EP2SGX130GF40C4NES vs EP2SGX130GF40C4NGB Comparação
Comparação detalhada lado a lado de EP2SGX130GF40C4NES por Intel e EP2SGX130GF40C4NGB por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
EP2SGX130GF40C4NES - 132K LE Stratix II GX FPGA, 6.375Gbps SERDES, 1508-FBGA | Intel
EP2SGX130GF40C4NES ⚠ Última compraIntel
EP2SGX130GF40C4NGB - Stratix II GX FPGA, 132K LEs, 6.6K LABs | Intel
EP2SGX130GF40C4NGB ObsoleteComparação de especificações
| Parâmetro | EP2SGX130GF40C4NES | EP2SGX130GF40C4NGB |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Última compra | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.380,00 | $640,00 |
| Family | Stratix II GX | Enhanced Configuration (EPC) Devices |
| Logic Elements | 132,540 | 132,540 |
| Logic Blocks / ALMs | Approximately 53,000 ALMs | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | Up to 20 (4 to 20, device-dependent) | — |
| User I/O Pins | 734 | 734 |
| Total Package Pins | 1508 (FC-FBGA ball grid) | — |
| Package Code | GF40 (FC-FBGA, 40x40 mm, 1.0 mm pitch) | — |
| Speed Grade | C4 (speed grade -4) | C4 |
| Internal Operating Frequency | Up to 717 MHz | — |
| Embedded Memory | Approximately 4.5 Mbits (TriMatrix) | — |
| PLL Blocks | 8 | — |
| DSP Blocks | Yes (variable, see datasheet) | Yes (embedded multipliers) |
| Tipo de montagem | Surface Mount (flip-chip BGA) | — |
| Lead-Free / RoHS | Yes (LEAD FREE per datasheet family code) | — |
| Nível MSL | Per JEDEC J-STD-020, typically MSL-4 or higher [DATA_NEEDED: exact MSL level] | — |
| Temperatura de operação | Commercial Extended (per N suffix) | — |
| JEDEC Standard Reference | MS-034AAU-1 | — |
| Series | — | Stratix II GX |
| Logic Array Blocks (LABs) | — | 6,627 |
| Encapsulamento | — | 1508-ball FBGA (GF40) |
| Terminal Pitch | — | 1.00 mm |
| Temperature Grade | — | Commercial (0C to 85C) |
| Transceivers | — | Up to 20 multi-gigabit transceivers |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| PLLs | — | 8 |
| On-chip Memory | — | TriMatrix memory (block RAM + distributed RAM) |
| Configuration | — | Enhanced / EPC mode |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |