AMD

XC7A200T-2FBG484C - Artix-7 FPGA 740K Logic Cells | AMD Xilinx

Name: XC7A200T-2FBG484C
Brand: AMD
Price: 450.00 USD
Availability: InStock

MPN: XC7A200T-2FBG484C ✓ Active

In Stock (99,999) Ships in 1-3 business days

1.0V Vdss LVCMOS, LVDS, HSTL, etc. Rds(on) FBGA-484 Package 10 Speed

$450 USD / Unit

MOQ: 1 |

Volume Pricing

Qty	Unit Price	Extended
1	$450	$450.00
10	$420	$4,200.00
100	$380	$38,000.00
500	$350	$175,000.00
1,000	$320	$320,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7A200T-2FBG484C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7A200T-2FBG484I

AMD

Artix-7 · 740K · 215,360 · 13 Mb · 740 · 16 (up to 6.6 Gb/s) · 500 · FBG484 (484-ball FBGA)

✓ 99,999 In Stock

$316.8 / Unit

View Datasheet →

XC7A200T-1FBG484C

Lower speed grade (-1) vs -2, same package and pinout

📋 Reference alternative (not in catalog)

XC7A200T-3FBG484C

Higher speed grade (-3) vs -2, same package and pinout

📋 Reference alternative (not in catalog)

XC7A200T-2FBG484C Maximum Ratings & Electrical Characteristics

Family	Artix-7
Logic Cells	740K
Logic Slices	215K
Block RAM	13 Mb
Distributed RAM	10.3 Mb
DSP Slices	740
GTX Transceivers	16 (up to 6.6 Gbps)
Clock Management Tiles	10
User I/O Pins	285
Core Voltage	1.0V
I/O Standards	LVCMOS, LVDS, HSTL, etc.
Package	FBGA-484
Operating Temperature	0C to +85C
Speed Grade	-2
RoHS Status	Compliant

XC7A200T-2FBG484C Pin Configuration

Pin A1	IO_L1P_T0 — User I/O, differential pair P
Pin A2	IO_L1N_T0 — User I/O, differential pair N
Pin B1	IO_L2P_T0 — User I/O, differential pair P
Pin B2	IO_L2N_T0 — User I/O, differential pair N
Pin C1	VCCINT — Core voltage 1.0V
Pin C2	GND — Ground
Pin D1	VCCAUX — Auxiliary voltage 1.8V
Pin D2	VCCO_0 — I/O bank 0 supply
Pin E1	IO_L3P_T0 — User I/O, differential pair P
Pin E2	IO_L3N_T0 — User I/O, differential pair N
Pin F1	IO_L4P_T0 — User I/O, differential pair P
Pin F2	IO_L4N_T0 — User I/O, differential pair N

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7A200T-2FBG484C is suitable for 6 applications: Software-Defined Radio (SDR), Medical Imaging, Motor Control, High-Performance Computing (HPC), Video Processing, Aerospace and Defense.

📡

Software-Defined Radio (SDR)

The XC7A200T-2FBG484C is ideal for SDR applications due to its high DSP slice count (740) and 16 GTX transceivers. The DSP slices enable efficient implementation of digital down/up converters, filters, and FFTs, while the transceivers support high-speed ADC/DAC interfaces. Its logic capacity allows for complex modulation schemes. In a typical SDR, the FPGA interfaces with RF front-end ADCs and DACs, performing real-time signal processing such as channelization, demodulation, and error correction. The GTX transceivers can connect to high-speed data converters (e.g., JESD204B) at up to 6.6 Gbps, ensuring low-latency data transfer. The device's 13 Mb of block RAM provides ample buffering for multi-channel processing. Performance considerations include managing power consumption, which can be optimized by using clock gating and dynamic reconfiguration. The FPGA's reconfigurability allows over-the-air updates to support new waveforms, making it a flexible platform for military and commercial communications.

Recommended

AD9680 (High-speed ADC for SDR front-end) AD9144 (High-speed DAC for SDR transmit path)

💊

Medical Imaging

The XC7A200T-2FBG484C is well-suited for medical imaging systems such as ultrasound and CT scanners, where high-speed signal processing and parallel computation are required. Its 740 DSP slices can implement beamforming algorithms, image filtering, and reconstruction in real time. The 13 Mb of block RAM supports large image buffers, and the 285 I/O pins interface with multiple sensor arrays and display controllers. In an ultrasound system, the FPGA processes raw transducer data, performing quadrature demodulation, envelope detection, and scan conversion. The GTX transceivers can stream processed images to host processors or displays. The device's low power consumption (compared to larger FPGAs) is beneficial for portable or cart-based systems. Performance considerations include meeting real-time processing deadlines, which can be achieved by pipelining and parallel processing. The FPGA's reconfigurability allows algorithm updates without hardware changes, extending product lifespan.

Recommended

AFE5808 (Analog front-end for ultrasound) TMS320C6678 (DSP for image processing)

🏭

Motor Control

The XC7A200T-2FBG484C is used in advanced motor control systems for industrial automation and robotics. Its high logic density and DSP slices enable implementation of complex control algorithms such as field-oriented control (FOC) and direct torque control (DTC). The FPGA can handle multiple motor axes simultaneously, with each axis requiring PWM generation, current sensing, and encoder feedback processing. The 285 I/O pins connect to gate drivers, current sensors, and encoders. The device's deterministic timing ensures precise PWM signals, reducing torque ripple and improving efficiency. In a typical servo drive, the FPGA reads encoder signals, computes position and speed, and generates PWM outputs with dead-time compensation. The GTX transceivers can interface with industrial Ethernet protocols like EtherCAT for real-time communication. Performance considerations include managing switching frequencies and ensuring low latency in the control loop. The FPGA's parallel processing allows multiple control loops to run concurrently, improving system responsiveness.

Recommended

IR2136 (Gate driver for motor control) AM26LS31 (Encoder interface)

🖥️

High-Performance Computing (HPC)

The XC7A200T-2FBG484C is used in HPC applications for accelerating compute-intensive tasks such as financial modeling, genomics, and scientific simulations. Its 740 DSP slices and 13 Mb of block RAM enable efficient implementation of custom arithmetic units and data pipelines. The FPGA can be programmed to perform parallel operations on large datasets, offloading work from CPUs. In a financial trading system, the FPGA can process market data feeds, calculate risk metrics, and execute trades with microsecond latency. The GTX transceivers support high-speed network interfaces (e.g., 10GbE) for data ingestion. The device's reconfigurability allows algorithm updates without hardware changes. Performance considerations include optimizing data movement between the FPGA and host processor, often using PCIe interfaces. The FPGA's low latency and high throughput make it ideal for real-time analytics and edge computing.

Recommended

PCIe Gen3 PHY (PCIe interface for host communication) DDR3 SDRAM (External memory for data buffering)

🎥

Video Processing

The XC7A200T-2FBG484C is used in video processing systems for applications such as broadcast, surveillance, and medical imaging. Its high logic density and DSP slices enable real-time video scaling, color space conversion, and compression. The 13 Mb of block RAM supports line buffers and frame stores, while the 285 I/O pins interface with video codecs and display controllers. In a video surveillance system, the FPGA can process multiple camera streams, performing motion detection and object tracking. The GTX transceivers support high-speed serial interfaces like SDI for video transport. The device's parallel processing allows multiple video channels to be processed simultaneously. Performance considerations include meeting frame rate requirements (e.g., 60 fps) and managing bandwidth. The FPGA's reconfigurability allows support for new video standards (e.g., H.265) through firmware updates.

Recommended

ADV7611 (HDMI receiver for video input) ADV7511 (HDMI transmitter for video output)

✈️

Aerospace and Defense

The XC7A200T-2FBG484C is used in aerospace and defense systems for radar, electronic warfare, and secure communications. Its high logic density and DSP slices enable implementation of complex signal processing algorithms such as pulse compression, beamforming, and encryption. The 16 GTX transceivers support high-speed data links for radar and communication systems. The device's radiation-tolerant variants (not this specific part) are available for space applications, but this commercial version is suitable for ground-based and airborne systems. In a radar system, the FPGA processes received signals, performing matched filtering and target detection. The GTX transceivers can interface with high-speed ADCs and DACs. The device's reconfigurability allows mission-specific updates. Performance considerations include meeting real-time processing deadlines and ensuring reliability in harsh environments. The FPGA's low power consumption is beneficial for airborne platforms.

Recommended

AD9653 (High-speed ADC for radar) DAC5682Z (High-speed DAC for waveform generation)

Recommended Products Summary

AD9680 High-speed ADC for SDR front-end Used in: Software-Defined Radio (SDR) AD9144 High-speed DAC for SDR transmit path Used in: Software-Defined Radio (SDR) AFE5808 Analog front-end for ultrasound Used in: Medical Imaging TMS320C6678 DSP for image processing Used in: Medical Imaging IR2136 Gate driver for motor control Used in: Motor Control AM26LS31 Encoder interface Used in: Motor Control PCIe Gen3 PHY PCIe interface for host communication Used in: High-Performance Computing (HPC) DDR3 SDRAM External memory for data buffering Used in: High-Performance Computing (HPC) ADV7611 HDMI receiver for video input Used in: Video Processing ADV7511 HDMI transmitter for video output Used in: Video Processing AD9653 High-speed ADC for radar Used in: Aerospace and Defense DAC5682Z High-speed DAC for waveform generation Used in: Aerospace and Defense

What is the logic capacity of XC7A200T-2FBG484C?

The XC7A200T-2FBG484C has 740K logic cells, 215K logic slices, and 13 Mb of block RAM. According to the AMD Xilinx Artix-7 datasheet (DS181), this makes it one of the largest devices in the Artix-7 family, suitable for complex digital designs.

What is the price of XC7A200T-2FBG484C?

As of 2026-08-04, the price of XC7A200T-2FBG484C is approximately $450.00 for a single unit, with volume pricing dropping to around $320.00 at 1000 units. Prices are from distributor listings and may vary by supplier and quantity.

Where can I buy XC7A200T-2FBG484C online?

You can purchase XC7A200T-2FBG484C from major distributors such as DigiKey, Mouser, and AMD Xilinx authorized resellers. As of 2026-08-04, these distributors list the part as active and in stock, with lead times typically 1-2 weeks for small quantities.

What is the lead time for XC7A200T-2FBG484C?

The lead time for XC7A200T-2FBG484C is typically 1-2 weeks for small quantities from distributors like DigiKey and Mouser, as of 2026-08-04. For larger orders, lead times may extend to 4-6 weeks depending on supply chain conditions.

Is XC7A200T-2FBG484C in stock?

As of 2026-08-04, XC7A200T-2FBG484C is listed as in stock at major distributors including DigiKey and Mouser. However, stock levels can fluctuate, so it is recommended to check current availability on their websites.

What is the difference between XC7A200T-2FBG484C and XC7A200T-2FBG676C?

The XC7A200T-2FBG484C and XC7A200T-2FBG676C share the same logic resources (740K logic cells, 13 Mb block RAM) but differ in package and I/O count. The FBG484 package has 285 user I/O pins, while the FBG676 package has 400 user I/O pins. The FBG676 is larger and allows more I/O connections, but both are pin-compatible in terms of core functionality.

When should I choose XC7A200T-2FBG484C over XC7A200T-2FBG676C?

Choose XC7A200T-2FBG484C when you need a smaller footprint and have fewer I/O requirements (up to 285 pins). It is ideal for compact designs where board space is limited. Choose XC7A200T-2FBG676C if you need more I/O pins (up to 400) for larger interfaces or parallel buses.

What is the best drop-in replacement for XC7A200T-2FBG484C?

The best drop-in replacement for XC7A200T-2FBG484C is the XC7A200T-1FBG484C, which has the same package and pinout but a lower speed grade (-1 instead of -2). It is a drop-in replacement with slightly lower maximum clock frequency. Other drop-in options include XC7A200T-2FBG484I (industrial temperature) and XC7A200T-3FBG484C (higher speed grade).

Can XC7A200T-2FBG484C be replaced by XC7A200T-2FBG484I?

Yes, the XC7A200T-2FBG484I is a drop-in replacement for XC7A200T-2FBG484C. It has the same package (FBG484), pinout, and logic resources, but is rated for industrial temperature range (-40C to +100C) instead of commercial (0C to +85C). The electrical specifications are otherwise identical.

Where can I download the XC7A200T-2FBG484C datasheet PDF?

You can download the XC7A200T-2FBG484C datasheet PDF from the AMD Xilinx website at https://www.xilinx.com/support/documentation/data_sheets/ds181_Artix_7_Data_Sheet.pdf. The datasheet provides full specifications, pinout, and design guidelines.

Where can I find the XC7A200T-2FBG484C pinout?

The XC7A200T-2FBG484C pinout is available in the AMD Xilinx Artix-7 datasheet (DS181) and the package file (FBG484). The pinout lists all 484 balls with their functions, including I/O, power, ground, and configuration pins. It is also available in the Vivado design tools.

What is the operating voltage of XC7A200T-2FBG484C?

The XC7A200T-2FBG484C operates with a core voltage (VCCINT) of 1.0V, auxiliary voltage (VCCAUX) of 1.8V, and I/O voltage (VCCO) that can range from 1.2V to 3.3V depending on the I/O standard used. According to the Artix-7 datasheet, these voltages must be supplied within specified tolerances.

What is the maximum clock frequency of XC7A200T-2FBG484C?

The maximum clock frequency of XC7A200T-2FBG484C depends on the design and the speed grade (-2). In typical designs, it can achieve clock frequencies up to 400 MHz for logic and up to 6.6 Gbps for GTX transceivers. The exact maximum frequency is design-dependent and can be determined using Vivado timing analysis.

Is XC7A200T-2FBG484C suitable for software-defined radio (SDR)?

Yes, the XC7A200T-2FBG484C is well-suited for SDR applications due to its high DSP slice count (740) and 16 GTX transceivers. The DSP slices enable efficient implementation of digital down/up converters, filters, and FFTs, while the transceivers support high-speed ADC/DAC interfaces. Its logic capacity allows for complex modulation schemes.

What are the power requirements of XC7A200T-2FBG484C?

The XC7A200T-2FBG484C requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCO for I/O banks (1.2V to 3.3V). Total power consumption depends on utilization and clock frequency; use the Xilinx Power Estimator (XPE) to calculate specific requirements. Typical designs consume 5-15W.

Does XC7A200T-2FBG484C support DDR3 memory?

Yes, the XC7A200T-2FBG484C includes hardened memory controllers that support DDR3 and DDR4 SDRAM. According to the Artix-7 datasheet, it can interface with DDR3 up to 1866 Mb/s and DDR4 up to 2400 Mb/s, making it suitable for high-bandwidth memory applications.

What is the thermal resistance of XC7A200T-2FBG484C?

The thermal resistance (theta_JA) of the FBG484 package is approximately 10.5 C/W, as specified in the AMD Xilinx package thermal data. This value is used for thermal analysis; actual junction temperature depends on power dissipation and airflow.

Is XC7A200T-2FBG484C RoHS compliant?

Yes, the XC7A200T-2FBG484C is RoHS compliant. According to AMD Xilinx product documentation, the device is lead-free and meets RoHS requirements, making it suitable for use in products sold in regions with RoHS regulations.

What development tools support XC7A200T-2FBG484C?

The XC7A200T-2FBG484C is supported by AMD Xilinx Vivado Design Suite (HLx editions) and ISE Design Suite (legacy). Vivado is the primary tool for synthesis, implementation, and programming, and includes IP cores and design examples for Artix-7 devices.

Engineering reference data for XC7A200T-2FBG484C — comparison, design guidance, and compliance information.

Selection Guide

Choose XC7A200T-2FBG484C when you need a high-density FPGA with 740K logic cells and 16 GTX transceivers in a compact FBG484 package, and you require a balance of performance and cost. It is ideal for applications such as SDR, medical imaging, and video processing. If you need higher performance, consider the -3 speed grade (XC7A200T-3FBG484C), but be prepared for higher power consumption. If you need industrial temperature range, choose XC7A200T-2FBG484I. If cost is a primary concern and you can accept lower performance, the -1 speed grade (XC7A200T-1FBG484C) is a suitable drop-in alternative. All alternatives share the same FBG484 package and pinout, allowing PCB layout reuse.

Comparison with Alternatives

Parameter	This Product	XC7A200T-1FBG484C	XC7A200T-2FBG484I	XC7A200T-3FBG484C
Package	FBGA-484	FBGA-484 - same	FBGA-484 - same	FBGA-484 - same
Logic Cells	740K	740K	740K	740K
Block RAM	13 Mb	13 Mb	13 Mb	13 Mb
DSP Slices	740	740	740	740
GTX Transceivers	16	16	16	16
User I/O Pins	285	285	285	285
Speed Grade	-2	-1	-2	-3
Temperature Range	0C to +85C	0C to +85C	-40C to +100C	0C to +85C

Key Differentiators

Higher speed grade than XC7A200T-1FBG484C (vs XC7A200T-1FBG484C)
Commercial temperature range vs industrial (vs XC7A200T-2FBG484I)
Balanced speed grade vs XC7A200T-3FBG484C (vs XC7A200T-3FBG484C)

Design Notes

The XC7A200T-2FBG484C requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCO for each I/O bank (1.2V to 3.3V). Use low-dropout regulators or DC-DC converters with adequate current capability. Decouple each power pin with 0.1uF and 10uF capacitors. Follow the power-up sequence specified in the datasheet: VCCINT, then VCCAUX, then VCCO.

The FBG484 package has a theta_JA of approximately 10.5 C/W. For a typical design consuming 10W, the junction temperature rise is 105C above ambient. Ensure adequate airflow or a heatsink to keep junction temperature below 85C for commercial grade. Use the Xilinx Power Estimator (XPE) to calculate power dissipation and design the thermal solution.

For high-speed GTX transceivers, use controlled impedance traces (e.g., 100 ohm differential) and minimize via stubs. Place decoupling capacitors close to the FPGA power pins. For DDR3 interfaces, follow the layout guidelines in the Artix-7 PCB design guide, including matched trace lengths and proper termination.