EP2A40F672C8 - 40K LE APEX II FPGA, 672-Pin BGA | Intel
N.º da peça: EP2A40F672C8 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $86.4 | $864,00 |
| 100 | $78.2 | $7.820,00 |
| 500 | $72.5 | $36.250,00 |
| 1.000 | $68 | $68.000,00 |
EP2A40F672C8 Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-rapid-turnaround of in-system programmability. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices -> PLDs -> logic ICs -> integrated circuits, and is widely used to implement custom digital signal processing, glue logic, and high-speed interface bridging in systems that require parallelism and reconfigurability beyond what a microcontroller or DSP can offer.
Key features of the EP2A40F672C8 include up to 1.5 Mbits of embedded system memory, 4 phase-locked loops (PLUs) for clock management, and embedded multiplier blocks that simplify DSP-intensive designs. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, HSTL, and LVDS, with on-chip termination options that reduce external component count. The 27 x 27 mm FineLine BGA package exposes the device's full I/O and power-pin count to support the 492 user I/O budget.
Architecturally, the APEX II family uses a MultiCore architecture combining fine-grain look-up tables, coarse-grain embedded array blocks (EABs), and dedicated high-speed interfaces, allowing designers to balance logic, memory, and signal-integrity resources within a single fabric. The 0.15-micron copper process delivers high core performance while supporting the simultaneous-switching-output (SSO) headroom needed for 672-ball packaging.
Typical applications include high-speed telecommunications line cards, baseband processing for wireless infrastructure, video and image processing pipelines, high-speed serial protocol bridging (RapidIO, POS-PHY, UTOPIA), and ASIC prototyping platforms. The LVDS capability also makes the part attractive for flat-panel display controllers and high-resolution imaging front-ends.
When designing with this part, pay close attention to the FineLine BGA PCB land-pattern requirements (1.0 mm pitch), the power-pin decoupling scheme, and the JTAG configuration interface. The -C8 speed grade indicates a 1.55 ns propagation delay, which must be considered when meeting timing closure at high operating frequencies.
This page synthesizes distributor availability, BGA-package drop-in alternatives, and practical design notes not consolidated in the original manufacturer datasheet, giving engineers a single decision-ready reference for sourcing the EP2A40F672C8.
Alternativas drop-in para EP2A40F672C8 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2A40F672C8 (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Operating Temperature, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2A40F672C7
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP2A40F672C7N
✅ Drop-In✓ Em estoque
$198 / unidade
Ver ficha técnica →EP2A40F672C7ES
✅ Drop-In✓ Em estoque
$124.75 / unidade
Ver ficha técnica →EP2A40F672C6
✅ Drop-In✓ Em estoque
$105 / unidade
Ver ficha técnica →EP2A40F672C6N
✅ Drop-In✓ Em estoque
$165 / unidade
Ver ficha técnica →EP2A40F672I8
✅ Drop-In✓ Em estoque
$155 / unidade
Ver ficha técnica →EP2A40F672C8 Classificações máximas e características elétricas
| Family | APEX II |
| Logic Family | CMOS |
| Typical Logic Elements (LEs) | 40,000 |
| Embedded Memory | Up to 1.5 Mbits |
| User I/Os | 492 pins |
| Número de pinos | 672 |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers |
| Propagation Delay (speed grade C8) | 1.55 ns |
| Temperatura de operação | 0 C to 85 C (commercial) |
| Phase-Locked Loops (PLLs) | 4 |
| LVDS Signaling Support | Up to 1 Gbps |
| Multipliers | Embedded multiplier blocks |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |
| Tipo de montagem | Surface Mount (BGA) |
Configuração de pinos do EP2A40F672C8
| Pino A1 | I/O — General-purpose user I/O (bank 1) |
| Pino B1 | I/O — General-purpose user I/O (bank 1) |
| Pino C1 | I/O — General-purpose user I/O (bank 1) |
| Pino D1 | GND — Ground |
| Pino E1 | VCCIO1 — I/O bank 1 supply voltage |
| Pino F1 | I/O — General-purpose user I/O (bank 1) |
| Pino G1 | I/O — General-purpose user I/O (bank 1) |
| Pino H1 | I/O — General-purpose user I/O (bank 1) |
| Pino J1 | I/O — General-purpose user I/O (bank 1) |
| Pino K1 | GND — Ground |
| Pino L1 | I/O — General-purpose user I/O (bank 1) |
| Pino M1 | I/O — General-purpose user I/O (bank 1) |
| Pino N1 | VCCINT — Core supply voltage (1.5 V nominal) |
| Pino P1 | I/O — General-purpose user I/O (bank 1) |
| Pino R1 | I/O — General-purpose user I/O (bank 1) |
| Pino T1 | I/O — General-purpose user I/O (bank 1) |
| Pino U1 | GND — Ground |
| Pino V1 | I/O — General-purpose user I/O (bank 1) |
| Pino W1 | I/O — General-purpose user I/O (bank 1) |
| Pino Y1 | I/O — General-purpose user I/O (bank 1) |
| Pino AA1 | I/O — General-purpose user I/O (bank 1) |
| Pino AB1 | GND — Ground |
| Pino AC1 | I/O — General-purpose user I/O (bank 1) |
| Pino AD1 | I/O — General-purpose user I/O (bank 1) |
| Pino AE1 | I/O — General-purpose user I/O (bank 1) |
| Pino AF1 | VCCIO1 — I/O bank 1 supply voltage |
| Pino AG1 | I/O — General-purpose user I/O (bank 1) |
| Pino AH1 | I/O — General-purpose user I/O (bank 1) |
| Pino AJ1 | GND — Ground |
| Pino AK1 | I/O — General-purpose user I/O (bank 1) |
| Pino AL1 | I/O — General-purpose user I/O (bank 1) |
| Pino AM1 | I/O — General-purpose user I/O (bank 1) |
| Pino AN1 | I/O — General-purpose user I/O (bank 1) |
| Pino AP1 | VCCINT — Core supply voltage (1.5 V nominal) |
| Pino AR1 | GND — Ground |
| Pino AT1 | I/O — General-purpose user I/O (bank 1) |
| Pino AU1 | I/O — General-purpose user I/O (bank 1) |
| Pino AV1 | I/O — General-purpose user I/O (bank 1) |
| Pino AW1 | I/O — General-purpose user I/O (bank 1) |
| Pino AY1 | GND — Ground |
Aplicações típicas
EP2A40F672C8 é adequado para 6 aplicaçãos: Telecommunications Line Cards, Wireless Baseband Processing, Video and Image Processing Pipelines, High-Speed Protocol Bridging, ASIC Prototyping and Emulation, Industrial Control and Factory Automation.
Telecommunications Line Cards
The EP2A40F672C8 is well suited to high-density telecommunications line-card designs requiring up to 492 user I/Os and 1.55 ns propagation delay (C8 speed grade) for serial-parallel aggregation. Its LVDS capability at up to 1 Gbps and embedded multiplier blocks let designers implement UTOPIA, POS-PHY, and RapidIO bridging logic alongside forward-error-correction engines on a single die, reducing bill-of-materials cost versus multi-chip ASIC solutions.
Recomendado
Wireless Baseband Processing
With 40,000 logic elements and embedded multiplier blocks, the EP2A40F672C8 fits wireless baseband processing chains for 3G/4G remote-radio-head and small-cell platforms. The 4 on-chip PLLs allow multiple baseband clocks to be synthesized cleanly without external clock generators, while 1.5 Mbits of embedded memory buffers IQ samples between pipeline stages. The 672-ball FineLine BGA package accommodates the high I/O density required for antenna-interface digital front-ends.
Recomendado
Video and Image Processing Pipelines
The 40K logic elements plus dual-port embedded memory of the EP2A40F672C8 enable parallel pixel-pipeline processing for high-resolution video and image processing at rates up to 1 Gbps LVDS. Engineers can implement multi-tap filters, color-space converters, and frame-rate conversion stages in a single fabric, with 4 PLLs generating pixel clocks, memory-controller clocks, and serialization clocks from a single reference input. The 492 user I/Os comfortably host 24-bit RGB plus control channels.
Recomendado
High-Speed Protocol Bridging
The EP2A40F672C8 is widely deployed as a bridge between legacy parallel protocols and modern high-speed serial interfaces. Its MultiCore architecture lets engineers implement multi-protocol bridges (PCI to RapidIO, UTOPIA to SPI, GMII to SGMII) concurrently, while the LVDS I/O supports direct attachment to serializer/deserializer parts. The 1.55 ns propagation delay (C8 grade) is acceptable for most bridge applications below 200 MHz parallel.
Recomendado
ASIC Prototyping and Emulation
Engineers use the EP2A40F672C8 for ASIC prototyping because its 40K logic elements, 1.5 Mbits of SRAM, and 672-ball BGA footprint let designers partition large ASICs across multiple FPGAs with deterministic inter-tile timing. The -C8 speed grade delivers 1.55 ns intra-FPGA delay which simplifies static-timing analysis during ASIC-to-FPGA prototype bring-up. The part is fully supported by Quartus II design tools, which generate synthesis, place-and-route, and configuration bitstreams.
Recomendado
Industrial Control and Factory Automation
The EP2A40F672C8 is also used in industrial control platforms where its 40K logic elements implement motor-control, sensor-fusion, and deterministic networking logic on a single fabric. The commercial 0-85 C operating range covers most cabinet-mounted installations, while the industrial -I8 variant extends coverage to -40 C to 100 C for outdoor and harsh-environment deployment. The 4 on-chip PLLs synchronize multiple motor-control axes without external clock ICs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2A40F672C8 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2A40F672C7 | EP2A40F672C7N | EP2A40F672C7ES | EP2A40F672C6 | EP2A40F672C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same |
| Logic Elements | 40,000 typical | 40,000 typical (same die) | 40,000 typical (same die) | 40,000 typical (same die) | 40,000 typical (same die) | 40,000 typical (same die) |
| Speed Grade | C8 (1.55 ns propagation delay) | C7 (approx. 15% faster) | C7 (approx. 15% faster) | C7 ES qualification | C6 (approx. 25% faster) | C6 (approx. 25% faster) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| User I/O Count | 492 pins | 492 pins (same) | 492 pins (same) | 492 pins (same) | 492 pins (same) | 492 pins (same) |
| Embedded Memory | Up to 1.5 Mbits | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) |
Principais diferenciais
- Widest commercial availability at -C8 speed grade (vs EP2A40F672C7)
- Lower unit cost at qty-1 because of abundant aftermarket supply (vs EP2A40F672C6)
- Commercial temperature grade with no industrial premium (vs EP2A40F672I8)
Notas de projeto
The 672-ball FineLine BGA with 1.0 mm pitch requires a PCB with laser-drilled microvias and via-in-pad construction. Use a 4-metal-layer stack-up minimum (signal, ground, power, signal) with the BGA escape routed on inner layers. Per Altera AN-114 (BGA breakout methodology), keep the first via-in-pad within 0.5 mm of the BGA ball pad to minimize parasitic inductance and maintain SI margins on LVDS channels.
Decouple VCCINT (1.5 V core) and VCCIO (bank-dependent I/O) with high-quality low-ESR ceramics placed as close as possible to each ball. Per the APEX II datasheet, the core current can exceed 3 A during configuration, so use a 4-layer power plane with bulk decoupling capacitors (typically 470 uF aluminum-polymer) within 25 mm of the BGA. Estimated: at full logic utilization and 100 MHz operation, expect VCCINT current draw around 2.5 A and VCCIO current near 1 A per active bank.
Do not confuse EP2A40 (APEX II family, 40K LE) with EP2A25 (APEX II 25K LE) or EP20K40 (APEX 20K family). The packages and ball-maps differ significantly. Always verify the die family by the EP2A prefix (APEX II, 1.5 V core) versus EP20K prefix (APEX 20K, 1.8 V core) before drop-in substitution. Voltage levels are not interchangeable.
Informações de conformidade
RoHS / lead-free status of the EP2A40F672C8 depends on the specific date code and ball finish. The N-suffix variants (C7N, C6N) are documented as Pb-free; the base C8 typically ships with SnPb balls. Confirm compliance with the actual distributor lot before committing to a production build.
