A3PE3000-2FGG324 vs A3PE3000-FG324 비교
다음의 상세 나란히 비교: A3PE3000-2FGG324 제조: Microchip Technology 및 A3PE3000-FG324 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FGG324 ✓ 활성Microchip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ 활성사양 비교
| 파라미터 | A3PE3000-2FGG324 | A3PE3000-FG324 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $216.00 | $112.30 |
| Family | ProASIC3E | ProASIC3E Flash Family |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells | 75264 | — |
| CLBs | 75264 | — |
| Maximum System Frequency | 310 MHz | 231 MHz |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Configuration Memory | Flash (single-chip, instant-on) | — |
| User I/O | 221 | — |
| Total Memory Bits | [DATA_NEEDED: embedded SRAM capacity] | — |
| 패키지 | 324-ball FBGA (FGG324) | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Speed Grade | 2 | — |
| 동작 온도 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Packaging Type | Tray | — |
| RoHS 상태 | Green (RoHS compliant) | RoHS Non-Compliant (contains lead, per digichip listing) |
| Automotive Qualification | Not qualified (standard grade) | — |
| Logic Elements / CLBs | — | 75,264 |
| User I/Os | — | 221 |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| In-System Programming | — | Yes (JTAG, IEEE 1532-compliant) |
| Security | — | 128-bit AES decryption via JTAG; FlashLock |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM bits] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| I/O Standards Supported | — | [DATA_NEEDED: supported I/O standards] |
| Lead Free Status | — | Contains Lead (per digichip listing) |
| Device ESD/HBM Rating | — | [DATA_NEEDED: ESD rating] |