5CSEBA6U19I7NTS - Cyclone V SE SoC FPGA, 110K LE, 925MHz, 484-UBGA | Intel
N.º da peça: 5CSEBA6U19I7NTS ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $64.04 | $64,04 |
| 10 | $58.2 | $582,00 |
| 100 | $52.85 | $5.285,00 |
| 250 | $49.1 | $12.275,00 |
| 500 | $46.25 | $23.125,00 |
5CSEBA6U19I7NTS Visão geral
What is an SoC FPGA? An SoC FPGA combines a traditional FPGA fabric (programmable logic, DSP blocks, memory, and transceivers) with a hard ARM-based application processor subsystem on a single die, delivering deterministic real-time performance in the programmable logic while the HPS runs operating systems such as Linux or RTOS. It sits in the broader hierarchy of FPGA & CPLD > programmable logic > semiconductor > integrated circuit. SoC FPGAs bridge the gap between microcontrollers (insufficient parallelism) and pure ASICs (high NRE cost), making them ideal for mid-volume embedded designs.
Key specifications include 110K logic elements, 925 MHz HPS core frequency, integrated DDR3/3L memory controller, 32-bit ECC support, and high-speed peripheral interfaces including Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, and UART. The Cyclone V architecture is built on TSMC's low-power 28 nm process, achieving up to 40% lower power than the previous Cyclone IV generation while delivering higher logic density and DSP performance.
Typical applications span industrial motor control, factory automation, video surveillance, automotive ADAS, smart grid, and medical imaging. The combination of an ARM Cortex-A9 HPS with programmable logic enables hardware-accelerated custom peripherals alongside a Linux-capable application processor, eliminating the need for a discrete MCU/FPGA combination and reducing BOM cost and PCB area. The industrial temperature grade supports deployment in harsh environments such as factory floors and outdoor enclosures.
When designing with this part, allocate PCB area for the HPS-to-FPGA bridge (AXI/ARM Cortex-A9 MPCore HPS-to-FPGA AXI bridges), provide separate power rails for the HPS and FPGA core, and ensure the DDR3 interface is routed with matched-length traces and proper impedance. Quartus Prime software (Subscription Edition required for SoC) is used for FPGA configuration, HPS firmware, and pin planning.
Alternativas drop-in para 5CSEBA6U19I7NTS — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA6U19I7NTS (mesmo formato e footprint) — diferindo em Package, Operating Temperature, DSP Blocks, Logic Elements, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA6U19I7N
✅ Drop-In✓ Em estoque
$142.75 / unidade
Ver ficha técnica →5CSEBA6U19I7LN
✅ Drop-In✓ Em estoque
$288.9 / unidade
Ver ficha técnica →5CSEBA6U19C8SN
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →5CSEBA6U19C7SN
✅ Drop-In✓ Em estoque
$149.85 / unidade
Ver ficha técnica →5CSEBA5U19I7N
✅ Drop-In✓ Em estoque
$119.85 / unidade
Ver ficha técnica →5CSEBA4U19I7N
✅ Drop-In✓ Em estoque
$72 / unidade
Ver ficha técnica →5CSEBA6U19I7NTS Classificações máximas e características elétricas
| Product Type | System-on-Chip FPGA (SoC FPGA) |
| Series | Cyclone V SE |
| Logic Elements | 110K |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| FPGA Architecture | Cyclone V SE, 28 nm low-power process |
| Encapsulamento | 484-ball UBGA (19x19 mm) |
| Temperatura de operação | -40C to +100C (Industrial, 'I7' speed grade) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Configuration Method | SRAM-based, via Quartus Prime |
| Tipo de memória | DDR3/DDR3L with ECC support |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART |
| Device Family | Cyclone V |
| Family Variant | SE (SoC FPGA with HPS) |
Guia de Configuração de Pinos do 5CSEBA6U19I7NTS 484-ball ubga (19x19 mm)
Configuração de pinos para 5CSEBA6U19I7NTS (pacote 484-ball ubga (19x19 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA6U19I7NTS.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA6U19I7NTS é adequado para 7 aplicaçãos: Industrial Motor Control and Drives, Machine Vision and Video Processing, Industrial IoT Gateway and Edge Computing, Medical Imaging and Diagnostics Equipment, Automotive Telematics and Infotainment, Smart Grid and Energy Substation, Software-Defined Radio Baseband Processing.
Industrial Motor Control and Drives
The 5CSEBA6U19I7NTS is well suited to industrial multi-axis motor control and variable-frequency drives because the dual ARM Cortex-A9 HPS at 925 MHz runs the motion-control stack (trajectory planner, state machine, EtherCAT master) while the 110K-logic-element FPGA fabric implements deterministic hardware PWM generation, encoder decoding (EnDat, BiSS, SSI), and field-oriented-control loops. The industrial -40C to +100C temperature grade supports deployment in factory-floor cabinets and outdoor drive enclosures without additional thermal management. DDR3 ECC memory protects against bit flips in long-lifetime installations, while the FPGA fabric's parallel DSP blocks accelerate Park/Clarke transforms and SVM generation at switching frequencies above 20 kHz.
Recomendado
Machine Vision and Video Processing
The 5CSEBA6U19I7NTS is ideal for industrial machine vision and video surveillance because the FPGA fabric can ingest parallel image-sensor data (LVDS or sub-LVDS from MIPI-CSI-2 bridges), perform real-time preprocessing (color correction, lens distortion compensation, edge detection), and stream results to the ARM Cortex-A9 HPS for higher-level inference or display composition. The 925 MHz HPS runs Linux with OpenCV or GStreamer pipelines, while the FPGA fabric handles deterministic pixel pipelines at line rate. Industrial temperature and RoHS compliance allow deployment in factory inspection cells and outdoor surveillance cabinets. The HPS Gigabit Ethernet MAC streams processed video to a network video recorder with minimal CPU overhead.
Recomendado
Industrial IoT Gateway and Edge Computing
The 5CSEBA6U19I7NTS functions as a high-performance Industrial IoT edge gateway because the dual ARM Cortex-A9 MPCore HPS at 925 MHz runs Linux with containerized workloads (MQTT brokers, OPC-UA servers, time-series databases) while the FPGA fabric implements deterministic industrial protocol bridges (PROFINET, EtherCAT, Modbus-TCP, CANopen) and pre-processes sensor data before HPS delivery. The 110K logic elements support up to 8 industrial protocol channels concurrently. Industrial temperature operation permits DIN-rail mounted installations, and the HPS's Gigabit Ethernet and USB 2.0 OTG enable both factory-floor connectivity and secure over-the-air firmware updates.
Recomendado
Medical Imaging and Diagnostics Equipment
The 5CSEBA6U19I7NTS is suitable for portable and cart-based medical imaging systems because the FPGA fabric accelerates image reconstruction (back-projection for CT, beamforming for ultrasound) while the ARM Cortex-A9 HPS at 925 MHz runs the Qt-based GUI, DICOM networking stack, and patient data management. The 110K logic elements support real-time processing of mid-resolution ultrasound or endoscopy streams. Industrial temperature operation supports hospital and clinic environments with reliable thermal margins. The HPS DDR3 controller with ECC ensures data integrity for diagnostic image storage and patient records, while the FPGA fabric provides deterministic latency for sensor synchronization.
Recomendado
Automotive Telematics and Infotainment
The 5CSEBA6U19I7NTS fits non-safety automotive telematics and infotainment head units because the dual ARM Cortex-A9 HPS runs Android Automotive OS or QNX with the HMI stack, while the FPGA fabric handles multi-display pixel composition, audio DSP (upmixing, noise cancellation), and CAN/LIN gateway functions. The 925 MHz HPS frequency supports smooth 720p/1080p touchscreen UIs. The 110K logic elements can drive up to three independent displays with overlay composition. Industrial temperature range covers cabin environments. Note: this part is not AEC-Q100 qualified; for safety-critical ADAS, designers should use AEC-Q100 qualified Cyclone V Auto variants.
Recomendado
Smart Grid and Energy Substation
The 5CSEBA6U19I7NTS is well matched to smart-grid substation equipment and renewable-energy inverters because the FPGA fabric implements deterministic IEC 61850-3 sampled-value processing, phasor measurement (PMU), and protection relay logic, while the ARM Cortex-A9 HPS runs the supervisory communication stack (DNP3, IEC 60870-5-104, MQTT-SN). The 110K logic elements support multi-feed protection schemes with sub-cycle latency. Industrial -40C to +100C operation handles outdoor substation cabinets. The HPS DDR3 ECC protects against single-event upsets in high-altitude and cosmic-ray-exposed installations, and the FPGA fabric's deterministic response time supports the 4 ms protection-cycle requirements of IEC 61850.
Recomendado
Software-Defined Radio Baseband Processing
The 5CSEBA6U19I7NTS can serve as the baseband processor for low-channel-count software-defined radio systems because the FPGA fabric implements parallel digital down-conversion, channelization (polyphase filter banks), and digital predistortion, while the ARM Cortex-A9 HPS at 925 MHz handles MAC-layer scheduling and remote management. The 110K logic elements support up to 4 simultaneous narrowband channels. Industrial temperature operation supports outdoor small-cell and fixed-wireless-access deployments. The HPS Gigabit Ethernet MAC streams digitized samples to upper-layer processing, and the FPGA fabric's deterministic timing supports the strict latency budgets of TDD and FDD frame structures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA6U19I7NTS — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA6U19I7N | 5CSEBA6U19I7LN | 5CSEBA6U19C8SN | 5CSEBA5U19I7N | 5CSEBA4U19I7N |
|---|---|---|---|---|---|---|
| Package | 484-UBGA (19x19 mm) | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 110K | 110K | 110K | 110K | ~85K | ~85K |
| HPS Core | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| HPS Maximum Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I7 | I7 | I7 | C8 | I7 | I7 |
| Delivery Format | Tape & Reel | Tray | Tray (Lead-Free) | Tape & Reel | Tray | Tray |
Principais diferenciais
- Tape-and-reel delivery format for high-volume SMT assembly (vs 5CSEBA6U19I7N)
- Maximum logic capacity in the Cyclone V SE 484-ball family (vs 5CSEBA5U19I7N / 5CSEBA4U19I7N)
- Industrial temperature grade for harsh environment deployment (vs 5CSEBA6U19C8SN)
Notas de projeto
The 5CSEBA6U19I7NTS requires multiple separate power rails: VCC (FPGA core, typically 1.1V), VCCPD (I/O pre-driver, 2.5V or 3.0V), VCCIO (per bank, 1.2V to 3.3V), VCCP (HPS core, 1.1V), VCCPD_HPS (HPS pre-driver, 2.5V), and HPS-specific voltages. Use a sequenced power controller such as Intel's EN63A0A or LTC3612 to ensure proper HPS power-up sequencing before FPGA core power. Bulk decoupling: at least 220 uF polymer per rail plus 4.7 uF and 0.1 uF ceramics per pin pair. Power estimation tool in Quartus Prime should be run with realistic toggle rates to size the DC-DC converters appropriately.
Although the 5CSEBA6U19I7NTS industrial temperature grade is rated -40C to +100C, the actual junction temperature must stay below 100C at the worst-case ambient. The 484-ball UBGA package has theta_JA around 14 C/W with a 4-layer JEDEC JESD51-7 standard PCB; a hot design with 110K LE at 200 MHz toggle rate can dissipate 2-3 W. Estimated: with 4-layer PCB and 200 LFM airflow, junction rise is approximately 30-45C above ambient at 2 W dissipation. For sealed enclosures without airflow, either derate the operating frequency, reduce utilization, or add a heatsink bonded to the package top.
The 484-ball UBGA at 0.8 mm pitch requires 4-layer or higher PCB stackup with HDI microvia construction (laser-drilled microvias from outer layers to BGA pads). Route the HPS DDR3 interface with matched-length traces (within 25 mils for data lanes, within 50 mils for address/command) and proper impedance (50 ohm single-ended, 100 ohm differential for DQS). Keep high-speed transceiver-less GPIO differential pairs (LVDS) length-matched to within 10 mils. Provide at least 4 stitching vias around the BGA perimeter to suppress ground bounce. Intel provides reference design pinout files and Quartus Prime pin planner for layer-by-layer routing guidance.
Common design pitfalls when using the 5CSEBA6U19I7NTS include: (1) failing to provide separate analog and digital grounds for the HPS PLL supplies, (2) using the wrong MSEL configuration pins (MSEL[2:0] must match the chosen configuration mode - AS, AP, FPP, or PS), (3) not connecting HPS_COLD_nRESET properly during power-up, which can leave the HPS in an indeterminate state, (4) omitting the 1.1V and 2.5V decoupling on the HPS analog supply pins (HPS_VREF, HPS_VCCPLL), and (5) attempting to use a free Quartus Prime Lite Edition - the SoC FPGA requires Quartus Prime Subscription Edition for HPS firmware and device-tree generation.
For the HPS DDR3 interface at 533 MHz clock (1066 Mbps data rate), use IBIS-AMI simulations with Intel's HPS memory controller model and your chosen DRAM (typically Micron or Samsung) IBIS model. Set VTT termination at the midpoint of DRAM VDDQ, and place DRAM as close as possible to the HPS balls (under 50 mm trace length preferred). For LVDS GPIO pairs on the FPGA fabric, place 100 ohm differential termination at the receiver end, not at the driver. For multi-drop GPIO buses (EMIF, parallel flash), use Intel's soft memory controller IP with calibrated timing.
Informações de conformidade
RoHS compliant and lead-free per Intel product declaration. Not AEC-Q100 qualified - the Cyclone V SE family is targeted at industrial and commercial applications, not safety-critical automotive. For AEC-Q100 needs, use the Cyclone V Auto family. Halogen-free status not explicitly stated in available web data.
