A3PE3000-2FGG324 vs A3PE3000-FG324 Comparaison
Comparaison détaillée côte à côte de A3PE3000-2FGG324 par Microchip Technology et A3PE3000-FG324 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FGG324 ✓ ActifMicrochip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-2FGG324 | A3PE3000-FG324 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $216,00 | $112,30 |
| Family | ProASIC3E | ProASIC3E Flash Family |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells | 75264 | — |
| CLBs | 75264 | — |
| Maximum System Frequency | 310 MHz | 231 MHz |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Configuration Memory | Flash (single-chip, instant-on) | — |
| User I/O | 221 | — |
| Total Memory Bits | [DATA_NEEDED: embedded SRAM capacity] | — |
| Boîtier | 324-ball FBGA (FGG324) | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height | — |
| Type de montage | Surface Mount | Surface Mount |
| Speed Grade | 2 | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Packaging Type | Tray | — |
| Statut RoHS | Green (RoHS compliant) | RoHS Non-Compliant (contains lead, per digichip listing) |
| Automotive Qualification | Not qualified (standard grade) | — |
| Logic Elements / CLBs | — | 75,264 |
| User I/Os | — | 221 |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| In-System Programming | — | Yes (JTAG, IEEE 1532-compliant) |
| Security | — | 128-bit AES decryption via JTAG; FlashLock |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM bits] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| I/O Standards Supported | — | [DATA_NEEDED: supported I/O standards] |
| Lead Free Status | — | Contains Lead (per digichip listing) |
| Device ESD/HBM Rating | — | [DATA_NEEDED: ESD rating] |