MPC8360ZUAJDGA
MPC8360ZUAJDGA - PowerQUICC II Pro MPU, 533MHz e300, 740-TBGA | NXP
The NXP MPC8360ZUAJDGA is a PowerQUICC II Pro integrated communications microprocessor based on the Power Architecture e300 core, clocked at 533 MHz in a 740-ball T-BGA (TBGA) package measuring 37.5 mm x 37.5 mm. It integrates a 32-bit CPU core, DDR1/DDR2 memory controller, PCI, 1 GbE, USB, TDM, and ATM interfaces, targeting wired communications infrastructure including routers, DSLAMs, and line cards. The device is built on a 0.13 micron CMOS process and supports multiple voltage rails (1.8 V, 2.5 V, 3.3 V).
A PowerQUICC (pronounced "power-quic") processor is a family of communications microprocessors originating at Motorola Semiconductor (later Freescale, now NXP) that combines a Power Architecture CPU with integrated communications peripherals such as Ethernet MACs, ATM controllers, HDLC, TDM, and PCI. Within the broader taxonomy, the MPC8360 sits as a microprocessor IC -> embedded microprocessor -> communications MPU -> PowerQUICC II Pro family -> semiconductor IC. Its primary role in a system hierarchy is to consolidate CPU plus connectivity into a single SoC, eliminating external protocol-handling ASICs.
Key differentiating features of the MPC8360ZUAJDGA include its 533 MHz e300 core with 32 KB L1 instruction cache and 32 KB L1 data cache, hardware QUICC Engine technology for accelerated communications, integrated DDR1/DDR2 memory controller with ECC support, dual 10/100/1 Gb Ethernet, USB 2.0 host/device, PCI 2.2 bus interface, and TDM/ATM serial interfaces. Operating temperature range spans 0 C to 105 C (TA = -40 C to +125 C for the silicon), making it suitable for thermally managed equipment enclosures.
Architecturally, the MPC8360E family uses a Harvard-style e300 core with separate instruction and data MMUs, a unified internal bus, and a multi-channel QUICC Engine subsystem that offloads protocol processing from the CPU. The 740-TBGA package provides the pin density required for the parallel DDR, PCI, Ethernet GMII, and QUICC Engine serial interfaces, and is paired with a thermal pad for board-mounted heat-spreading.
Typical applications include SME (small-to-medium enterprise) routers, low-end DSLAMs, IP-PBX systems, line cards for multiservice access nodes, and industrial wired backhaul platforms. In these applications, the integrated communications peripherals allow a single MPU plus external PHYs and DSPs to form a complete line card or CPE platform.
When designing with this part, allocate proper thermal dissipation because the 740-TBGA dissipates significant power at 533 MHz; design stack-up for matched-impedance DDR2 traces, 50 ohm controlled-impedance Ethernet, and 100 ohm differential QUICC Engine serdes; and verify DDR2 IBIS models against the chosen DIMM topology.
This page synthesizes distributor stock and lead-time data, drop-in alternative MPNs from the MPC83xx family, and practical PCB/thermal design notes that complement the manufacturer hardware specifications document.
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