EP1K50TI144-3N vs EP1K30TI144-3N Comparação
Comparação detalhada lado a lado de EP1K50TI144-3N por Altera e EP1K30TI144-3N por Altera. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP1K50TI144-3N | EP1K30TI144-3N |
|---|---|---|
| Marca | Altera | Altera |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $19,80 | $21,80 |
| Family | ACEX 1K (EP1K) | ACEX 1K |
| Series | EP1K50 | EP1K30 |
| Logic Elements | 2,880 | 1,728 |
| Typical Gates | 50,000 | 30,000 |
| Embedded Array Blocks (EABs) | 40 (4 Kbit each) | — |
| Embedded Memory (EAB SRAM) | 40,960 bits | — |
| Maximum User I/O | 102 | — |
| Dedicated Inputs | 6 | — |
| Core Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) | — |
| I/O Bank Voltage (VCCIO) | 2.375 V to 5.0 V (multiVolt I/O) | — |
| Speed Grade | -3 (fastest ACEX 1K grade) | -3 (fastest in EP1K30 family) |
| Maximum Internal Frequency | 166.67 MHz (process node data) | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.18 um CMOS, 4 metal layers |
| Encapsulamento | 144-pin TQFP (Industrial, Pb-free) | TQFP-144 (0.5 mm pitch) |
| Temperatura de operação | -40 °C to +85 °C (Industrial) | -40C to +85C (Industrial) |
| Tipo de montagem | Surface Mount | Surface Mount (Gull-Wing) |
| Configuration Interface | JTAG (IEEE 1149.1) + passive-serial | — |
| Status RoHS | Compliant (Pb-free terminal finish, "N" suffix) | [DATA_NEEDED: RoHS status] |
| Nível MSL | [DATA_NEEDED: MSL level] | — |
| Supply Current (typ/ICC) | [DATA_NEEDED: ICC standby] | — |
| Usable Gates | — | 17,500 |
| Embedded Memory (EAB) | — | 24 Kbit (6 EABs of 4 Kbit each) |
| Maximum User I/O Pins | — | 102 |
| Dedicated Input Pins | — | 6 |
| Total Terminals | — | 144 |
| Core Supply Voltage | — | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Configuration Modes | — | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | — | 4 |
| Thermal Resistance (theta_JA) | — | Approximately 35-40 C/W (PCB-dependent) |