W25N01GVZEIR - 1Gbit SPI/Quad SLC NAND Flash | Winbond
MPN: W25N01GVZEIR ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.52 | $4.52 |
| 10 | $4.05 | $40.50 |
| 100 | $3.61 | $361.00 |
| 500 | $3.22 | $1,610.00 |
| 1,000 | $2.85 | $2,850.00 |
W25N01GVZEIR Overview
A serial NAND flash such as the W25N01GVZEIR is a non-volatile memory IC that stores bits in NAND cell arrays but exposes them through a low-pin-count SPI bus rather than a parallel interface. SLC NAND stores one bit per cell, yielding 10x higher endurance and 10x lower bit error rate than MLC/TLC parts at the cost of density. The part belongs to the broader hierarchy NAND flash -> non-volatile memory -> memory IC -> semiconductor, sitting alongside SPI NOR flash and parallel NAND in modern embedded designs; SPI NAND typically wins where higher density per pin and lower cost-per-bit are required.
Key features include industrial -40C to +85C operating range, 100k program/erase endurance cycles per block, 10-year data retention, hardware and software write protection, a 64-bit unique ID, and a JEDEC-standard SFDP (Serial Flash Discoverable Parameters) table that lets host controllers auto-configure the device. The 8-WSON package is halogen-free and RoHS compliant, with renewable-energy manufacturing indicated by the 'G' position-character.
The W25N01GVZEIR uses a single 3 V supply and a 1-bit/2-bit/4-bit SPI bus to reduce host pin count versus parallel NAND. Its on-die ECC engine corrects up to 8-bit errors per 512-byte sector, freeing the host MCU from running software ECC and lowering CPU load during page reads. The integrated BBM LUT preserves the logical address space when bad blocks emerge during the device's lifetime, simplifying FTL design for raw-NAND Linux MTD and LittleFS deployments.
Typical applications include IoT edge nodes requiring 1 Gbit of low-pin-count non-volatile storage, industrial sensor loggers, smart-home gateways, automotive infotainment boot + data partitions, consumer wearables storing firmware and telemetry, and embedded Linux systems booting from SPI NOR and using SPI NAND as a data partition. Compared with SPI NOR of equal density, SPI NAND delivers higher density per pin at a lower cost-per-bit while trading some random-access speed for sequential throughput.
When designing, ensure the host controller supports the Winbond W25N-GV command set (0xEF manufacturer ID, 0xAA21 device ID) and that ECC is either disabled on the host or left to the on-die engine. Place a 1 uF decoupling capacitor within 5 mm of the VCC pin and route /CS through a dedicated GPIO so deep power-down (0xB9) can be asserted to drop standby current below 15 uA when the host sleeps.
This page synthesizes distributor pricing, pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for W25N01GVZEIR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
W25N01GVZEIG
✅ Drop-In📋 Reference alternative (not in catalog)
W25N01GVZEIT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
W25N01GVTCIG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
GD5F1GQ4
✅ Drop-In📋 Reference alternative (not in catalog)
MX35LF1GE4AB
✅ Drop-In📋 Reference alternative (not in catalog)
W25N01GVZEIR Maximum Ratings & Electrical Characteristics
| Memory Type | Non-volatile NAND flash (SLC) |
| Density | 1 Gbit (128 MByte) |
| Bus Interface | SPI / Dual SPI / Quad SPI |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Maximum Clock Frequency | 104 MHz |
| Access Time | 7 ns |
| Page Size | 2048 bytes + 64 bytes spare |
| Block Size | 64 pages (128 KByte + 4 KByte spare) |
| On-die ECC | 8-bit per 512-byte sector (hardware) |
| Bad Block Management | Built-in BBM LUT |
| Program/Erase Endurance | 100,000 cycles per block (typical) |
| Data Retention | 10 years (typical) |
| Operating Temperature | -40C to +85C (industrial) |
| Package | 8-WSON (8x6 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Halogen Free | Yes |
| Continuous Read Mode | Yes |
| Unique ID | 64-bit factory programmed |
W25N01GVZEIR Pin Configuration
| Pin 1 | /CS — Chip select, active low |
| Pin 2 | DO (IO1) — Serial data out / IO1 in Quad SPI |
| Pin 3 | /WP (IO2) — Write protect, active low / IO2 in Quad SPI |
| Pin 4 | GND — Ground |
| Pin 5 | SI (IO0) — Serial data in / IO0 in Quad SPI |
| Pin 6 | CLK — Serial clock |
| Pin 7 | /HOLD (IO3) — Hold, active low / IO3 in Quad SPI |
| Pin 8 | VCC — Power supply, 2.7 V to 3.6 V |
Typical Applications
W25N01GVZEIR is suitable for 6 applications: Industrial IoT Data Logger, Smart Home Gateway, Automotive Infotainment Boot Partition, Consumer Wearable Firmware Store, Embedded Linux Data Partition, Audio Recording and Voice Prompt Storage.
Industrial IoT Data Logger
Stores hours-to-days of sensor telemetry in edge gateways and remote monitoring nodes. The W25N01GVZEIR's 1 Gbit density holds up to 128 MByte of structured logs while the SPI/Quad bus keeps the host MCU pin count to six lines (CS, CLK, IO0, IO1, IO2, IO3), freeing GPIOs for sensors and radios. Its -40C to +85C industrial rating, 100k P/E endurance per block, and 10-year retention withstand vibration, thermal cycling, and multi-year unattended deployment. On-die 8-bit/512-byte ECC plus the BBM LUT let the host skip software ECC and raw-NAND FTL work, dramatically lowering CPU load on low-power Cortex-M0/M4 designs. Place the part on a 3.3 V rail with a 1 uF decoupling cap, and use deep-power-down (command 0xB9) when the gateway sleeps to drop standby current under 15 uA.
Recommended
Smart Home Gateway
Provides local firmware storage, configuration cache, and Zigbee/Thread/Z-Wave protocol buffers in residential gateways. The W25N01GVZEIR's 104 MHz Quad SPI bus delivers up to 416 Mbit/s sequential read, fast enough to shadow large OTA update payloads into RAM and boot Linux in under a second on gateway SoCs. The 2 KB page size and on-die ECC match typical LittleFS and Linux MTD drivers, eliminating external NAND controllers. The 8-WSON 8x6 mm footprint fits beneath the gateway SoC BGA, and the RoHS-compliant halogen-free package meets EU and North American consumer-electronics substance rules. Industrial temperature grade lets indoor and outdoor gateway housings share the same BOM.
Recommended
Automotive Infotainment Boot Partition
Holds the Linux kernel and initramfs for IVI head units where 1 Gbit is sufficient for compressed boot assets. The W25N01GVZEIR's industrial -40C to +85C range tolerates cabin and behind-dash environments, and its Quad SPI XiP mode allows direct boot from flash on many automotive SoCs without external DRAM for early boot stages. The on-die ECC engine and BBM LUT are critical in automotive duty cycles, where vibration-induced bit errors and lifetime wear-out of NAND blocks must be masked transparently. Designers targeting AEC-Q100 must verify the specific Winbond part number carries the /Q1 or AEC-Q100 suffix; the standard W25N01GVZEIR is industrial-grade, not automotive-qualified.
Recommended
Consumer Wearable Firmware Store
Stores bootloader, firmware, activity history, and BLE bonding data in fitness bands and smart watches. The W25N01GVZEIR's low 8-WSON 8x6 mm footprint occupies less than 50 mm^2 of PCB area, and its 2.7 V to 3.6 V supply matches coin-cell and Li-ion regulated rails. Quad SPI Continuous Read mode lets the host MCU stream 2 KB pages sequentially without per-page command overhead, reducing SPI bus activity and saving battery energy during OTA updates. The 10-year retention spec comfortably exceeds typical wearable service life of 3-5 years, while 100k P/E cycles support daily activity-log writes for many years.
Recommended
Embedded Linux Data Partition
Acts as a non-rootfs data partition on Linux systems booting from SPI NOR, providing 1 Gbit of writable storage for logs, databases, and configuration files. The W25N01GVZEIR's JEDEC SFDP table lets modern Linux kernels auto-detect the device and load the Winbond SPI NAND driver without a custom device-tree node, simplifying BSP bring-up. The on-die ECC engine offloads error correction from the host CPU, while the BBM LUT keeps the logical address map stable across the device's lifetime despite bad-block emergence. Engineers pair it with a 16 to 64 Mbit SPI NOR for the bootloader + kernel, leaving the larger 1 Gbit SPI NAND for application data.
Recommended
Audio Recording and Voice Prompt Storage
Stores pre-recorded voice prompts, alarm tones, and compressed audio playback buffers in intercoms, alarm panels, and doorbells. The W25N01GVZEIR's 1 Gbit density holds roughly 8 minutes of 16 kHz 16-bit PCM audio or several hours of ADPCM/Opus compressed prompts. Continuous Read mode streams pages sequentially without per-page command overhead, eliminating audio glitches caused by SPI command latency. The 7 ns access time and 104 MHz Quad SPI clock deliver up to 416 Mbit/s of read bandwidth, which exceeds typical ADPCM and Opus bitrates by an order of magnitude, leaving ample headroom for concurrent system activity.
Recommended
Recommended Products Summary
Engineering reference data for W25N01GVZEIR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | W25N01GVZEIG | W25N01GVZEIT | W25N01GVTCIG | GD5F1GQ4 | MX35LF1GE4AB |
|---|---|---|---|---|---|---|
| Brand | Winbond | Winbond | Winbond | Winbond | GigaDevice | Macronix |
| Package | 8-WSON (8x6 mm) | 8-WSON (8x6 mm) - same | 8-WSON (8x6 mm) - same | 8-WSON (8x6 mm) - same | 8-WSON (8x6 mm) - same | 8-WSON (8x6 mm) - same |
| Density | 1 Gbit (128 MByte) | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Interface | SPI / Quad SPI | SPI / Quad SPI | SPI / Quad SPI | SPI / Quad SPI | SPI / Quad SPI | SPI / Quad SPI |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Max Clock | 104 MHz | 104 MHz | 104 MHz | 104 MHz | 104 MHz | 104 MHz |
| On-die ECC | 8-bit/512-byte | 8-bit/512-byte | 8-bit/512-byte | 8-bit/512-byte | 8-bit/512-byte | 8-bit/512-byte |
| Lifecycle Status | Obsolete | Active | Active | Active | Active | Active |
Key Differentiators
- Pin-compatible with multiple Winbond W25N-GV family members (vs W25N01GVZEIG)
- Cross-brand second-source coverage in same package (vs GD5F1GQ4 / MX35LF1GE4AB)
- Higher density per pin than SPI NOR alternatives (vs W25Q-series SPI NOR (e.g., W25Q256JV))
Design Notes
Place a 1 uF X7R 0402 ceramic decoupling capacitor within 5 mm of pin 8 (VCC) and another 100 nF within 2 mm for high-frequency noise. The 8-WSON 8x6 mm central thermal pad (EP) must be soldered to a GND copper pour of at least 1 square inch to provide thermal relief and a low-impedance ground return. Keep the SPI traces to the host MCU within 25 mm and length-matched within 2 mm if running at 80 MHz or higher to avoid timing skew in Quad SPI mode. Add a 10 kohm pull-up on /CS to prevent floating chip-select during host reset.
Route CLK away from noisy rails (DC-DC switch nodes, RF traces) and place a 22 ohm series resistor near the host MCU on CLK to dampen reflections when running at the 104 MHz maximum. For Quad SPI IO0-IO3, use matched-impedance routing (typically 50 ohm single-ended) and avoid via stubs. Add a 4.7 kohm pull-up on /HOLD and /WP if those pins are unused in the design to prevent accidental chip reset. Verify timing margins with a worst-case IO delay simulation at -40C before sign-off.
Do not assume SPI NAND reads work the same way as SPI NOR: the W25N01GVZEIR returns data only after the page-read command (0x13) completes internally (typ. 25-50 us), so the host must poll status register bit 0 before clocking out the page. Disabling on-die ECC by clearing the ECC bit in the status register will silently corrupt data, since the host MCU is unlikely to run software ECC over 2 KB pages in real time. Always issue deep power-down (0xB9) before removing VCC to ensure the internal charge pump finishes its current write cycle, otherwise the in-progress page may be left in an indeterminate state.
Compliance Information
RoHS compliant and halogen-free packaging per Winbond product page. Industrial temperature grade (-40C to +85C) is not AEC-Q100 qualified; designers targeting automotive must verify the specific part suffix for AEC-Q100 status.
