XC6SLX45T-3FG484C - 43,661-Cell Spartan-6 LXT FPGA | AMD
MPN: XC6SLX45T-3FG484C ✓ ActiveXC6SLX45T-3FG484C Overview
An FPGA is a programmable semiconductor in the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable I/O, embedded memory, clocking, and digital signal-processing resources. Designers implement and revise hardware behavior through a configuration bitstream rather than changing the integrated-circuit mask.
The XC6SLX45T combines 43,661 logic cells with 296 I/O in the FG484C 484-pin FBGA package. Its -3 designation identifies the device speed grade used in the ordering code. The verified product listings also identify 45 nm CMOS fabrication and a 1.2 V operating supply. These resources make the device suitable for designs requiring parallel interfaces, protocol bridging, embedded control logic, and moderate signal-processing throughput.
The Spartan-6 LXT architecture supports integration of programmable logic with dedicated block RAM and DSP resources. This allows a single FPGA to implement control state machines, packet buffering, waveform generation, filtering, and external interface bridging. The 296 available I/O provide substantial connectivity for parallel buses, memory interfaces, clocks, and control signals, although the exact user-assigned I/O standards must be confirmed against the manufacturer documentation.
Typical applications include industrial automation, embedded instrumentation, communications equipment, video and image processing, motor control, and general-purpose digital signal processing. In each case, the FPGA is configured after power-up and can implement parallel processing or hardware protocols that would otherwise require several discrete logic devices, processors, memories, and interface components.
Design planning must include the correct 484-BBGA footprint, power-plane distribution for the 1.2 V core rail, decoupling, configuration-interface implementation, and thermal analysis. Because the verified excerpts do not provide the complete pin table, pinout file contents, or package dimensions, engineers should download the official Spartan-6 documentation and verify all ball assignments before layout release.
This page combines verified distributor specifications, availability information, and carefully qualified same-brand replacement guidance. It also adds application-focused design considerations, package comparison data, and explicit data gaps so procurement and engineering teams can distinguish documented facts from information that still requires manufacturer-document confirmation.
Drop-in alternatives for XC6SLX45T-3FG484C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX45T-3FG484C (same form factor and footprint) — differing in Device Type.
XC6SLX45T-N3FG484C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45T-3FGG484C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45T-2FGG484C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45T-2FG484C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45T-3FG484C
✅ Drop-InContact for price
View Datasheet →XC6SLX45T-3FG484C Maximum Ratings & Electrical Characteristics
| Device Type | Spartan-6 LXT Field Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 cells |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| I/O Count | 296 I/O |
| Package Pin Count | 484 pins |
| Package Type | 484-BBGA (FG484C) |
| Mounting Type | Surface mount |
| Speed Grade | -3 |
| FPGA Family | Spartan-6 LXT |
| Programmable Logic Type | SRAM-configurable FPGA |
XC6SLX45T-3FG484C 484-bbga (fg484c) Pin Configuration Guide
Pin configuration for XC6SLX45T-3FG484C (484-bbga (fg484c) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX45T-3FG484C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX45T-3FG484C is suitable for 6 applications: Industrial Automation Controllers, Communications Protocol Bridging, Digital Signal Processing, Embedded Instrumentation, Video and Image Processing, Motor and Power Control.
Industrial Automation Controllers
The XC6SLX45T-3FG484C fits industrial automation controllers because its 43,661 logic cells and 296 I/O can consolidate sequencing logic, communication interfaces, and discrete I/O handling in one programmable device. The 45 nm CMOS Spartan-6 LXT device can implement deterministic control pipelines alongside configuration logic and embedded buffering. Its 484-BBGA package also provides a substantial ball array for power distribution and external connectivity. Before layout approval, engineers must confirm bank voltage limits, available I/O standards, configuration requirements, and the exact FG484C ball assignments in AMD's package documentation.
Recommended
Communications Protocol Bridging
XC6SLX45T-3FG484C is well suited to protocol bridging because programmable logic can translate parallel bus formats, buffer data between clock domains, and manage frame-level state concurrently. With 43,661 logic cells and 296 I/O, a design can combine several interfaces instead of relying on separate fixed-function bridge devices. The -3 ordered grade provides a defined timing class within the family, although exact maximum frequencies remain unavailable in the supplied excerpts. Engineers should use AMD timing data and the FG484C pinout files to assign pins, establish clocking, and validate I/O voltage compatibility.
Recommended
Digital Signal Processing
The XC6SLX45T-3FG484C can implement parallel filtering, waveform generation, signal conditioning, and fixed-point processing through configurable logic and dedicated Spartan-6 resources. Its 43,661 logic cells allow a design to combine datapath operations with buffering and control state machines rather than treating signal processing as an isolated function. The 296 I/O provide connectivity for parallel converters, memories, and synchronization signals. Exact DSP-slice count, block-RAM capacity, and maximum operating frequency were not included in the verified excerpts, so the implementation should be scoped against the official Spartan-6 LXT resource tables.
Recommended
Embedded Instrumentation
XC6SLX45T-3FG484C supports embedded instrumentation by combining acquisition control, digital filtering, calibration tables, display interfaces, and communication logic in a single FPGA. The 45 nm CMOS device offers ample configurable logic for parallel sensor conditioning and protocol handling, while the 296 I/O can support converters, clocks, displays, and external buses. The 484-BBGA footprint demands careful power-plane and escape-routing planning, especially when both core and I/O rails are required. Confirm package ball assignments, decoupling, configuration pins, and signal-integrity margins before releasing the PCB layout.
Recommended
Video and Image Processing
The XC6SLX45T-3FG484C can serve as a configurable front end for image pipelines, timing generation, pixel processing, and display-interface conversion. Its 43,661 logic cells allow parallel datapaths and control logic to be implemented in parallel, while the 296 I/O support cameras, converters, memory devices, and display links. The documented -3 speed grade should be evaluated against the required pixel clock and timing margin using official AMD data. Because the supplied excerpts do not identify supported memory interfaces, transceiver capabilities, or complete timing limits, those features must be verified before committing to a specific video architecture.
Recommended
Motor and Power Control
XC6SLX45T-3FG484C can implement deterministic motor-control sequencing, fault capture, sensor decoding, and supervisory logic in parallel with communication tasks. Its 43,661 configurable cells make it suitable for combining multiple control loops and diagnostic functions, while 296 I/O support encoders, current sensing, gate-driver interfaces, and communications. The 1.2 V core supply should be planned alongside separately verified I/O-bank supply requirements. Exact timing, I/O standards, temperature range, and safety certification were not supplied, so safety-critical or high-temperature use requires direct validation against the official documentation.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX45T-3FG484C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX45T-N3FG484C | XC6SLX45T-3FGG484C | XC6SLX45T-2FGG484C | XC6SLX45T-2FG484C |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA (FG484C) | 484-BBGA (FG484C) | 484-BBGA (FG484C) | 484-BBGA (FG484C) | 484-BBGA (FG484C) |
| FPGA Family | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT |
| Ordered Speed Grade | -3 | N3 ordering code | -3 | -2 | -2 |
| Package Pin Count | 484 pins | 484 pins | 484 pins | 484 pins | 484 pins |
Key Differentiators
- Exact -3 grade and FG484C ordering configuration (vs XC6SLX45T-2FG484C)
- Direct FG484C ordering-code match (vs XC6SLX45T-3FGG484C)
- Documented 43,661-cell and 296-I/O Spartan-6 LXT resource profile (vs XC6SLX45T-2FGG484C)
Design Notes
Implement the 484-BBGA footprint using AMD's official FG484C package drawing and pinout file rather than relying on a generic 484-ball library. Confirm every exposed-pad, power, ground, configuration, and user-I/O assignment before routing. For a PCB footprint that does not already match the GGG package code, do not substitute a GGG variant merely because both packages contain 484 balls; package dimensions and ballout compatibility must be proven independently.
Plan a dedicated, low-impedance distribution network for the documented 1.2 V core rail and place the manufacturer-specified decoupling capacitors directly beside the corresponding FBGA power balls. Exact capacitance, allowable ripple, current, I/O-bank voltages, and sequencing requirements are not contained in the supplied excerpts, so obtain those values from the official datasheet before defining the power tree. Verify thermal and current margins for the complete board configuration.
Preserve short return paths for every supply and ground connection by using adjacent or vertically connected power and ground planes where the package design permits. Avoid routing sensitive clocks and high-speed interfaces beneath noisy power regions or across split supply-plane boundaries. Follow AMD's package recommendations for decoupling, unused I/O, configuration pins, and thermal-via placement; these details are package- and bank-specific and should not be inferred from another 484-BBGA device.
Do not treat a shared 484-pin count as proof of a drop-in match. The alternative ordering codes differ by speed grade, N3 identifier, or GGG versus FG package designation. Before substituting any candidate, compare the complete AMD ordering guide, package drawings, pinout files, temperature ratings, resource tables, and configuration compatibility. The replacement percentages on this page indicate search-result proximity, not a substitute for manufacturer qualification.
Compliance Information
The supplied verified excerpts do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than being inferred from manufacturer identity or device family.
