A3PE3000-2FGG324 vs A3PE3000-FG324 Comparação
Comparação detalhada lado a lado de A3PE3000-2FGG324 por Microchip Technology e A3PE3000-FG324 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FGG324 ✓ AtivoMicrochip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000-2FGG324 | A3PE3000-FG324 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $216,00 | $112,30 |
| Family | ProASIC3E | ProASIC3E Flash Family |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells | 75264 | — |
| CLBs | 75264 | — |
| Maximum System Frequency | 310 MHz | 231 MHz |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Configuration Memory | Flash (single-chip, instant-on) | — |
| User I/O | 221 | — |
| Total Memory Bits | [DATA_NEEDED: embedded SRAM capacity] | — |
| Encapsulamento | 324-ball FBGA (FGG324) | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Speed Grade | 2 | — |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Packaging Type | Tray | — |
| Status RoHS | Green (RoHS compliant) | RoHS Non-Compliant (contains lead, per digichip listing) |
| Automotive Qualification | Not qualified (standard grade) | — |
| Logic Elements / CLBs | — | 75,264 |
| User I/Os | — | 221 |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| In-System Programming | — | Yes (JTAG, IEEE 1532-compliant) |
| Security | — | 128-bit AES decryption via JTAG; FlashLock |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM bits] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| I/O Standards Supported | — | [DATA_NEEDED: supported I/O standards] |
| Lead Free Status | — | Contains Lead (per digichip listing) |
| Device ESD/HBM Rating | — | [DATA_NEEDED: ESD rating] |