DSPIC33EP64MC504-I/TL
DSPIC33EP64MC504-I/TL - 16-bit DSC, 70 MIPS, 64KB Flash | Microchip
The Microchip Technology DSPIC33EP64MC504-I/TL is a 16-bit digital signal controller (DSC) delivering up to 70 MIPS from its dsPIC33EP core, with 64 KB of program flash memory and a 44-pin VQFN (TL, 9 x 9 mm, 0.90 mm height, exposed pad) package rated for -40C to +85C operation.
A digital signal controller combines the computational architecture of a microcontroller with the math-acceleration hardware of a digital signal processor. In the product hierarchy, the dsPIC33EP family sits between general-purpose 16-bit MCUs (such as the PIC24) and dedicated DSPs, making it a preferred choice for closed-loop control systems that need fast multiply-accumulate operations, deterministic interrupt latency, and rich on-chip peripherals in a single-voltage 3.0 V to 3.6 V device.
Key features of the DSPIC33EP64MC504-I/TL include the 16-bit dsPIC DSC core with DSP engine supporting 70 MIPS operation, 64 KB of self-programmable flash for code storage, connectivity peripherals including CAN, I2C, SPI, UART/USART, IrDA, LINbus, and QEI (quadrature encoder interface), plus a high-speed PWM module targeted at precision motor control. The digchip listing documents 51 general-purpose I/O available in the 44-pin QFNL package and multiple general-purpose timers, including nine 16-bit timers.
Architecturally, the dsPIC33EP core integrates a dedicated DSP multiply-accumulate unit, hardware division support, and zero-overhead looping, which allows control loops such as field-oriented motor control to execute predictably at multi-kHz rates. The enhanced peripherals are tightly coupled to the core so that PWM updates, ADC sampling, and interrupt handling occur with minimal software overhead.
Typical applications include brushless DC and permanent-magnet synchronous motor drives, digital power supplies and PFC stages, and industrial sensing and actuation nodes where the QEI input directly interfaces with rotary encoders. The CAN interface makes the part suitable for automotive-adjacent and industrial fieldbus nodes.
When designing with this device, pay attention to the exposed thermal pad on the VQFN-44 (TL) package: it must be soldered to a ground plane both for mechanical reliability and thermal dissipation, and ICSP programming requires matching PGECx/PGEDx pin pairs.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Cotação
Contato