5CSEBA6U19I7NTS vs 5CSEBA6U19I7N Comparação
Comparação detalhada lado a lado de 5CSEBA6U19I7NTS por Intel e 5CSEBA6U19I7N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
5CSEBA6U19I7NTS - Cyclone V SE SoC FPGA, 110K LE, 925MHz, 484-UBGA | Intel
5CSEBA6U19I7NTS ✓ AtivoIntel
5CSEBA6U19I7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9 800MHz | Intel
5CSEBA6U19I7N ✓ AtivoComparação de especificações
| Parâmetro | 5CSEBA6U19I7NTS | 5CSEBA6U19I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $46,25 | $142,75 |
| Product Type | System-on-Chip FPGA (SoC FPGA) | — |
| Series | Cyclone V SE | 5CSEBA6 |
| Logic Elements | 110K | 110,000 |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 925 MHz | 800 MHz |
| FPGA Architecture | Cyclone V SE, 28 nm low-power process | — |
| Encapsulamento | 484-ball UBGA (19x19 mm) | 484-pin UBGAFBGA (UBGA-484, 19x19 mm) |
| Temperatura de operação | -40C to +100C (Industrial, 'I7' speed grade) | -40C to +100C (Industrial) |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount (BGA) |
| Nível MSL | [DATA_NEEDED: MSL rating] | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration Method | SRAM-based, via Quartus Prime | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 112 (18x18 multipliers) |
| Tipo de memória | DDR3/DDR3L with ECC support | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART | — |
| Device Family | Cyclone V | — |
| Family Variant | SE (SoC FPGA with HPS) | — |
| Family | — | Cyclone V SE SoC FPGA |
| Device Variant | — | 5CSEA6 (U19 package, 110K LE) |
| Hard Processor System | — | Dual-core ARM Cortex-A9 MPCore |
| Embedded Memory | — | 4.45 Mbits (M10K + MLAB) |
| Hard Memory Controller | — | DDR3, DDR3L, LPDDR2 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| PLLs | — | 6 (FPGA) + 3 (HPS) |
| User I/O Banks | — | 8 |
| Maximum User I/O | — | 288 (package-dependent) |
| Process Technology | — | TSMC 28 nm low-power |
| Tensão de alimentação | — | Multi-rail (1.1 V core, 1.5/1.8/2.5/3.0/3.3 V I/O) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |