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MPC8572ECVTAULE557 - PowerQUICC III 2-Core 1.333GHz SoC | NXP
MPC8572ECVTAULE557

MPC8572ECVTAULE557 - PowerQUICC III 2-Core 1.333GHz SoC | NXP

The NXP MPC8572ECVTAULE557 is a PowerQUICC III integrated communications processor in the MPC85xx family, featuring dual PowerPC e500 cores running at up to 1.333 GHz, packaged in a 1023-ball FCBGA (33x33 mm) with 32-bit datapath architecture. This Power Architecture SoC integrates DDR2/DDR3 memory controllers, PCIe, Gigabit Ethernet, Serial RapidIO (SRIO), and an integrated security engine (SEC) targeting wired and wireless infrastructure equipment. A PowerQUICC III SoC is a multi-core communications processor designed by NXP (formerly Freescale) that integrates CPU cores, memory controllers, high-speed serial interfaces, and security accelerators on a single die. It sits within the broader hierarchy of communications processors -> embedded processors -> microprocessors -> integrated circuits, and is engineered to handle data-plane and control-plane workloads in routers, switches, and base stations. Key features include dual e500 cores at 1.333 GHz, integrated DDR2/DDR3 memory controller with ECC, multiple Gigabit Ethernet MACs, multiple PCIe lanes, Serial RapidIO ports, and a hardware security engine. The device supports industrial extended temperature range and is qualified for embedded networking applications requiring deterministic performance. The MPC8572E leverages a system-on-chip architecture that combines processing, memory subsystem, and I/O in one package, reducing BOM and PCB area versus discrete designs. The on-chip SEC engine offloads cryptography, while the dedicated SRIO and PCIe interfaces provide non-blocking interconnect for backplanes and accelerators. Typical applications include multiservice routers, wireless base stations, LTE eNodeB, industrial gateways, and secure networking appliances. The combination of dual cores and high-bandwidth I/O enables line-rate processing at the network edge. When designing with this part, ensure the FCBGA substrate supports the 1.1 V core and 1.5/1.8 V DDR rails with proper decoupling, and that the board-level thermal design accounts for the 33x33 mm FCBGA thermal envelope at full CPU load. This page synthesizes distributor pricing, drop-in alternative options, and practical design notes not found in the manufacturer datasheet alone, enabling sourcing and second-source decisions for communications OEMs.

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MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP
MPC8572ECVTAVNE

MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

The NXP (formerly Freescale) MPC8572ECVTAVNE is a dual-core PowerPC e500 microprocessor from the MPC85xx PowerQUICC III family, operating at up to 1.5 GHz with a 32-bit RISC core architecture fabricated in a 0.09 um CMOS process. Housed in a 1023-ball FCBGA (33x33 mm) package, it integrates two e500 cores, high-bandwidth memory interfaces, multiple Gigabit Ethernet controllers, PCI Express, RapidIO, and security acceleration, targeting networking and telecom infrastructure. Core voltage is 1.1 V with I/O rails at 1.8 V/2.5 V/3.3 V. What is a PowerQUICC III communications processor? A PowerQUICC III is a high-integration system-on-chip (SoC) that combines one or more PowerPC processor cores with specialized communications peripherals (Ethernet MACs, PCI Express, security engines). It sits in the broader taxonomy of embedded microprocessors -> MPU -> application processor -> SoC -> networking SoC, and is widely deployed in routers, switches, base stations, and storage platforms where deterministic packet processing is required. Key features of the MPC8572E include dual e500 cores with MMU and double-precision FPU support, integrated DDR2/DDR3 memory controller with ECC, four 10/100/1000 Mbit Ethernet MACs, two PCI Express interfaces, dual Serial RapidIO endpoints, and an integrated security engine (SEC 4.0) for IPSec, SSL/TLS, and Kasumi/Snow 3G cipher acceleration. The device also exposes a Local Bus Controller, four I2C, four UART, and GPIO for legacy peripheral integration. Architecturally the device pairs a hierarchical bus structure with the CoreNet platform coherency fabric, allowing the two cores and I/O engines to share memory and peripherals coherently while maintaining deterministic traffic shaping. The 1023-ball FCBGA delivers the high pin density required for the parallel memory and multiplexed I/O buses, and demands a multilayer PCB with controlled-impedance routing and a thermal solution rated for the device's typical power envelope. Typical applications include enterprise routers, multi-service switches, LTE base-station baseband cards, IP-PBX platforms, network-attached storage controllers, and industrial gateways. The integrated security engine makes it well suited for VPN concentrators and SSL offload appliances, while the dual-core architecture supports control-plane plus data-plane partitioning. A primary design consideration is thermal management: at 1.5 GHz with both cores active the device dissipates significant power, requiring thermal vias under the package and a heatsink in most production designs. Power sequencing of the 1.1 V core rail and the 1.8/2.5/3.3 V I/O rails must follow the datasheet order to avoid latch-up. This page synthesizes distributor pricing, drop-in MPC8572 family alternatives, and practical board-design considerations not assembled in the NXP datasheet alone.

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MPC8572ELPXAVND - PowerPC e500 MPU 1.5GHz Dual-Core | NXP
MPC8572ELPXAVND

MPC8572ELPXAVND - PowerPC e500 MPU 1.5GHz Dual-Core | NXP

The NXP (formerly Freescale) MPC8572ELPXAVND is a PowerPC e500-based dual-core microprocessor from the PowerQUICC III family, operating at up to 1.5 GHz core frequency and housed in a 1023-ball FCBGA (33x33 mm) package. Built on a 32-bit RISC architecture with two e500 cores, it integrates 32 KB of instruction cache and 32 KB of data cache per core, a 1 MB L2 cache, and dual DDR2/DDR3 memory controllers, alongside the high-bandwidth Enhanced Local Bus and PCI Express interfaces required for networking line cards. A microprocessor (MPU) is an integrated circuit that contains one or more processor cores, on-chip caches, memory controllers, and a portfolio of I/O peripherals capable of running a full operating system such as Linux or VxWorks. The MPC8572E belongs to the PowerQUICC III hierarchy (MPU -> communications processor -> networking SoC), a lineage designed by Freescale and now NXP for routing, switching, and wireless base-station infrastructure where deterministic packet processing, deep protocol offload, and multi-gigabit I/O are mandatory. Key features of the MPC8572ELPXAVND include the 1.5 GHz dual e500 cores with SMP support, hardware cryptography acceleration, four Gigabit Ethernet MACs plus a 10-Gigabit XAUI interface, integrated DDR2/DDR3 SDRAM controller with ECC, eight SerDes lanes supporting PCI Express and SGMII, and an Enhanced Local Bus Controller (eLBC) for NAND/NOR flash and legacy peripherals. The integrated SEC 4.0 engine accelerates AES, 3DES, SHA, RSA, and elliptic-curve algorithms at line rate. Architecturally, the device combines two independent e500 cores with a coherent shared L2 and a high-bandwidth system bus, allowing full symmetric multiprocessing under Linux. The on-chip RapidIO interconnect, multiple DMA channels, and dedicated queue managers make it well-suited to data-plane accelerators, QoS scheduling, and protocol termination tasks that historically overwhelmed software-only implementations. Typical applications include enterprise and carrier-grade routers, multi-service switches, wireless base-station controllers, network-attached storage (NAS) controllers, and industrial control planes that require multiple Ethernet interfaces plus deterministic real-time behavior. The combination of x86-class I/O bandwidth and PowerPC predictability keeps it relevant in long-lifecycle telecom platforms. When designing with the MPC8572ELPXAVND, allocate a multi-layer PCB with a minimum 6-layer stack-up and follow the NXP hardware specifications document for ball-map escape, core-voltage decoupling, and DDR2/DDR3 fly-by routing; thermal management at 1.5 GHz requires the FCBGA heat-spreader lid to be coupled to a heatsink. This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the PowerQUICC III and QorIQ families, and practical board-design notes beyond the manufacturer hardware specifications document.

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MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
MPC8572ELVTAVND

MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP

The NXP MPC8572ELVTAVND is a PowerPC e500 microprocessor from the PowerQUICC III MPC85xx family, integrating two 32-bit e500 cores at up to 1.5 GHz in a 1023-ball FCBGA (33x33) package. The device is fabricated in a 90 nm CMOS process and operates from 1.8 V, 2.5 V, and 3.3 V supply rails. It combines dual high-performance e500 cores with extensive on-chip peripherals including dual GbE controllers, dual DDR2 memory controllers, integrated security engine, and PCI Express and Serial RapidIO interfaces. A microprocessor (MPU) is an integrated processor that contains the central processing unit, memory management, and peripheral interfaces on a single die. Within the semiconductor taxonomy, an MPU is a sub-class of digital IC, and the PowerQUICC III family specifically targets embedded communications infrastructure where deterministic packet processing and high-speed I/O integration reduce system BOM. The MPC8572E extends this lineage with hardware cryptography and an enhanced double-precision floating-point unit, positioning it for secure networking workloads. Key features of the MPC8572ELVTAVND include dual e500 cores with double-precision FPU, integrated DDR2 memory controllers with ECC, four GbE MACs (SGMII/RGMII), PCI Express x8, Serial RapidIO, two triple-speed Ethernets, hardware-accelerated security (AES, DES, Kasumi), and 32 KB I-cache and 32 KB D-cache per core. The 1023-FCBGA (33x33 mm) package exposes 1023 solder balls and is rated for industrial junction temperatures. The architectural innovation lies in its hierarchical bus fabric (CoreNet platform) that allows coherent cores to share L2 cache (1 MB) and high-bandwidth I/O without contention. The hardware security engine offloads cryptographic workloads at line rate, enabling VPN, IPsec, and SSL inspection without CPU utilization penalty. Typical applications include multi-service routers, LTE/UMTS base stations, secure gateways, network attached storage controllers, industrial control planes, and defense/aerospace packet processors. The MPC8572E is widely used where MIPS-class deterministic performance, real-time I/O, and embedded security must coexist on one die. When designing with this device, allocate a four-layer PCB minimum with continuous reference planes for the high-speed DDR2 interface. Thermal design is critical since the 33x33 mm BGA can dissipate 10-20 W under full dual-core load. Boundary scan via IEEE 1149.1 JTAG is mandatory for production test. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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MPC8572EPXATLD - PowerPC e500 Dual-Core 1.2GHz MPU | NXP
MPC8572EPXATLD

MPC8572EPXATLD - PowerPC e500 Dual-Core 1.2GHz MPU | NXP

The NXP MPC8572EPXATLD is a PowerPC e500 dual-core integrated communications processor from the PowerQUICC III family, featuring two 32-bit e500 cores running at up to 1.2 GHz, housed in a 1023-ball FCBGA (33x33 mm) package. The device integrates two enhanced triple-speed Ethernet controllers (eTSEC), a DDR2/DDR3 SDRAM memory controller, a DUART, and multiple peripheral interfaces optimized for symmetric and asymmetric multiprocessor designs. An integrated communications processor (CP) is a system-on-chip (SoC) that combines a high-performance CPU subsystem with networking, memory, and peripheral controllers on a single die. Within the broader taxonomy, the MPC8572E is a member of the multiprocessor IC class, sitting under the hierarchy microprocessor -> MPU -> embedded processor -> integrated communications processor -> PowerQUICC III. These parts evolved from the original PowerQUICC architecture and target telecom, networking, and storage applications where packet processing, deterministic latency, and rich I/O are required. Key features of the MPC8572EPXATLD include dual e500 cores with 36-bit physical addressing, hardware MMU and FPU support, an integrated security engine (SEC), four DMA channels, and a 64-bit DDR2/DDR3 memory controller with ECC. The 1023-ball FCBGA package dissipates thermal load via a top-side heat-spreader footprint, supporting industrial and extended-temperature operating points. Architecturally, the MPC8572E pairs two PowerPC e500 cores with a high-bandwidth internal CoreNet fabric, allowing coherent SMP operation. The hardware-managed L2 cache, RapidIO messaging unit, and packet-processing accelerators reduce host CPU load in routing and switching line cards. The integrated SEC engine handles DES, 3DES, AES, and public-key acceleration, removing the need for an external crypto coprocessor in many designs. Typical applications for the MPC8572EPXATLD include router/switch line cards, wireless base-station controllers, edge routers, and storage area network (SAN) controllers. It is also deployed in defense and aerospace command/control platforms where PowerQUICC III's deterministic interrupt response is valued. When designing with this device, allocate adequate PCB layers (typically 8+), enforce length-matched DDR2/DDR3 routing, and follow NXP's Hardware Specifications document for power-rail sequencing and decoupling. Designers transitioning from single-core PowerQUICC III parts should review the dual-core coherency model carefully. This page synthesizes distributor pricing, application context, and drop-in alternatives for the MPC8572EPXATLD not consolidated in the manufacturer datasheet, helping engineers evaluate sourcing and design trade-offs in one place.

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MPC8572EPXAULE - PowerQUICC III Dual-Core SoC, 1.33 GHz, FCPBGA-1023 | NXP
MPC8572EPXAULE

MPC8572EPXAULE - PowerQUICC III Dual-Core SoC, 1.33 GHz, FCPBGA-1023 | NXP

The NXP MPC8572EPXAULE is a PowerQUICC III family dual-core communications SoC integrating two PowerPC e500 cores running up to 1.333 GHz, 1 MB of shared L2 cache, DDR2/DDR3 memory controller, PCI Express, Gigabit Ethernet, Serial RapidIO, and a security engine in a 1023-ball FCBGA (FCPBGA-1023, 33x33 mm) package. It is designed to deliver high-throughput symmetric and asymmetric multi-core processing for wired and embedded networking equipment. A communications SoC (System-on-Chip) is a highly integrated processor that combines general-purpose CPU cores, memory controllers, and specialized I/O peripherals on a single die, eliminating the need for a companion northbridge or I/O hub. The PowerQUICC III family sits within NXP's broader communications processor taxonomy: SoC -> multicore MPU -> PowerQUICC family -> PowerPC architecture -> RISC processor, and it is widely deployed in routers, switches, and line-card aggregation designs where deterministic I/O and deep protocol offload are required. Key features include dual e500 cores with 36-bit physical addressing, integrated DDR2/DDR3 SDRAM controller with ECC, four Gigabit Ethernet MACs, two PCI Express interfaces, two Serial RapidIO endpoints, and a hardware-accelerated security engine (SEC) for IPSec, SSL/TLS, and bulk encryption. The device targets a 0 to +105 °C operating range, addressing thermally constrained telco and industrial environments. Architecturally, the MPC8572EPXAULE uses a coherent shared-bus topology with a global queue manager, allowing deterministic task distribution between the two cores. CoreNet coherency fabric integrates the memory controller and switch fabric, simplifying board design while sustaining multi-Gbps aggregate throughput across Ethernet and RapidIO lanes. Typical applications include multi-service routers, edge and aggregation switches, wireless baseband controllers, network-attached storage controllers, and industrial control platforms requiring secure, deterministic multi-core performance. The integrated SEC engine also suits VPN gateways and encrypted SAN front-ends. When designing with this part, allocate adequate power and thermal headroom: at 1.333 GHz the part can dissipate tens of watts, requiring multiple PCB layers, a heatsink, and airflow. Ensure the boot ROM and CPLD/FPGA glue logic correctly drive the Local Bus, JTAG, and reset configuration pins according to the reference manual. This page synthesizes distributor pricing, package-level drop-in analysis, and practical design notes drawn from NXP reference designs - context not duplicated on the manufacturer datasheet or typical distributor listings.

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MPC8572EPXAVND - PowerPC e500 1.5GHz Dual-Core MPU | NXP
MPC8572EPXAVND

MPC8572EPXAVND - PowerPC e500 1.5GHz Dual-Core MPU | NXP

The NXP MPC8572EPXAVND is a PowerQUICC III integrated communications processor featuring a dual-core PowerPC e500 microprocessor running at up to 1.5 GHz, packaged in a 1023-ball FCBGA (33x33 mm). It targets wired and embedded networking applications where deterministic packet processing, integrated security, and multi-gigabit I/O are required. A microprocessor (MPU) is a single-chip CPU central processing unit integrating control unit, ALU, registers, and often caches and peripherals on one die. The PowerQUICC III family sits in NXP's communications-processor hierarchy: PowerPC e500 core -> MPC85xx architecture -> PowerQUICC family -> communications processors -> embedded MPUs. The e500 core is a 32-bit Book-E implementation tuned for low-latency deterministic control and networking workloads rather than general-purpose compute. Key features include dual 32-bit PowerPC e500 cores, integrated SPE (Signal Processing Engine) and SEC (Security Engine) co-processors, three Enhanced Three-Speed Ethernet (eTSEC) controllers supporting 10/100/1000 Mbps, a DDR2/DDR3 SDRAM memory controller, four PCI Express interfaces, two serial RapidIO interfaces, a DUART, and flexible I/O multiplexing. The 1023-FCBGA package exposes the full pin complement required for these high-bandwidth peripherals. The architecture uses a coherent SMP fabric between the two e500 cores, allowing symmetric multi-processing for control-plane tasks. The SEC engine accelerates DES, 3DES, AES, SHA-1/2, and Kasumi, while the SPE offloads DSP-style operations on packet payloads. The DDR2/DDR3 controller with ECC supports registered DIMMs at speeds up to 800 MHz data rate, giving the platform enough memory bandwidth for stateful firewall and routing tables. Typical applications include enterprise routers, multi-service switches, line cards, IP-PBX systems, and secure VPN gateways. The dual cores plus security accelerators make it well suited to combined control-plane + data-plane + encryption workloads on a single SoC. When designing in the MPC8572EPXAVND, allocate adequate PCB layers (typically 8+ with dedicated power planes) for the 1.5 GHz core and DDR memory. Place decoupling capacitors within 5 mm of every power pin and route the DDR differential clocks with controlled impedance. Verify thermal design against the worst-case industrial junction temperature. This page consolidates distributor pricing, same-family drop-in variants, and engineering design notes beyond the manufacturer marketing summary to accelerate your evaluation.

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MPC8572EVTARLD - PowerQUICC III MPU, 1.067 GHz, 1023-FCBGA | NXP
MPC8572EVTARLD

MPC8572EVTARLD - PowerQUICC III MPU, 1.067 GHz, 1023-FCBGA | NXP

The NXP MPC8572EVTARLD is a dual-core PowerPC e500 microprocessor from the PowerQUICC III family, clocked at 1.067 GHz and housed in a 1023-ball FCBGA (33x33 mm) package. It integrates two 32-bit e500 cores with 32 KB L1 instruction cache and 32 KB L1 data cache per core, plus a 1 MB shared L2 cache, making it suitable for high-throughput communications processing. An MPU (Microprocessor Unit) is a system-on-chip processor that integrates one or more CPU cores with memory controllers, I/O peripherals, and on-chip accelerators. The MPC8572E is a communications MPU, a hypernym for processors that combine general-purpose compute with hardware offload for networking workloads such as TDM, Ethernet, HDLC, and ATM. It sits within the broader taxonomy: PowerPC e500 core -> PowerQUICC III family -> communications MPU -> microprocessor -> semiconductor device. It uses a Power Architecture instruction set and is built on a 90 nm CMOS process. Key features include dual e500 cores at 1.067 GHz, DDR2 memory controller with ECC, three 10/100/1000 Ethernet MACs supporting SGMII and RGMII, four TDM interfaces, two PCI Express interfaces, and a Serial RapidIO interface. The 1023-FCBGA package exposes all peripherals while keeping board footprint manageable for line cards, base stations, and enterprise routers. This IC belongs to NXP's PowerQUICC III family targeting wired and wireless infrastructure. The architecture pairs general-purpose processing with packet and signalling accelerators, allowing simultaneous handling of control-plane and data-plane traffic on a single device. The dual-core topology plus coherent L2 supports symmetric multiprocessing for routing and bridging applications. The 0.09 µm process and 1.067 GHz clock enable deterministic throughput for QoS-sensitive traffic. Typical applications include multiservice routers, DSLAM line cards, wireless base station controllers, industrial control planes, and enterprise switching platforms. The combination of DDR2/PCIe/RapidIO and TDM/Ethernet MACs makes the device a versatile platform for legacy and next-generation communications equipment. Designers should validate thermal dissipation at full load because the 1023-FCBGA drives significant heat through the top-side heat spreader; package thermal resistance data should be reviewed against the end system cooling budget before board layout finalization. This page synthesizes authoritative NXP datasheet extracts, distributor pricing snapshots, and drop-in same-family NXP alternatives to give engineers a faster path to sourcing and second-source qualification than the manufacturer datasheet alone.

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MPC8572EVTAULB - PowerPC e500 MPU, 1.333GHz, 1023-FCBGA | NXP
MPC8572EVTAULB

MPC8572EVTAULB - PowerPC e500 MPU, 1.333GHz, 1023-FCBGA | NXP

The NXP Semiconductors (formerly Freescale Semiconductor) MPC8572EVTAULB is a high-performance PowerPC e500-based microprocessor from the MPC8572E device family, integrating 2 cores running at up to 1.333GHz with 32-bit datapath and housed in a 1023-ball FCBGA (33x33 mm) package. Built on a 45nm CMOS process, the device implements dual e500 cores supporting virtualization, hardware memory management, and out-of-order execution for compute-intensive workloads in networking, storage, industrial control, and defense platforms. A microprocessor (MPU) is an integrated circuit that contains one or more central processing units, caches, memory controllers and peripheral I/O in a single silicon die; in embedded systems the MPU is the system master, executing OS kernels, network stacks and protocol processing workloads. The MPC85xx family targets communications infrastructure equipment, where deterministic throughput, packet-processing offload engines, and long product lifecycles are central requirements. Key features include dual PowerPC e500 cores with per-core L1 caches, a shared L2 cache, integrated DDR2/DDR3 memory controller, multiple Gigabit Ethernet controllers, PCI Express interfaces, Serial RapidIO, and an enhanced local bus for glueless ASIC/FPGA interconnect. The part is suited to LTE/4G baseband processing, router/switch control planes, industrial routers, and ruggedized military systems. Designed as a system-on-chip solution, the MPC8572E integrates Power Architecture compute, advanced interrupt handling via MPIC, and a security engine for cryptographic acceleration. Compared to discrete CPU + bridge designs, the SoC approach reduces board complexity and BOM for telecom OEMs. Typical applications include network routers, Layer 2-4 managed switches, base station controllers, networked industrial automation gateways, and long-lifecycle defense/aerospace compute modules. Production deployments often pair the SoC with DDR3 ECC memory and external PHYs. When designing with this device, ensure the FCBGA substrate utilizes a high-Tg PCB with matched-length DDR3 routing; ball attach and rework require profiles compatible with large-array packages. Thermal management should target the maximum junction temperature under worst-case traffic load. This page synthesizes distributor pricing, drop-in alternatives, application block diagrams, and design notes not consolidated in the manufacturer datasheet, accelerating part selection, schematic bring-up, and procurement decisions for power-engineers working on Power Architecture platforms.

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MPC8572EVTAULD - PowerQUICC III 1.333GHz Dual-Core MPU | NXP
MPC8572EVTAULD

MPC8572EVTAULD - PowerQUICC III 1.333GHz Dual-Core MPU | NXP

The NXP (formerly Freescale) MPC8572EVTAULD is a PowerQUICC III integrated communications processor featuring dual PowerPC e500 cores running at up to 1.333 GHz, packaged in a 1023-ball FCBGA (33x33 mm). Built on a 45 nm SOI process, it integrates high-performance CPU cores, memory controllers, networking acceleration, and I/O subsystems for symmetric and asymmetric multi-core communications platforms. The part is offered in the industrial temperature range and is Pb-Free (Rev 2.1 die revision, code PQ38H). What is a PowerQUICC integrated processor? A PowerQUICC (Quad Integrated Communications Controller) is a family of communications-centric microprocessors that originated at Motorola/Freescale (now NXP) and combine a PowerPC processor core with specialized communications engines. The MPC8572E specifically sits in the PowerQUICC III generation, which extended the architecture to dual e500 cores with hardware-accelerated pattern matching, RapidIO, PCI Express, and Gigabit Ethernet MACs. The hypernym hierarchy is: microprocessor -> MPU -> communications processor -> network SoC -> embedded processor. Key features of the MPC8572EVTAULD include 32 KB L1 instruction cache and 32 KB L1 data cache per core, a shared 1 MB L2 cache with ECC, a 64-bit DDR2/DDR3 memory controller, two Gigabit Ethernet controllers, dual PCI Express interfaces, four SerDes lanes usable for SGMII, RapidIO, or PCI Express, and an integrated security block (SEC) supporting DES, 3DES, AES, and public-key algorithms. The integrated pattern-matching engine accelerates deep-packet classification for network security and QoS workloads. The MPC8572E architecture implements a coherent SMP/MSC (Symmetric/Asymmetric Multi-Core) topology with hardware-validated cache coherency, enabling parallel execution across both e500 cores. The SEC crypto-acceleration engine is wired directly to the memory hierarchy, providing multi-Gbps line-rate encryption. The 45 nm CMOS process and 33x33 mm FCBGA package support the high integration required by multi-service routers and LTE/3G base-station line cards. This processor is engineered for multi-service routers, secure gateways, LTE/UMTS base stations, network-attached storage, and enterprise switching platforms. The combination of dual e500 cores, hardware crypto, RapidIO/PCIe interconnect, and Gigabit Ethernet controllers addresses line-rate performance for both control-plane and data-plane workloads. Designers should be aware of the 1023-ball FCBGA requiring high-density PCB layout, controlled-impedance SerDes routing, and matched-length DDR traces. Thermal management must accommodate the device's TDP through a heatsink plus airflow, especially at industrial temperature corners. This page consolidates distributor pricing, drop-in alternatives within the same 1023-FCBGA family, and design considerations not explicitly tabulated in the manufacturer datasheet.

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MPC8572EVTAVNE - PowerQUICC III Dual 1.5GHz SoC | NXP
MPC8572EVTAVNE

MPC8572EVTAVNE - PowerQUICC III Dual 1.5GHz SoC | NXP

The NXP MPC8572EVTAVNE is a PowerQUICC III dual-core PowerPC e500 microprocessor SoC running at 1.5GHz per core, packaged in a 1023-ball FCBGA (33x33 mm). It integrates DDR2/DDR3 memory controllers, PCIe, Gigabit Ethernet, Serial RapidIO (SRIO), and Security (SEC) engines for symmetrical/asymmetric multi-core communications systems. A PowerQUICC III SoC is a communications-processor family within the broader PowerPC architecture, sitting in the hierarchy SoC -> microprocessor -> communications processor -> embedded processor -> semiconductor. These devices were designed by Freescale (now NXP) to consolidate networking datapath and control-plane processing on a single chip, displacing discrete CPU-plus-assist ASIC designs. Key features include dual 32-bit PowerPC e500 cores at 1.5GHz each, integrated DDR2/DDR3 SDRAM controller with ECC, hardware-accelerated Security Engine (SEC 4.0), four Gigabit Ethernet controllers, two PCIe Gen 1/2 interfaces, two Serial RapidIO ports, and an operating temperature range of 0C to 105C. The 'EVT' suffix denotes the enhanced verification/testing variant with security and DDR3 support enabled, while 'AVNE' decodes as 1.5GHz, no encryption restrictions per part number scheme. The architecture combines dual e500 cores with the QUICC Engine datapath accelerator and a coherent SMP fabric, enabling line-rate processing for edge routers, media gateways, and wireless base stations. The SEC engine accelerates AES, 3DES, SHA, and public-key operations offloading security from the cores. DDR3 support doubles memory bandwidth versus DDR2 predecessors, critical for 10Gbps-class traffic classification. Typical applications include enterprise routers and switches, LTE/UMTS base station baseband processing, multi-service access nodes, line cards for ATCA/AMC platforms, and secure network appliances requiring on-die cryptography. When designing with this device, ensure the FCBGA substrate uses at least 8-layer PCB stack-up with matched impedance for DDR3 traces. Provide robust thermal management since dual 1.5GHz cores can exceed 15W TDP under sustained load. The part is marked Obsolete per latest lifecycle data - plan last-time-buy inventory for production continuity. This page synthesizes distributor pricing, drop-in alternative coverage, and design notes not consolidated in the manufacturer datasheet, providing engineer-ready decision support beyond raw specification tables.

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MPC8572LVJAULE - 1.333GHz Dual-Core PowerQUICC III MPU | NXP
MPC8572LVJAULE

MPC8572LVJAULE - 1.333GHz Dual-Core PowerQUICC III MPU | NXP

The NXP MPC8572LVJAULE is a dual-core PowerQUICC III microprocessor unit (MPU) featuring two PowerPC e500 cores running at 1.333 GHz, housed in a 1023-ball FCBGA (33x33 mm) package. The device integrates a 32-bit RISC architecture with on-chip signal processing (SPE) coprocessors and supports DDR2/DDR3 memory controllers, PCIe, Gigabit Ethernet, and Serial RapidIO (SRIO) high-speed serial interfaces for symmetric and asymmetric multi-core systems. A microprocessor unit (MPU) is the central processing unit of an embedded computing system, integrating CPU cores, caches, memory controllers, and high-speed peripherals on a single die. The PowerQUICC III family sits at the top of NXP's communications-processor hierarchy, descended from the original PowerQUICC, PowerQUICC II, and PowerQUICC II Pro families, and is designed for wired and wireless infrastructure equipment where deterministic multi-protocol packet processing is required. Key features of the MPC8572LVJAULE include 1.333 GHz core clock on each of the two e500 cores, integrated DDR2/DDR3 memory controllers, four Gigabit Ethernet controllers, two PCIe interfaces, two Serial RapidIO ports, dual I2C, SPI, DUART, and USB 2.0, plus an integrated security engine. The device supports industrial-temperature operation from 0°C to 105°C (junction) and is manufactured on a 90 nm process with 1.8V/2.5V/3.3V I/O supply rails. Architecturally, the MPC8572LVJAULE uses a 32-bit superscalar e500 core with dual integer and dual double-precision floating-point units, a 32 KB I-cache and 32 KB D-cache per core, and a shared 1 MB L2 cache with ECC. The memory subsystem supports up to 32 GB of addressable DDR2/DDR3 with ECC. High-bandwidth I/O is delivered through dedicated SerDes lanes routed to PCIe, SRIO, and GbE PHYs without external glue logic. Typical applications include multi-service routers, LTE/UMTS baseband line cards, industrial control gateways, secure network appliances, and embedded computing platforms requiring hardware-accelerated packet processing and deterministic multi-protocol bridging. The dual-core configuration enables separation of control-plane and data-plane workloads. When designing with the MPC8572LVJAULE, allocate generous copper area under the FCBGA land pattern for thermal dissipation, follow NXP's reference PCB stack-up recommendations for high-speed SerDes, and verify DDR3 write leveling/calibration with the actual memory devices. Use NXP's CodeWarrior development suite for bring-up. This page synthesizes distributor pricing, drop-in PowerQUICC III alternatives, and practical design notes not consolidated on the NXP product page or the manufacturer datasheet.

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MPC8572LVTAULE - PowerQUICC III 1.333GHz Dual-Core SoC | NXP
MPC8572LVTAULE

MPC8572LVTAULE - PowerQUICC III 1.333GHz Dual-Core SoC | NXP

The NXP (formerly Freescale) MPC8572LVTAULE is a PowerQUICC III integrated communications processor that integrates two PowerPC e500 cores running at up to 1.333 GHz with 32-bit architecture and a high-bandwidth system interconnect, housed in a 1023-ball FCBGA (33x33 mm) package. The device combines dual e500 cores, a 1 MB shared L2 cache, integrated memory controller for DDR2/DDR3, and a rich peripheral set including PCI Express, Serial RapidIO (SRIO), and dual 10/100/1000 Ethernet (GbE) MACs for line-card and control-plane applications. Background Knowledge - What is a PowerQUICC III Communications Processor: A communications processor is a specialized System-on-Chip (SoC) that integrates one or more general-purpose CPU cores with hardware acceleration engines, memory controllers, and high-speed serial interfaces specifically designed for networking and telecom infrastructure. The PowerQUICC III family (PowerPC e500 core, MPC85xx family) sits within the broader taxonomy: Microprocessor -> SoC -> communications processor -> networking ASIC. PowerQUICC III SoCs are widely deployed in routers, switches, base stations, and storage systems where deterministic throughput and protocol offload are required. Key differentiating specifications: 1.333 GHz dual-core e500 with 32 KB L1 instruction cache and 32 KB L1 data cache per core, 1 MB shared L2 cache, DDR2/DDR3 memory controller with ECC support, three PCI Express interfaces, two Serial RapidIO interfaces, two Gigabit Ethernet MACs, and an integrated security engine. The 1023-FCBGA package uses a 33x33 mm substrate with the flip-chip die facing up; thermal performance is handled through the package lid and an attached heatsink. Technical depth: The MPC8572L uses a 90 nm CMOS process (per Freescale hardware specifications, document MPC8572E PowerQUICC III). The platform integrates a CoreNet fabric-based coherency engine that lets both e500 cores snoop each other's L1 caches against the shared L2, simplifying software coherency in symmetric multiprocessing. The integrated memory controller supports up to 8 GB of DDR2/DDR3 with ECC, and the SerDes lanes can be configured for combinations of PCIe, SRIO, and SGMII. Typical applications: edge routers, multiservice switches, line cards for chassis-based routers, LTE/3G base-station baseband cards, IP-PBX, security appliances, and industrial control systems. The wide operating temperature range of 0C to +105C suits thermally constrained networking chassis. Design consideration: Use the Freescale/NXP CodeWarrior or the open-source Yocto SDK to build U-Boot and Linux BSP; ensure the SerDes reference clock jitter stays below 100 ps RMS to keep PCIe and SRIO links in spec. Power sequencing on the GVDD/CVDD rails must follow the order in the hardware specifications to avoid latch-up. This page synthesizes distributor stock, drop-in alternatives, and practical design notes for engineers evaluating or sourcing the MPC8572LVTAULE - information not collated on any single distributor page.

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MPC8572VJAVNE - PowerQUICC III 2x1.5GHz SoC MPU | NXP | 1023-FCBGA
MPC8572VJAVNE

MPC8572VJAVNE - PowerQUICC III 2x1.5GHz SoC MPU | NXP | 1023-FCBGA

The NXP MPC8572VJAVNE is a dual-core PowerQUICC III integrated communications processor featuring two PowerPC e500 cores running at 1.5 GHz, housed in a 1023-ball FCBGA package. It integrates DDR2/DDR3 memory controllers, PCIe, Gigabit Ethernet, and Serial RapidIO interfaces for symmetrical and asymmetrical multi-core communications systems. A PowerQUICC III SoC (System-on-Chip) is a high-performance communications processor family from NXP (formerly Freescale) that integrates CPU cores, memory interfaces, and multiple high-speed serial peripherals onto a single die. Positioned in the taxonomy: MPU -> microprocessor -> integrated circuit -> semiconductor, PowerQUICC III parts target wired and wireless infrastructure, line cards, and base-station equipment where deterministic multi-protocol packet processing is required. Key features include dual 32-bit PowerPC e500 cores up to 1.5 GHz, integrated signal-processing engine (SPE), dual DDR2/DDR3 memory controllers with ECC support, four x4/x2/x1 PCI Express ports, two SGMII Gigabit Ethernet interfaces, dual Serial RapidIO (sRIO) interfaces, and a 32-bit local bus. The SoC integrates a security engine and multiple DMA channels for offloading I/O from the cores. Architecturally, the MPC8572VJAVNE uses a coherent shared-memory fabric with hardware-coherent caches between the two e500 cores, enabling true symmetric multiprocessing. The 1023-ball FCBGA package exposes the full SerDes and memory bandwidth while dissipating up to approximately 25 W under load, requiring a heatsink and a multilayer PCB with controlled-impedance SerDes routing. Typical applications include multi-service routers, LTE/UMTS base-station baseband processing, ATCA/AMC line cards, industrial Ethernet switches, and storage area network controllers. The combination of dual cores and multiple high-speed serial interfaces suits packet classification, deep packet inspection, and protocol termination workloads. Design consideration: route all SerDes lanes with 100-ohm differential impedance and length-matched pairs within 150 mils; provide a 4-layer (or more) PCB with a solid ground plane under the FCBGA to manage the 25 W thermal envelope. The part is approaching end of life on NXP's product roadmap, so designers should plan second-source or migration paths. This page synthesizes distributor pricing, same-family NXP drop-in alternatives, FCBGA-1023 package details, and practical design notes that augment the manufacturer datasheet.

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MPC8572VTATLD - PowerPC e500 Dual-Core 1.2GHz MPU | NXP
MPC8572VTATLD

MPC8572VTATLD - PowerPC e500 Dual-Core 1.2GHz MPU | NXP

The NXP MPC8572VTATLD is a PowerPC e500 dual-core microprocessor from the MPC8572E PowerQUICC III family, operating at up to 1.2 GHz with a 32-bit architecture and housed in a 1023-pin FC-BGA (33x33) package. It integrates two e500 cores, sophisticated on-chip peripherals, and a high-bandwidth system bus to deliver integrated communications processing for symmetric and asymmetric multi-core systems. A PowerQUICC III integrated communications processor is a multi-core system-on-chip that combines general-purpose PowerPC cores with specialized communication engines and I/O subsystems. The MPC85xx family hierarchy spans PowerPC MPU -> embedded microprocessor -> communications processor -> SoC, targeting networking and telecom infrastructure where deterministic throughput and rich peripheral integration matter more than raw single-thread performance. Key features of the MPC8572VTATLD include dual e500 cores running at 1.2 GHz, on-chip L1 caches, integrated security and pattern-matching engines, and a wide range of high-speed serial interfaces including Gigabit Ethernet, PCI Express, and RapidIO. The device supports 1.8 V, 2.5 V, and 3.3 V I/O operations, simplifying mixed-voltage board designs. Memory interfaces include DDR2 SDRAM with ECC and a local bus controller for legacy peripherals. Architecturally, the MPC8572E combines dual e500 superscalar cores with the system interface and acceleration logic typical of the PowerQUICC III platform. Core-to-core coherency is maintained through the device's on-chip fabric, and the integrated security engine offloads AES, 3DES, public-key, and CRC operations from the host cores, reducing CPU load for packet-processing pipelines. Typical applications include enterprise routers and switches, line cards, network security appliances (firewalls, IPS/IDS, VPN gateways), industrial control and automation backplanes, and telecom infrastructure such as LTE base stations and channel cards. The high core count plus integrated I/O makes it well suited for control-plane and data-plane workloads running concurrently. When designing with this part, engineers should plan thermal management for the FC-BGA package, follow NXP's power-sequencing recommendations, and use DDR2 reference-termination layouts. Designers should also verify that the local bus and RapidIO/PCIe reference clocks are within the jitter limits listed in the MPC8572E hardware specifications. This page synthesizes NXP datasheet extracts, current distributor stock and pricing, and drop-in alternative guidance not available in the bare datasheet, giving engineers a single source for evaluation, procurement, and second-sourcing decisions.

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MPC8572VTATLE557 - PowerQUICC III Dual-Core 1.2GHz MPU | NXP/Freescale
MPC8572VTATLE557

MPC8572VTATLE557 - PowerQUICC III Dual-Core 1.2GHz MPU | NXP/Freescale

The NXP/Freescale MPC8572VTATLE557 is a PowerQUICC III integrated communications processor featuring a dual-core PowerPC e500 architecture operating at up to 1.2 GHz in a 1023-ball FCBGA (33x33) package. It is a member of the MPC8572 family of high-performance microprocessors designed for enterprise switching, routing, and unified threat management (UTM) applications, integrating a high-speed SerDes and a flexible peripheral set on a single die. A PowerQUICC integrated communications processor is a highly integrated System-on-Chip (SoC) that combines one or more PowerPC processor cores with packet-processing accelerators and a wide variety of high-speed communications interfaces. It sits within the broader taxonomy of embedded microprocessors -> microcontrollers and microprocessors -> integrated circuits, and historically served networking equipment designers who needed a single device to handle control plane plus data plane workloads. Key features of the MPC8572VTATLE557 include dual PowerPC e500 cores running at 1.2 GHz, an integrated security engine (SEC), a 32-bit DDR2/DDR3 memory controller, four 10/100/1000 Ethernet MACs, and PCI Express and Serial RapidIO interfaces. It supports industrial and extended-temperature operating ranges, hardware virtualization support, and a coherent SMP fabric that simplifies symmetric multiprocessing firmware. The MPC8572 architecture utilizes a high-performance e500 core with Book-E instruction set architecture and integrated L1/L2 caches, plus an on-chip packet engine and DMA fabric that offload frame processing from the cores. The '557' speed grade denotes a 1.2 GHz core frequency, the highest bin available for this family, which maximizes packet throughput in enterprise routers and security appliances. Typical applications include enterprise routers, Layer 2/3 managed switches, network security appliances (UTM/NGFW), industrial control and factory automation, and telecom line cards. The MPC8572VTATLE557 is the right choice when an integrated dual-core CPU and communications accelerator are required in a single, mature BGA package with extensive reference designs available. When designing with this part, allocate the maximum PCB area allowed for the 33x33 mm FCBGA, plan a high-layer-count PCB (typically 12-16 layers) with matched-length SerDes routes, and ensure the thermal solution can dissipate up to roughly 20-25 W at full turbo. Designers should also validate second-source availability, as this part is on long-term support with multiple authorized distributors. This page consolidates distributor pricing, identical-footprint same-brand variants (T-series speed grades and the -557 thermal bin) and cross-brand drop-in alternatives, plus practical thermal and PCB layout guidance not found in the manufacturer datasheet alone.

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MPC8572VTAULD - PowerQUICC III Dual-Core e500 1.333GHz MPU | NXP
MPC8572VTAULD

MPC8572VTAULD - PowerQUICC III Dual-Core e500 1.333GHz MPU | NXP

The NXP MPC8572VTAULD is a PowerQUICC III integrated communications processor featuring two PowerPC e500 cores running at up to 1.333 GHz, fabricated in a 90 nm CMOS process and housed in a 1023-ball FCBGA (33x33 mm) package. The device integrates high-performance CPU cores with a flexible peripheral set including multiple Gigabit Ethernet controllers, PCI Express, Serial RapidIO, and DDR2/DDR3 memory controllers, targeting wireline networking, storage, and embedded telecommunications equipment. A PowerQUICC III processor belongs to the PowerPC-based microprocessor family, which combines a general-purpose CPU subsystem with on-chip networking peripherals to offload protocol processing from the host CPU. The MPC85xx family sits at the intersection of microprocessors and communications SoCs, derived from Freescale's earlier PowerQUICC II architecture but with a much higher integration level including dedicated hardware accelerators for encryption, pattern matching, and queue management. Key features include dual e500 cores with 32 KB L1 instruction and 32 KB L1 data caches per core, a unified 1 MB L2 cache, an integrated DDR2/DDR3 SDRAM controller with ECC support, four 10/100/1000 Mbps Ethernet MACs, two PCI Express interfaces, two Serial RapidIO endpoints, and a security engine supporting AES, DES, 3DES, SHA-1/SHA-256, and public-key cryptography. The device operates from 1.0 V core / 1.8 V / 2.5 V / 3.3 V I/O rails and supports industrial temperature ranges. The MPC8572E integrates the above with an additional enhanced security block, distinguishing it from the MPC8572 base part. The 'VT' speed-grade designation indicates the 1.333 GHz core frequency bin, while the 'AULD' suffix encodes the FCBGA-1023 package, lead-free RoHS compliance, and the extended-temperature qualification. The architecture exposes a 64-bit local bus and supports boot from NOR flash, NAND flash, I2C EEPROM, and PCI Express to accommodate a wide range of system topologies. Typical applications include multi-service routers, line cards for carrier Ethernet switches, IP DSLAMs, RAID storage controllers, and industrial automation controllers requiring deterministic Ethernet and RapidIO fabric connectivity. The integrated security engine also enables IPSec/SSL acceleration in unified SBC, ADC, and protocol-offload appliances. When designing with the MPC8572VTAULD, careful attention must be paid to PCB layout for the FCBGA package: a high-density substrate, controlled-impedance routing for DDR2/DDR3 traces, and matched-length SERDES lanes are required to meet signal-integrity budgets. Decoupling capacitors must be placed as close as possible to every power pin, with a star-ground topology recommended for the analog PLL supplies. This page synthesizes distributor stock and pricing snapshots, package-level drop-in alternatives drawn from the same MPC8572 family, and practical PCB thermal and SERDES layout notes that complement the NXP datasheet without replacing it.

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MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023
MPC8572VTAVNE

MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023

The NXP (formerly Freescale) MPC8572VTAVNE is a PowerQUICC III integrated communications processor built on the PowerPC e500 core, integrating two 32-bit e500 cores clocked up to 1.5 GHz with a shared 1 MB L2 cache. It is housed in a 1023-ball FCBGA (33 mm x 33 mm) package and is specified for an extended commercial operating temperature range of 0 to +105 degrees C, with a core voltage of approximately 1.1 V. The part is widely used in networking line cards, base stations, and embedded industrial platforms where deterministic multi-core processing and high-bandwidth I/O are required. A communications SoC (System-on-Chip) of this class integrates one or more general-purpose CPU cores, a high-throughput memory subsystem, and a flexible I/O fabric on a single die. Within the broader taxonomy, the MPC8572VTAVNE is a member of the microprocessor family (MPU), a subclass of integrated circuits, and is specifically targeted at data-plane and control-plane workloads where a single chip must terminate multiple high-speed serial links. The PowerQUICC III lineage from NXP is the third generation of the PowerQUICC architecture, designed for symmetric and asymmetric multi-core systems in networking infrastructure. Key differentiating features include dual e500 cores with separate L1 caches, hardware table lookup and pattern-matching accelerators used for packet classification, support for DDR2 and DDR3 memory controllers with ECC, three PCI Express interfaces, dual Gigabit Ethernet MACs, Serial RapidIO (SRIO), and an integrated security engine. The 1023-ball FCBGA package exposes the full set of high-speed serial links and parallel memory buses needed for backplane routing, while a dedicated local bus controller can interface to legacy Flash and peripherals. Architecturally, the MPC8572VTAVNE relies on the Power Architecture Book E instruction set, augmented by the Signal Processing Engine (SPE) for SIMD-style DSP operations, and a coherent CoreNet platform fabric that ties the cores, L2, and I/O together with hardware snoop and coherency. Compared with general-purpose CPUs, this design is optimized for predictable interrupt latency, DMA-driven packet movement, and tight integration with networking peripherals - which is why it has historically been preferred for line-card SoCs in switches and routers. Typical applications include enterprise switching and routing line cards, LTE and WiMAX base-station baseband processing, industrial control and factory automation controllers, military and aerospace ruggedized networking, and storage-area network (SAN) controllers. The wide I/O mix also makes it a frequent choice for medical imaging and high-end embedded instrumentation. When designing with this part, ensure the PCB has a sufficient copper pour and via hole stitching beneath the FCBGA land pattern to meet the 1023-ball thermal dissipation requirement; the 1.1 V core rail demands a low-noise multi-phase regulator. Avoid signal routing under the package and place the DDR2/DDR3 memory as close as possible to the controller pins to maintain timing margins. This page synthesizes distributor stock levels, official NXP documentation, and a same-package cross-reference list that is not aggregated anywhere else, providing engineers a one-stop view for MPC8572VTAVNE selection, sourcing, and lifecycle planning.

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MPC8572VTAVNE557 - PowerQUICC III 1.5GHz Dual-Core MPU | NXP
MPC8572VTAVNE557

MPC8572VTAVNE557 - PowerQUICC III 1.5GHz Dual-Core MPU | NXP

The NXP (formerly Freescale) MPC8572VTAVNE557 is a PowerQUICC III integrated communications processor featuring two Power Architecture e500 cores running at 1.5 GHz in a 1023-ball FCBGA (33x33) package. The device integrates 32-Kbyte L1 instruction and data caches per core with parity protection, plus a shared L2 cache, and is built on a 32-bit Book E-enhanced Power Architecture technology. The part number suffix 'VTAVNE' denotes a 1.5 GHz core frequency, -40C to +105C industrial temperature range, and the 1023-FCBGA package; '557' is a specific die revision/ordering code. A PowerQUICC III is a high-performance communications microprocessor that combines general-purpose processing cores with integrated networking and peripheral accelerators, primarily targeting wired and wireless infrastructure, telecom switching, and industrial control. The MPC8572E family sits in the hierarchy: MPU -> communications processor -> embedded processor -> semiconductor, and is engineered for parallel multi-protocol packet processing at line rate. Key features include dual 32-bit e500 cores, integrated Double-Precision Floating-Point Unit (DPFPU), four Gigabit Ethernet controllers, two 10/100/1000 Ethernet MACs, PCI Express interfaces, RapidIO interconnect, DDR2/DDR3 memory controller with ECC, and integrated security engines. The device supports hypervisor-aware virtualization and is designed for deterministic real-time response in packet-processing pipelines. The architecture combines two symmetric e500 cores with on-chip coherence logic, a high-bandwidth CoreNet fabric interconnecting memory, I/O and accelerators, and dedicated hardware blocks for queue management, table lookup and cryptography. This partitioning lets the cores run control-plane software while dedicated engines accelerate data-plane operations. Typical applications include multi-service routers, LTE/UMTS base-station baseband, industrial control servers, defense/aerospace networking equipment, and storage area network controllers. The industrial temperature grade (-40C to +105C Tj) makes it suitable for harsh-environment deployments where commercial parts would fail. When designing with this device, pay special attention to PCB layout: the 1023-ball FCBGA requires microvia or wire-bond-compatible stack-up, matched-length DDR traces, and a multi-layer reference design from NXP (typically 10+ layers). Power sequencing of the 1.0V core, 1.5V/1.8V DDR and 3.3V I/O rails must follow the datasheet sequence to prevent latch-up. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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MPC857DSLCVR66B - 66MHz PowerQUICC MPU 357-BGA | NXP
MPC857DSLCVR66B

MPC857DSLCVR66B - 66MHz PowerQUICC MPU 357-BGA | NXP

The NXP MPC857DSLCVR66B is a PowerQUICC MPC8xx microprocessor IC featuring a single 32-bit core running at 66MHz, fabricated on a 0.32-micron process, and housed in a 357-pin Plastic BGA (PBGA) package measuring 25x25 mm. The device belongs to NXP's MPC857 PowerQUICC family, integrating a PowerPC core with on-chip peripherals including communication controllers for networking and embedded telecom infrastructure. The 66.66MHz core frequency gives it a 1.2V-2.0V core and 3.3V I/O typical supply architecture in a single-chip control solution. What is an MPU (Microprocessor Unit)? An MPU is a processor IC that integrates a central processing unit, memory controller, and peripheral interfaces onto a single silicon die. The PowerQUICC MPC8xx family specifically combines a PowerPC integer unit with embedded communications peripherals (CPM - Communication Processor Module) optimized for WAN, LAN, and telecom routing equipment. These MPUs are positioned between standalone microcontrollers (which integrate memory on-chip) and high-end application processors (which require external DRAM), offering a balanced compute-plus-I/O architecture for legacy networking systems. Key features of the MPC857DSLCVR66B include a 32-bit RISC core, integrated Memory Management Unit (MMU), dual 10/100Mbps Ethernet MAC via the CPM, serial communication controllers (SCCs) and serial management controllers (SMCs), and an industry-standard PCI interface. The 357-ball PBGA package provides 1.27mm pitch and supports multilayer PCB designs typical in networking hardware. The -40C to +95C industrial temperature grade makes the part suitable for outdoor and industrial telecom cabinets. Architecturally, MPC857 PowerQUICC devices decouple the general-purpose PowerPC core from the CPM, which handles DMA-driven protocol processing independently, offloading the core from real-time packet processing. This hardware acceleration makes the part well-suited for medium-throughput routers, DSLAM line cards, and base-station control plane applications where determinism and packet throughput matter more than raw clock speed. Typical applications include industrial Ethernet routers, telecom line-card controllers, protocol converter gateways, ATM/Frame Relay access devices, and military/aerospace embedded systems. The 32-bit core and rich peripheral set also suit SCADA controllers and ruggedized IoT gateways. When designing with this part, ensure your PCB supports the BGA-357 land pattern with controlled-impedance routing for the external memory bus. Power sequencing between the core and I/O rails must follow NXP's reference design or unexpected resets may occur during power-up. This page consolidates distributor pricing, same-package NXP alternatives, and design notes not found in the manufacturer datasheet, including a flagged lifecycle observation that several distributors list the part as Last Time Buy or obsolete.

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MPC857DSLVR50B - MPC8xx PowerQUICC MPU 50MHz 357-PBGA | NXP
MPC857DSLVR50B

MPC857DSLVR50B - MPC8xx PowerQUICC MPU 50MHz 357-PBGA | NXP

The NXP MPC857DSLVR50B is a PowerQUICC MPC8xx microprocessor IC integrating one PowerPC 32-bit core running at 50 MHz with the CPM (Communications Processor Module) co-processor, packaged in a 357-ball PBGA at 25x25 mm. According to the manufacturer product page, the device belongs to the MPC8xx family and is targeted at PowerQUICC communications-processor applications. The 'DSLVR50B' suffix decodes as: DSL = PBGA-357 / Leaded / 0 to 105C operating temperature grade, VR = 50 MHz core, B = revision B silicon. An MPU (Microprocessor Unit) is the central processing unit of an embedded system, executing instruction streams fetched from memory and orchestrating peripherals. The MPC8xx family is a line of PowerPC-based microprocessors in the broader taxonomy MPU -> embedded processor -> microprocessor -> integrated circuit -> semiconductor. The 'PowerQUICC' name denotes NXP/Freescale parts that pair a PowerPC core with the CPM (Communications Processor Module) - a RISC engine dedicated to serial-communication tasks, offloading DMA, HDLC, Ethernet, ATM, and serial-protocol handling from the main CPU. Key features of the MPC857DSLVR50B include 50 MHz PowerPC core, integrated CPM with up to 10 Mbps Ethernet (one port) plus 10/100 Mbps Ethernet (one port), DRAM controller, and a 32-bit external data bus. The 357-ball plastic BGA exposes the full PowerQUICC peripheral set: SCCs, SMCs, SPI, I2C, PCMCIA, memory controller, and general-purpose I/O. Per the NXP product listing, the part is built on a 0.32 micrometer process and ships in tray packaging. Architecturally, the device combines an integer PowerPC core with the CPM coprocessor via an internal bus; the CPM uses microcode-driven RISC engines (CPs) for serial channel termination, enabling simultaneous multi-protocol handling. The 32-bit core performs general control-plane code (RTOS, networking stack, system management), while the CPM handles time-critical data-plane communication without CPU intervention. The integrated DRAM controller and PCI bridge (via UTOPIA/standard MPC8xx peripherals) reduce the chip count of typical routing/bridging designs. Typical applications include industrial Ethernet routers, telecom edge equipment, protocol bridges, low-speed DSL/cable modem control planes, and embedded control-plane subsystems requiring deterministic serial-channel handling. The 50 MHz core and CPM combination is well suited to designs where the host CPU runs management/control software while the CPM terminates serial bearers in parallel. When designing with this part, verify that the 357-ball PBGA PCB land pattern, power-rail sequencing, and 50 MHz system clock match the MPC8xx reference design. Pay particular attention to the BSDL/ boundary-scan compliance and the JTAG TAP for production test. Because this part is reported as obsolete by some distributors, lifecycle planning and second-source identification are recommended during the design phase. This page synthesizes distributor pricing, the same-family NXP alternatives, and practical design considerations that are not consolidated in the manufacturer datasheet.

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MPC857DSLZQ50B - PowerQUICC MPC8xx MPU 50MHz 357-PBGA | NXP
MPC857DSLZQ50B

MPC857DSLZQ50B - PowerQUICC MPC8xx MPU 50MHz 357-PBGA | NXP

The NXP MPC857DSLZQ50B is a PowerQUICC communications processor built on 32-bit Power Architecture, integrating a single MPC8xx core running at 50 MHz with the CPM (Communications Processor Module) for protocol offload. Housed in a 357-ball PBGA package (25x25 mm), it targets embedded networking equipment that requires deterministic serial-channel handling with low system cost. The part is specified over the 0 to 105 C commercial operating range and is supplied in tray packaging. A PowerQUICC processor is a category of integrated communications microprocessor that combines a PowerPC embedded core with dedicated serial-protocol engines (SCCs, SMCs, SPI, I2C, UART) and a 10/100 Ethernet MAC, eliminating the need for an external protocol-handling CPU. It belongs to the broader family of system-on-chip MPUs and historically dominated router, DSLAM, and industrial serial-bridge designs where deterministic latency and a small bill of materials mattered more than raw clock speed. Key features include 32-bit Power Architecture core at 50 MHz, integrated CPM with multiple SCC/SMC channels, integrated 10/100 Ethernet MAC, 32-bit data/address bus support for external memory, on-chip interrupt and timer subsystems, and a JTAG IEEE 1149.1 test access port. The wide integration reduces external glue logic, allowing a compact BOM for gateway and bridge designs. Technically, the MPC857DSLZQ50B uses a Harvard-style core with separate instruction and data MMUs, an internal 4 KB instruction cache and 4 KB data cache, and a bus interface unit that drives SDRAM, SRAM, EPROM and Flash. The CPM offloads the core by handling DMA for the serial controllers, leaving the CPU free for routing and control-plane tasks. Typical applications include industrial serial-to-Ethernet gateways, DSL/Cable modem head-end line cards, router control planes, SCADA protocol converters, and legacy protocol bridges where RS-232/RS-485/CAN-style traffic must terminate into Ethernet. It also fits automation controllers needing deterministic serial handling without a host CPU. When designing with this part, allocate adequate PCB area for the 357-ball PBGA; a minimum of four PCB layers with a continuous ground plane is recommended for signal-integrity and thermal reasons. Use the JTAG port for boundary-scan and code development, and follow NXP's hardware specifications for SDRAM trace length matching. This page synthesizes distributor pricing, drop-in PowerQUICC siblings, and PBGA PCB layout notes not collected in any single manufacturer datasheet, providing engineering value beyond what NXP's product brief offers.

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MPC857TCZQ66B - PowerQUICC MPU, 32-Bit 66MHz 357-PBGA | NXP
MPC857TCZQ66B

MPC857TCZQ66B - PowerQUICC MPU, 32-Bit 66MHz 357-PBGA | NXP

The NXP MPC857TCZQ66B is a PowerQUICC microprocessor from the MPC8xx family featuring a 32-bit single core running at 66 MHz, housed in a 357-pin PBGA (Plastic Ball Grid Array) package measuring 25 mm x 25 mm. Originally designed by Freescale Semiconductor (now part of NXP), this PowerQUICC part integrates a PowerPC core with communication peripherals for embedded networking and telecommunications systems. A PowerQUICC (PowerPC QUICC) MPU is a category of integrated communications processor that combines a PowerPC execution core with on-chip peripheral subsystems optimized for networking, telecom, and data transport applications. PowerQUICC processors sit within the broader hierarchy of embedded microprocessor units (MPUs), a subclass of microcontrollers and integrated circuits, and they specifically target deterministic handling of serial communications alongside general-purpose computation. This positioning makes them distinct from microcontrollers (which prioritize low power and integrated flash) and from application processors (which prioritize high-throughput multimedia). Key features include a 32-bit PowerPC architecture core, 66 MHz operating frequency, and the large 357-ball PBGA package that provides extensive I/O for memory and peripheral interfaces. The device is part of the MPC857 sub-series, which adds communications peripheral enhancements over the baseline MPC850/MPC855 devices. The 25x25 mm PBGA accommodates parallel external memory buses, multiple communication channels, and DMA controllers typical of PowerQUICC designs. From an architecture standpoint, the MPC857TCZQ66B integrates a PowerPC integer unit, on-chip caches, a system interface unit for external memory, a communications processor module (CPM), and serial interface controllers. This integrated design allowed OEMs in the late 1990s and 2000s to build routers, WAN access equipment, and industrial control platforms with a single-chip solution rather than separate CPU plus ASIC implementations. Typical applications include telecom line cards, WAN access routers, industrial serial communications gateways, and legacy embedded networking equipment. The wide operating temperature range and robust PBGA package also make the part usable in industrial control environments requiring long-term reliability. When designing with the MPC857TCZQ66B, engineers should consider the legacy status of this part: the PowerQUICC I family is mature and has been superseded by newer QorIQ and Layerscape families from NXP. For new designs, evaluate newer alternatives unless specific software or qualification reasons lock the MPC857 in place. Existing designs benefit from stable supply through distributors carrying remaining inventory. This page synthesizes distributor inventory status, drop-in same-package alternatives, and practical supply notes not found in the original Freescale/NXP datasheet.

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MPC857TVR66B - PowerQUICC MPC8xx 32-Bit 66MHz MPU | NXP
MPC857TVR66B

MPC857TVR66B - PowerQUICC MPC8xx 32-Bit 66MHz MPU | NXP

The NXP (formerly Freescale) MPC857TVR66B is a PowerQUICC MPC8xx 32-bit microprocessor running at 66 MHz, housed in a 357-ball PBGA package measuring 25 mm x 25 mm. It is a single-core PowerQUICC device from the MPC860/MPC857T/MPC857DSL family that integrates a PowerPC core with communications peripherals, aimed at networking and embedded telecom equipment. The part is supplied from a 3.3 V rail and is offered in tray packaging with RoHS-compliant lead-free terminations. A microprocessor (MPU) is an integrated circuit that fetches, decodes, and executes instructions from program memory using an internal CPU core. The PowerQUICC MPC8xx family belongs to the broader embedded microprocessor category, which sits hierarchically above microcontrollers (MCUs) for applications that need higher CPU performance and richer peripheral integration. The MPC8xx line specifically combines a PowerPC core with the CPM (Communications Processor Module), historically used for WAN, LAN, and serial-routing functions in networking gear. Key features include a 32-bit PowerPC core with 66 MHz core clock, integrated CPM block for HDLC/SCC/SMC channels, integrated system functions (timers, interrupt controller, memory controller), and a 357-ball PBGA package for high-density board designs. The 25 mm x 25 mm BGA footprint provides generous thermal mass for the typical PowerQUICC power envelope and supports controlled-impedance routing required by the external memory bus. The MPC857T variant of the MPC8xx family is differentiated from the MPC860 by on-chip enhancements to the CPM and by extended temperature and silicon revision identification. The 66 MHz speed grade is the standard commercial operating point, and parts from the same family are available at higher bus frequencies (e.g., MPC857TVR80B). The architecture is well documented in the Freescale/NXP MPC862/857T/857DSL reference manual. Typical applications include legacy networking routers and bridges, industrial serial communications, telecom control planes, and embedded control systems that require deterministic serial-channel handling. Engineers frequently pair the MPC8xx with external SDRAM/Flash memory and PHY devices for complete line-card or WAN-router designs. When designing with this device, carefully observe the IBIS and BSDL models from NXP to ensure signal integrity on the external memory bus. Decoupling must follow the reference board stack-up documented in the evaluation kit schematic; the 357-BGA package requires via-in-pad or microvia technology for reliable assembly. Verify all errata against the latest silicon revision mask before committing to volume production. This page synthesizes distributor stock, drop-in alternatives, and engineering guidance beyond what the bare datasheet excerpt provides.

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