDR |
| Clock Multiplication | Integrated CMU |
| Verified Unit Price | $45.5787 as of 2026-10-20 |
Design Notes
Treat every high-speed lane and reference clock as a controlled-impedance transmission line. Use continuous ground and power reference planes, minimize vias and stubs, maintain lane-length and clock skew control, and terminate unused or test points according to the complete Microchip design guidance. Prototype measurements should include insertion loss, return loss, crosstalk, eye opening, and jitter across temperature. The supplied data confirms operation up to 11.3 Gbps but does not provide channel masks, so the PCB cannot be released from headline frequency alone.
The 244-FCBGA requires a multilayer PCB with dense escape routing and package-specific via and land patterns. Obtain the authoritative Microchip pin list, footprint, exposed-pad requirements, and assembly process information before CAD release. Place decoupling and clock-generation components near their associated device pins, preserve symmetry on differential routes, and avoid plane splits beneath high-speed paths. The 17 mm by 17 mm package saves board area relative to multiple large ICs but does not eliminate high-layer-count or fine-pitch assembly requirements.
Verify the device's permitted supply rails, tolerance, sequencing, current, and power-consumption limits from the complete manufacturer datasheet because those values are absent from the supplied extracts. Use a low-noise power tree, local bulk and high-frequency decoupling, and sufficient plane connectivity to control simultaneous switching effects. Measure ripple on every active rail during maximum-data-rate and worst-case pattern operation; a nominal 11.3 Gbps capability does not establish immunity to an inadequately designed power grid.
Do not treat another VSC8479 suffix, a generic 16-bit serializer, or any other 11.3 Gbps transceiver as a drop-in replacement without verified pin, package, clock, protocol, and parameter equivalence. No validated replacement MPN appears in the supplied cross-reference results. Also do not infer lead time, lifecycle status, temperature range, pin assignments, or RoHS status from distributor snippets. Resolve those items through current Microchip documentation and written distributor confirmation before schematic, PCB, or purchasing release.
Compliance Information
The supplied search results do not provide verified environmental, automotive, lead-free, halogen-free, or conflict-minerals declarations. No compliance status has been inferred.
