MPC8358ZQAGDDA - PowerQUICC II Pro 400MHz CPU | NXP | BGA-668
N.º da peça: MPC8358ZQAGDDA ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $45 | $45,00 |
| 10 | $42 | $420,00 |
| 100 | $38.5 | $3.850,00 |
| 500 | $35 | $17.500,00 |
| 1.000 | $32 | $32.000,00 |
MPC8358ZQAGDDA Visão geral
A PowerQUICC processor is a system-on-chip that combines a PowerPC CPU with communications peripherals and a hardware acceleration engine; the PowerQUICC II Pro family (an MPC83xx derivative of the original PowerQUICC II) targets mid-range wired networking where the device must terminate DDR memory, perform DMA on packet data, and present industry-standard I/O such as PCI, USB, Ethernet MACs, TDM, and ATM interfaces on a single die.
Key features include the e300 core with MMU and hardware cache coherency, an integrated DDR1/DDR2 memory controller with ECC, dual 10/100/1000 Ethernet MACs (one RGMII plus one GMII), a 32-bit PCI interface (up to 66MHz), USB 2.0 full-speed PHY, and multi-channel TDM/ATM glue for legacy telecom interconnects. The QUICC Engine datapath offers hardware acceleration for PPP, HDLC, ATM AAL, Ethernet bridging, and policing; this lets an OEM run multi-megabit aggregate traffic at line rate without consuming CPU cycles.
The architecture pairs the e300 core with the QUICC Engine block, which executes time-critical protocol processing in dedicated microcode. The 400MHz core supplies the control plane for routing tables, management plane tasks, and QoS queuing while the QUICC Engine manages the data plane. The 668-PBGA-PGE package provides a thermal pad tied to a copper pour for heat removal, but typical router designs of this era dissipate only a few watts, allowing passive cooling.
Typical applications include small-to-medium enterprise routers, business gateways, xDSL IADs, SOHO security appliances, and Industrial Ethernet bridges. Pin-to-pin compatible part variants such as MPC8358EVRAGDDA and MPC8358CVRAGDDA target different operating envelopes or feature sets within the same board layout.
When designing with this device, allocate adequate copper area under the exposed pad and follow the NXP application note for DDR2 termination to meet SI margins; reference the MPC8360E reference board where possible to shorten design cycles and reuse the QUICC Engine firmware framework.
This page consolidates distributor pricing (as of 2026-10-17), MPC83xx family alternative candidates, and design notes that go beyond the manufacturer datasheet summary to support procurement and board-level decisions.
Alternativas drop-in para MPC8358ZQAGDDA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC8358ZQAGDDA (mesmo formato e footprint) — diferindo em Operating Temperature, Mounting Type, RoHS Status, Core Architecture, Ethernet.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC8358EVRAGDDA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8358CVRAGDDA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8358VRAGDDA
✅ Drop-In✓ Em estoque
$47.85 / unidade
Ver ficha técnica →MPC8358EZUAGDDA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8360EZUAGDDA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8309CVMAGDCA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC8358ZQAGDDA Classificações máximas e características elétricas
| Processor Type | PowerPC e300 Microprocessor IC (PowerQUICC II Pro) |
| Series | MPC83xx |
| Core Architecture | PowerPC, 32-bit |
| Core Count | 1 |
| Core Speed | 400 MHz |
| Supply Voltage (Core) | 1.2 V |
| Memory Controller | DDR1 / DDR2 with ECC |
| Ethernet | 1 Gbit/s (RGMII/GMII) |
| PCI | 32-bit, up to 66 MHz |
| USB | USB 2.0 full-speed PHY |
| TDM / ATM | Multi-channel TDM / ATM glue |
| Temperatura de operação | 0C to +105C |
| Encapsulamento | 668-BGA (PBGA-PGE) 29x29 mm with exposed pad |
| Tipo de montagem | Surface Mount |
| Lead Free Status | Lead Free |
| Status RoHS | Compliant |
| Packaging | Tray |
Guia de Configuração de Pinos do MPC8358ZQAGDDA 668-bga (pbga-pge) 29x29 mm with exposed pad
Configuração de pinos para MPC8358ZQAGDDA (pacote 668-bga (pbga-pge) 29x29 mm with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC8358ZQAGDDA.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC8358ZQAGDDA é adequado para 6 aplicaçãos: Small-to-Medium Enterprise Router, Business Gateway / xDSL IAD, Industrial Ethernet Bridge, SOHO Security Appliance, Wireless Access Point Controller, Voice-over-IP Gateway.
Small-to-Medium Enterprise Router
The MPC8358ZQAGDDA is the canonical silicon for an SME router: the 400 MHz e300 core provides enough CPU power for routing-table lookup, NAT, QoS classification and management-plane tasks while the QUICC Engine executes PPP, HDLC and Ethernet bridging in microcode. An OEM can terminate up to 1 Gbit/s RGMII plus legacy TDM/ATM uplinks on a single device, which removes an external co-processor and shrinks the BOM. Typical reference designs from NXP show this part behind a 4-port GbE switch ASIC with DDR2-667 SODIMM sockets for routing tables.
Recomendado
Business Gateway / xDSL IAD
For an integrated access device, the MPC8358ZQAGDDA mixes DSL channel data, gigabit Ethernet and VoIP TDM streams on a single SoC. The DDR1/DDR2 controller feeds both the line-side packet buffers and the VoIP DSP ring buffers, while the PCI 66 MHz bus drives a VDSL PHY or HPNA transceiver. The 0C to 105C envelope covers sealed indoor enclosures without derating; total power dissipation is around 3 to 5 W when both MACs are active.
Recomendado
Industrial Ethernet Bridge
An Industrial Ethernet bridge uses the MPC8358ZQAGDDA to forward Profinet, EtherNet/IP or Modbus TCP traffic between ring segments and an uplink. The QUICC Engine takes care of broadcast storm suppression and IEEE 1588 timestamping in firmware microcode, which simplifies the e300 control plane. The USB 2.0 full-speed PHY can drive a diagnostics channel or host a configuration flash; PCI can connect a real-time Ethernet ASIC for sub-millisecond latency.
Recomendado
SOHO Security Appliance
The MPC8358ZQAGDDA serves as the CPU for a low-cost firewall/UTM at SME scale; the QUICC Engine handles stateful packet inspection and most SPI logic at line rate for sub-gigabit links. The non-E variant omits the hardware crypto accelerator, so IPSec is run in software; if IPSec at >100 Mbit/s is mandatory, the E suffix variant (MPC8358EVRAGDDA) is the in-package upgrade. Booting from NAND flash over the local bus keeps the bill of materials small.
Recomendado
Wireless Access Point Controller
In a managed 802.11n AP, the MPC8358ZQAGDDA sits on the wired side, aggregating frames from multiple radios (typically connected over mini-PCIe) before delivering them to the core network. The e300 core handles association tables, WPA2-Enterprise RADIUS forwarding, and 802.1X authentication, while the QUICC Engine accelerates CAPWAP fragmentation on the uplink. DDR2 ECC is useful for long-term reliability against bit-flips in 24/7 deployments.
Recomendado
Voice-over-IP Gateway
An SMB VoIP gateway uses the MPC8358ZQAGDDA to bridge T1/E1 TDM trunks and the SIP signalling channel. Multi-channel TDM glue is wired directly to codec/SLIC devices for FXS and FXO ports, while the Ethernet MACs carry SIP traffic and RTP streams. The QUICC Engine accelerates RTP payload handling and silence-suppression, which keeps the e300 core free for SIP state machines; the PCI bus drives a HDLC controller for legacy signalling.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC8358ZQAGDDA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC8358EVRAGDDA | MPC8358CVRAGDDA | MPC8358VRAGDDA | MPC8358EZUAGDDA | MPC8360EZUAGDDA | MPC8309CVMAGDCA |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 668-BGA (PBGA-PGE) 29x29 | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) 29x29 - same | 668-BGA (PBGA-PGE) - same |
| Core Architecture | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Security Engine | No | Yes | No | No | Yes | Yes | No |
| DDR Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| RoHS / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free | Compliant / Lead Free |
Principais diferenciais
- Drop-in compatible across the MPC8358 family in the same 668-BGA package (vs MPC8358EVRAGDDA)
- Common NXP ecosystem with broader 668-BGA compatibility for upgrades (vs MPC8360EZUAGDDA)
- Integrated QUICC Engine for hardware protocol offload (vs MPC8309CVMAGDCA)
Notas de projeto
The 668-BGA exposed pad (PBGA-PGE) must be soldered to a continuous copper pour that occupies at least 25 percent of the bottom layer, with thermal vias on a 1.2 mm pitch grid to the internal ground plane. A poorly soldered thermal pad can push junction temperature above the 105 C limit during sustained gigabit traffic; on prototype boards, verify with a thermal probe on the top of the package before sealing the enclosure.
DDR2 traces should be length-matched within 25 mils per byte lane, with series-termination resistors and 60 ohm on-die termination enabled. Place a 100 nF decoupling cap adjacent to every power pin and a 1 to 4.7 uF bulk cap per supply rail; failure to meet the DDR2 SI budget is the single most common cause of intermittent boot in MPC8358ZQAGDDA designs.
Do not assume pin-compatible MPC8358 siblings share the same default firmware. The non-E variant omits the security engine; firmware that enables crypto offload at boot will hang or silently fail on MPC8358ZQAGDDA. Always gate the crypto initialization code on a feature bit read from the SVR register before issuing SEC commands.
Maintain 5x5 ball-to-ball keepout under the BGA (no vias, no traces) and use microvia stack-ups to fan out signals to inner layers. Use laser-drilled blind vias or staggered microvia in-pad to escape the 1.0 mm pitch BGA in a 4-1-4 PCB stack-up without violating the escape density.
Informações de conformidade
RoHS compliance and lead-free status confirmed per distributor listings (DigiKey). REACH, halogen-free, and conflict-minerals statements were not present in the verified web data and are marked unknown - request the latest NXP material declaration for confirmation.
