W9751G6KB-25-TR - 512Mb DDR2 SDRAM x16 84-WBGA | Winbond
MPN: W9751G6KB-25-TR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.65 | $26.50 |
| 100 | $2.3 | $230.00 |
| 500 | $2.05 | $1,025.00 |
| 1,000 | $1.85 | $1,850.00 |
| 3,000 | $1.62 | $4,860.00 |
W9751G6KB-25-TR Overview
A DDR2 SDRAM is a synchronous dynamic random-access memory that transfers two data words per clock cycle on both rising and falling edges, doubling peak throughput compared with DDR1 at the same clock rate. DDR2 sits in the SDRAM hierarchy between DDR1 and DDR3, with lower power (1.8 V VDD), higher prefetch (4n), and on-die termination that improves signal integrity on densely routed DIMM or SoC fly-by topologies. It is the standard commodity DRAM of the late-2000s era and remains widely second-sourced today for industrial, set-top, networking, and embedded designs.
Key features of the W9751G6KB-25-TR include a 16-bit-wide data interface, 4-bank architecture supporting concurrent operations, programmable CAS Latency (CL), Additive Latency (AL), and Write Latency (WL) to ease controller timing closure, and on-die termination (ODT) for signal-integrity tuning. The 84-WBGA package with 8 x 12.5 mm outline offers a compact footprint for space-constrained boards, while the industrial-commercial temperature window covers most non-automotive embedded environments.
The device integrates Winbond's standard DDR2 mode-register set, refresh logic, and self-refresh / power-down modes for low standby current. Programmable burst lengths of 4 and 8 plus burst-chop and burst-interrupt sequences allow efficient DDR2 controller interfacing. The 25 in the part number (W9751G6KB-25) corresponds to the -25 speed grade (CL5 equivalent), supporting 400 MHz operation.
Typical applications include IPTV/set-top box main memory buffering, low-end networking line cards, industrial HMI panels, surveillance DVR frame buffers, and consumer-electronics motherboards that still support DDR2 memory. The 512 Mbit density slots in where 64 MB of working memory is needed without the cost of 1 Gb densities.
When designing with this part, observe the JEDEC DDR2 fly-by topology recommendations: route command/address/control/clock in a daisy-chain from the controller to the DRAM, place VREF and VTT termination as recommended, and provide a 100 nF plus bulk decoupling near each VDD/VSS pair.
This page synthesizes current distributor pricing, drop-in equivalents from Winbond and competitor sources, and practical PCB-layout notes not aggregated on any single manufacturer or distributor page.
Drop-in alternatives for W9751G6KB-25-TR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with W9751G6KB-25-TR (same form factor and footprint) — differing in Access Time, Burst Length, Clock Frequency, Memory Size, Memory Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
W9751G6KB-25
✅ Drop-In✓ In Stock
$0.92 / Unit
View Datasheet →W9751G6KB-25-TRAY
✅ Drop-In📋 Reference alternative (not in catalog)
MT47H64M16HR-25
✅ Drop-In📋 Reference alternative (not in catalog)
K4T51163QR-BID25
✅ Drop-In📋 Reference alternative (not in catalog)
IS43TR16640A-25DTLI
✅ Drop-In📋 Reference alternative (not in catalog)
W9751G6KB-25-TR Maximum Ratings & Electrical Characteristics
| Memory Type | Volatile DRAM, DDR2 SDRAM |
| Memory Size | 512 Mbit (64 MB) |
| Organization | 32M x 16 (8M words x 4 banks x 16 bits) |
| Interface | Parallel, SSTL_18 |
| Clock Frequency | 400 MHz (DDR2-800) |
| Data Rate | 800 MT/s |
| Access Time | 57.5 ns (clock cycle) |
| Supply Voltage (VDD/VDDQ) | 1.7 V to 1.9 V (1.8 V nominal) |
| Operating Temperature | 0 C to 85 C (commercial) |
| Number of Banks | 4 |
| Burst Length | 4, 8 (with burst chop) |
| On-Die Termination (ODT) | Yes, programmable |
| Self-Refresh / Power-Down | Supported |
| Package | 84-WBGA (8 x 12.5 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Delivery Form | Tape and Reel (TR) |
W9751G6KB-25-TR 84-wbga (8 x 12.5 mm) Pin Configuration Guide
Pin configuration for W9751G6KB-25-TR (84-wbga (8 x 12.5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for W9751G6KB-25-TR.
Refer to the datasheet for full pin configuration.
Typical Applications
W9751G6KB-25-TR is suitable for 6 applications: Set-Top Box / IPTV Main Memory, Industrial HMI / Panel PCs, Surveillance DVR Frame Buffer, Low-End Networking Line Card, Consumer Motherboard Mainstream DDR2, Embedded Single-Board Computer (SBC) Memory.
Set-Top Box / IPTV Main Memory
The W9751G6KB-25-TR supplies 64 MB of working memory for set-top box SoCs that retain a DDR2 controller for cost reasons. Its 800 MT/s peak transfer rate is sufficient for AV stream buffers, EPG caching, and Java runtime heap in middleware stacks. Placed adjacent to the SoC with fly-by command routing per JEDEC DDR2 topology, it provides the lowest-cost DDR2 density tier that still leaves headroom for full-resolution 1080p decode buffers.
Recommended
Industrial HMI / Panel PCs
In industrial HMI panels the W9751G6KB-25-TR provides compact 64 MB of working memory for Linux/Windows Embedded panels. Its 1.8 V supply keeps total system power below 1 W for the memory subsystem, which matters for fanless designs. The 84-WBGA package sits cleanly on standard 4-layer panels and meets 0-85 C commercial-grade requirements for indoor factory HMI use cases without industrial-temp de-rating.
Recommended
Surveillance DVR Frame Buffer
Surveillance DVRs allocate per-channel buffers for compressed video streams, and the W9751G6KB-25-TR provides 64 MB split across 4 banks to support 4-8 simultaneous 1080p H.264 streams at moderate bitrates. The 4-bank architecture supports concurrent activation of multiple rows for sustained read/write traffic. Its 84-WBGA footprint is well-suited to compact 4-channel DVR boards, and second-source cross-references to Micron MT47H64M16HR-25 simplify procurement.
Recommended
Low-End Networking Line Card
Entry-level router and switch line cards use DDR2 working memory for packet descriptors and ACL tables, and the W9751G6KB-25-TR provides 64 MB at 800 MT/s for descriptor rings. Its 1.8 V SSTL_18 I/O integrates cleanly with NXP LS1021A-class networking SoCs. The JEDEC standard timing and pinout let designers drop in either Winbond or Micron parts without firmware changes, supporting dual-source supply chains for networking OEMs.
Recommended
Consumer Motherboard Mainstream DDR2
Late-generation consumer motherboards with DDR2 slots still ship in high volume in cost-sensitive markets. The W9751G6KB-25-TR is widely used on DIMM modules as a single-rank x16 chip to build 64-MB or 128-MB registered/unbuffered modules. Its 400 MHz DDR2-800 grade satisfies mainstream consumer memory bandwidth needs while keeping bill-of-materials cost low.
Recommended
Embedded Single-Board Computer (SBC) Memory
Embedded SBCs targeting Linux or RTOS workloads at 64 MB footprint often use a single W9751G6KB-25-TR as the entire system memory. The 84-WBGA package, 1.8 V supply, and on-die termination simplify board design with only four decoupling caps per device. With 800 MT/s peak throughput the part supports busyboot times and TCP/IP stack throughput sufficient for IoT edge gateways in retail signage and access-control terminals.
Recommended
Recommended Products Summary
Engineering reference data for W9751G6KB-25-TR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | W9751G6KB-25 | W9751G6KB-25-TRAY | MT47H64M16HR-25 | K4T51163QR-BID25 | IS43TR16640A-25DTLI |
|---|---|---|---|---|---|---|
| Brand | Winbond | Winbond | Winbond | Micron Technology | Samsung Electronics | ISSI (Micron subsidiary) |
| Package | 84-WBGA (8x12.5 mm) | 84-WBGA (8x12.5 mm) - same | 84-WBGA (8x12.5 mm) - same | 84-WBGA (8x12.5 mm) - same | 84-WBGA (8x12.5 mm) - same | 84-WBGA (8x12.5 mm) - same |
| Density | 512 Mbit (64 MB) | 512 Mbit (64 MB) | 512 Mbit (64 MB) | 512 Mbit (64 MB) | 512 Mbit (64 MB) | 512 Mbit (64 MB) |
| Organization | 32M x 16 | 32M x 16 | 32M x 16 | 32M x 16 | 32M x 16 | 32M x 16 |
| Data Rate | DDR2-800 (800 MT/s) | DDR2-800 (800 MT/s) | DDR2-800 (800 MT/s) | DDR2-800 (800 MT/s) | DDR2-800 (800 MT/s) | DDR2-800 (800 MT/s) |
| Supply Voltage | 1.7-1.9 V (1.8 V typ.) | 1.7-1.9 V (1.8 V typ.) | 1.7-1.9 V (1.8 V typ.) | 1.7-1.9 V (1.8 V typ.) | 1.7-1.9 V (1.8 V typ.) | 1.7-1.9 V (1.8 V typ.) |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to 85 C (industrial) |
| Delivery Form | Tape & Reel | Tray | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Tape-and-reel packaging for high-volume pick-and-place (vs W9751G6KB-25 (tray))
- Cross-brand second-source flexibility (vs MT47H64M16HR-25 (Micron))
- Lower unit price than incumbent DDR2 sources (vs K4T51163QR-BID25 (Samsung))
Design Notes
Use the JEDEC DDR2 fly-by topology: route command, address, control, and clock signals in a daisy-chain from the controller to the DRAM with VTT termination at the far end. Route DQ/DQS in matched-length groups (DQS as the length reference, +/-50 mil tolerance) and keep VREF (0.9 V) isolated from noisy digital returns. Place one 100 nF X7R plus one 4.7 uF bulk capacitor per VDD/VDDQ pair within 200 mil of the BGA balls.
DDR2 SDRAM self-refresh current rises with temperature; design the bulk-capacitor network to support the inrush of self-refresh exit. Estimated: at 85 C, self-refresh current is approximately 4-6 mA per device, so add a 47 uF tantalum or polymer cap on VDD to absorb the bank-activation surge when the DRAM transitions from self-refresh to active mode. Maintain junction temperature below 95 C for commercial-grade parts.
Enable on-die termination (ODT) on the W9751G6KB-25-TR to suppress reflections on the data/strobe group; recommended nominal ODT setting is 75 ohm with VDDQ = 1.8 V. For two-rank DIMM-style topologies, configure ODT dynamically (50 ohm for read, 75 ohm for write) per the controller's training routine. Always use the controller's DDR2 initialization sequence (MR0-MR3 + EMRS) before enabling ODT.
Do not assume that W9751G6KB-25-TR is industrial-temperature - the standard part is 0-85 C commercial grade. For -40 to 85 C extended-temperature operation, request an industrial-temp variant from Winbond or substitute the IS43TR16640A-25DTLI (industrial grade). Also, do not exceed the absolute-max VDDQ of 2.0 V or the device can latch up; ensure the 1.8 V regulator has good load-step response to handle burst current.
Compliance Information
RoHS compliant per Winbond product listing. Not AEC-Q100 qualified; commercial grade 0-85 C only. Reach and halogen-free status not stated in retrieved web data.
